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    Electrically-conductive layer for imaging element containing composite metal-containing particles
    3.
    发明授权
    Electrically-conductive layer for imaging element containing composite metal-containing particles 失效
    用于含复合金属颗粒的成像元件的导电层

    公开(公告)号：US6114079A

    公开(公告)日：2000-09-05

    申请号：US053563

    申请日：1998-04-01

    申请人： Paul A. Christian ,  Debasis Majumdar ,  Ibrahim M. Shalhoub ,  Dennis J. Eichorst

    发明人： Paul A. Christian ,  Debasis Majumdar ,  Ibrahim M. Shalhoub ,  Dennis J. Eichorst

    IPC分类号： G03C1/85 ,  G03C1/89 ,  G03C1/95 ,  B41J3/407 ,  G03C8/52 ,  G03C11/22

    CPC分类号： G03C1/95 ,  G03C1/85 ,  G03C1/853 ,  G03C1/89

    摘要： The present invention is an imaging element including a support having a frontside and a backside, an imaging layer superposed on the frontside of said support, and a print-retaining, electrically-conductive layer superposed on the backside of the support. The electrically-conductive layer includes a film-forming binder comprising the latex polymeric addition product of from 20 to 65 mol % of styrene, from 30 to 78 mol % of n-butyl methacrylate, and from 2 to 10 mol % of the sodium salt of 2-sulfoethyl methacrylate. and at least about 60 weight percent composite electrically conductive particles. The composite electrically-conductive particles have a layer of electrically-conductive metal-containing crystallites overlying a nonconductive substrate particle. The electrically-conductive layer is formed by dispersing the composite electrically-conductive particles using polymeric milling media having a mean particle size less than 350 .mu.m to form a colloidal dispersion, combining the colloidal dispersion with the film forming binder to form a mixture, coating the mixture onto the support and drying the mixture to form the electrically-conductive layer.

    摘要翻译： 本发明是一种成像元件，其包括具有前侧和后侧的支撑体，叠置在所述支撑体的前侧上的成像层和叠置在支撑体的背面上的印刷保持导电层。 导电层包括成膜粘合剂，其包含20至65mol％的苯乙烯，30至78mol％的甲基丙烯酸正丁酯和2至10mol％的钠盐的胶乳聚合加成产物 的甲基丙烯酸2-磺乙酯。 和至少约60重量％的复合导电颗粒。 复合导电颗粒具有覆盖在非导电性基材颗粒上的导电性含金属微晶层。 通过使用平均粒度小于350μm的聚合物研磨介质分散复合导电颗粒来形成导电层，以形成胶体分散体，将胶体分散体与成膜粘合剂组合以形成混合物，涂层 将混合物加载到载体上并干燥混合物以形成导电层。