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公开(公告)号：US07084044B2
公开(公告)日：2006-08-01
申请号：US10862599
申请日：2004-06-07
申请人： Charles W. Lentz , Bettina A. Nechay , Abdallah Ougazzaden , Padman Parayanthal , George J. Przybylek
发明人： Charles W. Lentz , Bettina A. Nechay , Abdallah Ougazzaden , Padman Parayanthal , George J. Przybylek
IPC分类号： H01L21/76
CPC分类号： H01L31/184 , H01L31/1035 , H01L31/105 , H01S5/2081 , H01S5/2275 , Y02E10/544 , Y02P70/521
摘要： The present invention provides an optoelectronic device and a method of manufacture thereof. In one embodiment, the method of manufacturing the optoelectronic device may include creating a multilayered optical substrate and then forming a self aligned dual mask over the multilayered optical substrate. The method may further include etching the multilayered optical substrate through the self aligned dual mask to form a mesa structure.
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公开(公告)号：US06828592B2
公开(公告)日：2004-12-07
申请号：US10120923
申请日：2002-04-11
申请人： Charles W. Lentz , Bettina A. Nechay , Abdallah Ougazzaden , Padman Parayanthal , George J. Przybylek
发明人： Charles W. Lentz , Bettina A. Nechay , Abdallah Ougazzaden , Padman Parayanthal , George J. Przybylek
IPC分类号： H01L29225
CPC分类号： H01L31/184 , H01L31/1035 , H01L31/105 , H01S5/2081 , H01S5/2275 , Y02E10/544 , Y02P70/521
摘要： The present invention provides an optoelectronic device and a method of manufacture thereof. In one embodiment, the method of manufacturing the optoelectronic device may include creating a multilayered optical substrate and then forming a self aligned dual mask over the multilayered optical substrate. The method may further include etching the multilayered optical substrate through the self aligned dual mask to form a mesa structure.
摘要翻译： 本发明提供一种光电器件及其制造方法。 在一个实施例中，制造光电子器件的方法可以包括产生多层光学衬底，然后在多层光学衬底上形成自对准的双掩模。 该方法还可以包括通过自对准双掩模蚀刻多层光学衬底以形成台面结构。
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公开(公告)号：US06512291B2
公开(公告)日：2003-01-28
申请号：US09790811
申请日：2001-02-23
IPC分类号： H01L2310
CPC分类号： H01L35/34 , H01L23/38 , H01L23/4985 , H01L35/08 , H01L2224/16 , H01L2924/01046 , H01L2924/01079 , H01L2924/12044 , Y10S257/93
摘要： A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negatively-doped elements electrically coupled together, are positioned between a pair of flex panels. Each panel has connector sites at which connectors such as solder balls are located. The thermoelectric cooling devices may be arranged between the panels to create two or more device support areas having different temperature regimes. The thermoelectric cooling devices may be connected to the panels by placing the panels, connectors and thermoelectric cooling devices in a reflow chamber, exposing them to a reducing atmosphere, and heating to a temperature sufficient to reflow the connectors.
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4.发明授权Method and apparatus for retaining and releasing laser bars during a facet coating operation 失效在小面涂布操作期间保持和释放激光棒的方法和装置
公开(公告)号：US5989932A
公开(公告)日：1999-11-23
申请号：US123520
申请日：1998-07-28
CPC分类号： H01S5/028 , H01S5/0201
摘要： An apparatus and process for retaining laser bars during a facet coating operation and releasing the bars after the conclusion of the facet coating operation. A multitude of spacers are positioned with laser bars therebetween. Each spacer includes an upper and lower fixture blade. The spacers are compressed together, thus sandwiching the laser bars, during the facet coating operation. After release of the compressive force, adhered laser bars are removed by moving one of the fixture blades relative to the other fixture blade. Movement can be along the longitudinal axis of the blades, perpendicular to the longitudinal axis, or rotation about a pivot axis. Further, movement can include elevation of one blade, or an end of one blade, relative to the other blade.
