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公开(公告)号:US08928026B2
公开(公告)日:2015-01-06
申请号:US13565993
申请日:2012-08-03
申请人: Chao-Hsing Chen , Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Wei-Yo Chen
发明人: Chao-Hsing Chen , Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Wei-Yo Chen
CPC分类号: H01L33/38 , H01L33/20 , H01L33/40 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2933/0016 , H01L2924/00014 , H01L2924/00
摘要: An optoelectronic device comprises a semiconductor stack comprising a first semiconductor layer, an active layer and a second semiconductor layer, a first electrode electrically connecting with the first semiconductor layer, a second electrode electrically connecting with the second semiconductor layer, wherein there is a smallest distance D1 between the first electrode and the second electrode, a third electrode formed on a portion of the first electrode and electrically connecting with the first electrode and a fourth electrode formed on a portion of the first electrode and on a portion of the second electrode, and electrically connecting with the second electrode, wherein there is a smallest distance D2 between the third electrode and the fourth electrode, and the smallest distance D2 is smaller than the smallest distance D1.
摘要翻译: 光电子器件包括半导体堆叠,其包括第一半导体层,有源层和第二半导体层,与第一半导体层电连接的第一电极,与第二半导体层电连接的第二电极,其中存在最小距离 D1在第一电极和第二电极之间形成,第三电极形成在第一电极的一部分上并与第一电极电连接,第四电极形成在第一电极的一部分上并在第二电极的一部分上,以及 与第二电极电连接,其中在第三电极和第四电极之间具有最小距离D2,并且最小距离D2小于最小距离D1。
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公开(公告)号:US20130032848A1
公开(公告)日:2013-02-07
申请号:US13565993
申请日:2012-08-03
申请人: Chao-Hsing Chen , Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Wei-Yo Chen
发明人: Chao-Hsing Chen , Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Wei-Yo Chen
IPC分类号: H01L33/48
CPC分类号: H01L33/38 , H01L33/20 , H01L33/40 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2933/0016 , H01L2924/00014 , H01L2924/00
摘要: An optoelectronic device comprises a semiconductor stack comprising a first semiconductor layer, an active layer and a second semiconductor layer, a first electrode electrically connecting with the first semiconductor layer, a second electrode electrically connecting with the second semiconductor layer, wherein there is a smallest distance D1 between the first electrode and the second electrode, a third electrode formed on a portion of the first electrode and electrically connecting with the first electrode and a fourth electrode formed on a portion of the first electrode and on a portion of the second electrode, and electrically connecting with the second electrode, wherein there is a smallest distance D2 between the third electrode and the fourth electrode, and the smallest distance D2 is smaller than the smallest distance D1.
摘要翻译: 光电子器件包括半导体堆叠,其包括第一半导体层,有源层和第二半导体层,与第一半导体层电连接的第一电极,与第二半导体层电连接的第二电极,其中存在最小距离 D1在第一电极和第二电极之间形成,第三电极形成在第一电极的一部分上并与第一电极电连接,第四电极形成在第一电极的一部分上并在第二电极的一部分上,以及 与第二电极电连接,其中在第三电极和第四电极之间具有最小距离D2,并且最小距离D2小于最小距离D1。
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公开(公告)号:US09196605B2
公开(公告)日:2015-11-24
申请号:US13230988
申请日:2011-09-13
申请人: Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
发明人: Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
CPC分类号: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要: An embodiment of the present application discloses a light-emitting structure, comprising a substrate, a first unit and a second unit separately form on the substrate; a trench formed between the first unit and the second unit, and having a bottom portion exposing the substrate, a less steep sidewall and a steeper sidewall steeper than the less steep sidewall; and an electrical connection connecting the first unit and the second unit and covering the first unit, the second unit and the less steep sidewall; wherein the sidewalls directly connect to the bottom portion, and the steeper sidewall is devoid of the electrical connection covering.
摘要翻译: 本申请的一个实施例公开了一种发光结构,其包括基板,第一单元和在基板上分开形成的第二单元; 形成在所述第一单元和所述第二单元之间的沟槽,并且具有暴露所述基板的底部部分,比所述较不陡峭的侧壁更陡峭的侧壁和更陡峭的侧壁; 以及连接第一单元和第二单元并覆盖第一单元,第二单元和较不陡峭侧壁的电连接; 其中所述侧壁直接连接到所述底部部分,并且所述较陡侧壁没有电连接覆盖物。
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公开(公告)号:US20120061694A1
公开(公告)日:2012-03-15
申请号:US13230988
申请日:2011-09-13
申请人: Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
发明人: Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
IPC分类号: H01L33/08
CPC分类号: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要: An embodiment of the present application discloses a light-emitting structure, comprising a first unit; a second unit; a trench formed between the first unit and the second unit, and having a less steep sidewall and a steeper sidewall steeper than the less steep sidewall; and an electrical connection arranged on the less steep sidewall.
