公开(公告)号：US20090053839A1

公开(公告)日：2009-02-26

申请号：US12259696

申请日：2008-10-28

Applicant: Chang Wook KIM ,  Seon Goo Lee

Inventor： Chang Wook KIM ,  Seon Goo Lee

IPC: H01L33/00

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

Abstract: An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

Abstract translation: LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。 固定部件具有与颈部接合的第一端。 电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。 成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。 固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

公开(公告)号：US20070145387A1

公开(公告)日：2007-06-28

申请号：US11680847

申请日：2007-03-01

Applicant: Seon Goo LEE ,  Bum Joon JIN ,  Kyung Taeg HAN ,  Chang Wook KIM

Inventor： Seon Goo LEE ,  Bum Joon JIN ,  Kyung Taeg HAN ,  Chang Wook KIM

IPC: H01L33/00

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body. In this fashion, the invention can overcome restricted application problems by isolating the electrical connecting parts from the heat conducting part.

Abstract translation: 本发明涉及一种LED外壳及其制造方法。 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。 以这种方式，本发明可以通过将电气连接部件与导热部分隔离来克服限制的应用问题。

公开(公告)号：US20120026063A1

公开(公告)日：2012-02-02

申请号：US13180833

申请日：2011-07-12

Applicant: Sang Hun LEE ,  Sang Bae CHO ,  Dong Chan PARK ,  Chang Wook KIM ,  Ju Young SONG

Inventor： Sang Hun LEE ,  Sang Bae CHO ,  Dong Chan PARK ,  Chang Wook KIM ,  Ju Young SONG

IPC: H01Q1/50

CPC classification number: H03H7/40 ,  H03H11/40 ,  H04B1/0458

Abstract: An apparatus and method for matching impedance of an antenna by using Standing Wave Ratio (SWR) information is provided. While the impedance of the impedance matching unit is controlled, a region of a Smith chart in which initial total impedance of the impedance matching unit and the antenna is located by using an SWR calculated by an SWR operation unit, and the impedance of the impedance matching unit is controlled according to the determined region, thus correctly matching the impedance of the antenna.

Abstract translation: 提供了通过使用驻波比（SWR）信息来匹配天线的阻抗的装置和方法。 在阻抗匹配单元的阻抗被控制的情况下，通过使用由SWR运算单元计算的SWR和阻抗匹配单元和天线的阻抗匹配的阻抗匹配单元和天线的初始总阻抗的史密斯圆图的区域 单位根据确定的区域进行控制，从而正确匹配天线的阻抗。

公开(公告)号：US20090321779A1

公开(公告)日：2009-12-31

申请号：US12550073

申请日：2009-08-28

Applicant: Chang Wook KIM ,  Yoon Suk HAN ,  Young Jea SONG ,  Byung Man KIM ,  Jae Ky ROH ,  Seong Jae HONG

Inventor： Chang Wook KIM ,  Yoon Suk HAN ,  Young Jea SONG ,  Byung Man KIM ,  Jae Ky ROH ,  Seong Jae HONG

IPC: H01L33/00

CPC classification number: H01L33/62 ,  G02B6/0073 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/4554

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

公开(公告)号：US20090283792A1

公开(公告)日：2009-11-19

申请号：US12510520

申请日：2009-07-28

Applicant: Chang Wook KIM ,  Yoon Suk Han ,  Young Jae Song ,  Byung Man Kim ,  Jae Ky Roh ,  Seong Jae Hong

Inventor： Chang Wook KIM ,  Yoon Suk Han ,  Young Jae Song ,  Byung Man Kim ,  Jae Ky Roh ,  Seong Jae Hong

IPC: H01L33/00

CPC classification number: H01L33/62 ,  G02B6/0073 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/4554

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract translation: 一种用于背光单元的侧视图LED封装包括具有一倾斜内侧壁的空腔的封装主体，布置在封装主体中的第一和第二引线框架，该封装体的空腔暴露了第一和第二引线框架中的至少一个的一部分， 第二引线框架放置在腔的底部到外部，安装在腔的底部上以电连接到第一引线框架和第二引线框架的发光二极管芯片，以及布置在围绕发光二极管的空腔中的透明密封剂 芯片。 空腔的深度大于发光二极管芯片的安装高度，不超过安装高度的六倍。 侧壁的高度被缩短以改善发射光的束角特性，增加光量，并防止侧壁的模制缺陷。