Abstract:
A process for forming an MOS semiconductor device having an LDD structure is disclosed, which may include the steps of: forming a first insulating layer on a semiconductor substrate; forming a conductive layer on the first insulating layer; forming a second insulating layer on the conductive layer; forming a third insulating layer on the second insulating layer; forming an etch inhibiting layer pattern for forming an over-sized gate on a relevant area of the second insulating layer; removing the second and third insulating layers and the conductive layer excluding the portions protected from the etch inhibiting layer, so as to form a stacked pattern consisting of the residual second insulating layer/the third insulating layer/the conductive layer; forming a first impurity ion buried layer on a relevant portion of the semiconductor substrate utilizing the stacked pattern for formation of a source/drain region; removing the etch inhibiting layer; removing an edge portion of the remaining second insulating layer of the stacked pattern for forming the final gate; removing the residual third insulating layer of the stacked pattern; etching the residual conductive layer by using the partly removed second insulating layer as the mask to form the final gate; forming a second impurity ion buried layer on the relevant portion of the semiconductor substrate for forming the LDD structure; forming a fourth insulating layer on the whole surface of the wafer; and activating the first and second ion buried layers.
Abstract:
A method and apparatus for controlling the amount of ozone concentration in the layers of a film depositing system and the multi-layered structure produced thereby, whereby the concentration of ozone in each layer gradually changes from a low ozone concentration in the first deposited layer to a high ozone concentration in the last deposited layer.
Abstract:
A method and apparatus for controlling the amount of ozone concentration in the layers of a film depositing system and the multi-layered structure produced thereby, whereby the concentration of ozone in each layer gradually changes from a low ozone concentration in the first deposited layer to a high ozone concentration in the last deposited layer.
Abstract:
An apparatus for jetting ink utilizing a lamb wave and a method for producing the same, the apparatus including an ink chamber having nozzles, and an ejecting force source for supplying an ejecting force to eject the ink out of the nozzles. The ejecting force source includes inter-digital transducer electrodes for applying a voltage of a predetermined voltage, a piezoelectric element for generating the lamb wave by means of the voltage applied from the inter-digital transducer electrodes. Thus, as the voltage is applied to the inter-digital transducer electrodes, the lamb wave is generated from the lamb wave generating board, and the ink reserved in the ink chamber is ejected out of the nozzles.