摘要翻译: 本申请的实施例公开了一种发光结构,包括第一单元; 第二单位 形成在所述第一单元和所述第二单元之间的沟槽,并且具有比所述较不陡峭的侧壁更陡峭的侧壁和更陡峭的侧壁; 以及布置在不太陡峭的侧壁上的电连接。
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公开(公告)号:US09000457B2
公开(公告)日:2015-04-07
申请号:US13186218
申请日:2011-07-19
申请人: Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
发明人: Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
IPC分类号: H01L29/20 , F21K99/00 , F21Y101/02 , F21Y105/00 , F21Y113/00 , H01L25/075 , H01L33/50
CPC分类号: H01L25/0753 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , H01L33/50 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
摘要: The present application provides a multi-dimensional light-emitting device electrically connected to a power supply system. The multi-dimensional light-emitting device comprises a substrate, a blue light-emitting diode array and one or more phosphor layers. The blue light-emitting diode array, disposed on the substrate, comprises a plurality of blue light-emitting diode chips which are electrically connected. The multi-dimensional light-emitting device comprises a central area and a plurality of peripheral areas, which are arranged around the central area. The phosphor layer covers the central area. When the power supply system provides a high voltage, the central area and the peripheral areas of the multi-dimensional light-emitting device provide a first light and a plurality of second lights, respectively. The first light and the second lights are blended into a mixed light.
摘要翻译: 本申请提供了电连接到电源系统的多维发光装置。 多维发光装置包括基板,蓝色发光二极管阵列和一个或多个荧光体层。 设置在基板上的蓝色发光二极管阵列包括电连接的多个蓝色发光二极管芯片。 多维发光装置包括围绕中心区域布置的中心区域和多个周边区域。 磷光体层覆盖中心区域。 当电源系统提供高电压时,多维发光装置的中心区域和外围区域分别提供第一光和多个第二光。 第一个光和第二个光被混合成混合光。
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公开(公告)号:USD688819S1
公开(公告)日:2013-08-27
申请号:US29398875
申请日:2011-08-05
申请人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
设计人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
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公开(公告)号:USD668232S1
公开(公告)日:2012-10-02
申请号:US29398791
申请日:2011-08-04
申请人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
设计人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
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公开(公告)号:US20090162960A1
公开(公告)日:2009-06-25
申请号:US12379561
申请日:2009-02-25
申请人: Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Hsieh , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
发明人: Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Hsieh , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
CPC分类号: H01L33/0095
摘要: A method for manufacturing a light-emitting device comprising the steps of cutting a light-emitting unit by a laser beam, and cleaning the light-emitting unit by an acid solution to remove by-products resulted from the laser cutting.
摘要翻译: 一种发光装置的制造方法,其特征在于,包括以下步骤:用激光束切割发光单元,用酸溶液清洗发光单元,除去激光切割产生的副产物。
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公开(公告)号:USD644187S1
公开(公告)日:2011-08-30
申请号:US29367474
申请日:2010-08-09
申请人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
设计人: Chien-Fu Shen , Tsun-Kai Ko , Schang-Jing Hon
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公开(公告)号:US08486742B2
公开(公告)日:2013-07-16
申请号:US13191188
申请日:2011-07-26
申请人: Chien-Kai Chung , Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Hsieh , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
发明人: Chien-Kai Chung , Ta-Cheng Hsu , Jung-Min Hwang , Min-Hsun Hsieh , Ya-Lan Yang , De-Shan Kuo , Tsun-Kai Ko , Chien-Fu Shen , Ting-Chia Ko , Schang-Jing Hon
IPC分类号: H01L21/00
CPC分类号: H01L33/005 , H01L21/02057 , H01L21/3043 , H01L33/0095
摘要: A method for manufacturing a light-emitting device comprising the steps of: providing a substrate comprising a first surface and a second surface; forming a plurality of cutting lines on the substrate by a laser beam; cleaning the substrate by a chemical solution; and forming a light-emitting stack on an first surface of the substrate after cleaning the substrate.
摘要翻译: 一种制造发光器件的方法,包括以下步骤:提供包括第一表面和第二表面的基底; 通过激光束在基板上形成多条切割线; 用化学溶液清洗基材; 以及在清洁所述衬底之后在所述衬底的第一表面上形成发光叠层。
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