摘要翻译： 在小面涂布操作期间保持激光棒并在小面涂布操作结束之后释放棒的装置和方法。 多个间隔件之间设有激光条。 每个间隔件包括上和下固定刀片。 间隔件在面涂层操作期间被压缩在一起，从而夹住激光棒。 在释放压缩力之后，通过相对于另一固定刀片移动固定刀片中的一个来去除附着的激光棒。 运动可以沿着叶片的纵向轴线，垂直于纵向轴线，或绕枢转轴线旋转。 此外，移动可以包括相对于另一个叶片的一个叶片或一个叶片的端部的升高。
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公开(公告)号：US3947713A
公开(公告)日：1976-03-30
申请号：US569223
申请日：1975-04-18
申请人： George J. Przybylek
发明人： George J. Przybylek
摘要： The apparatus of the invention comprises a cup-shaped metal ring carrying a mercury amalgam from which mercury can be released, the ring being held within a supporting mass of fibrous insulating material and the entire assembly loosely mounted in the tubulation secured to the base plate of a display panel.
摘要翻译： 本发明的装置包括一个带有水银汞齐的杯形金属环，水银汞从汞罐中释放出来，该环被保持在一个纤维绝缘材料的支撑体内，整个组件松动地安装在固定在基板上的管中 显示面板。
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6.发明授权Display panel with expansible, metallic capsule containing mercury and method of making said capsule 失效具有可膨胀的，含有汞的金属胶囊的显示面板以及制造所述胶囊的方法
公开(公告)号：US3944869A
公开(公告)日：1976-03-16
申请号：US540050
申请日：1975-01-10
申请人： George J. Przybylek
发明人： George J. Przybylek
CPC分类号： B23P15/00 , H01J17/22 , Y10T29/49808
摘要： A mercury capsule comprises a mercury-filled metal tube, of measured capacity, having closed ends, each of which includes end portions which are cold welded and resistance welded to form an hermetic seal and intermediate portions, which are crimped closed. The length of the intermediate crimped portions of each capsule is designed to permit the mercury within the capsule to expand and stress the lightly crimped portions, during processing operations of a device in which a capsule is mounted, without opening the hermetically sealed end portions of each capsule.The method of the invention comprises filling a metal tube with mercury, closing the open end, and forming light crimps in the tube at spaced locations to form individual capsules, each of which is filled with a measured quantity of mercury. The crimped portions of the tube are processed to form lightly sealed portions on each side of the chamber which contains the mercury and tightly closed portions adjacent to the lightly closed portions at the ends of the capsules. The two closed portions have different resistance to opening under mercury vapor pressure at elevated temperatures, with the lightly closed portion being able to open at a temperature at which the tightly closed portion will not open.
摘要翻译： 水银胶囊包括具有测量容量的水银填充金属管，其封闭端部包括端部，其被冷焊和电阻焊接以形成气密密封件和压接封闭的中间部分。 每个胶囊的中间卷曲部分的长度被设计成允许胶囊内的汞在其中安装胶囊的装置的加工操作期间膨胀和应力轻压缩部分，而不打开每个胶囊的气密密封的端部 胶囊。
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公开(公告)号：US06204092B1
公开(公告)日：2001-03-20
申请号：US09290421
申请日：1999-04-13
IPC分类号： H01L2144
CPC分类号： H01L21/67132 , H01L2221/68354 , Y10S438/976
摘要： An apparatus and method for transferring a semiconductor die from an adhesive film to an output carrier is disclosed. The adhesive film and associated hoop assembly on which the die are secured are inverted so that die face downward, p-side down, from the film. And an output pack is positioned beneath the die. An ejector pin exerts a force on a side of the adhesive film opposite the side on which the semiconductor die is secured to release the die. A vacuum is provided through a port in the output pack, pulling the released die into the output pack. The transfer occurs in a single step and orients the die p-side down in the output pack, thus eliminating the control arm/vacuum collet assembly and associated handling steps of conventional transfer mechanisms.
摘要翻译： 公开了一种用于将半导体管芯从粘合剂膜转移到输出载体的装置和方法。 模具固定在其上的粘合膜和相关联的箍组件被倒置，使得模具从膜向下，p侧向下。 并且输出组件位于模具下方。 顶针在与固定半导体管芯的一侧相对的粘合膜的一侧上施加力以释放模具。 通过输出包装中的端口提供真空，将释放的模具拉入输出包装。 转移发生在单个步骤中，并将模具p侧定向在输出包装中，从而消除了传统转移机构的控制臂/真空夹头组件和相关的处理步骤。
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公开(公告)号：US6142044A
公开(公告)日：2000-11-07
申请号：US389239
申请日：1999-09-03
CPC分类号： B26D3/166 , Y10T82/10 , Y10T82/16 , Y10T82/16016 , Y10T82/16442
摘要： A system is provided for trimming excess vinyl film from a hoop assembly. The hoop assembly may be used to manufacture semiconductor workpieces. The system uses a pressure applying member applied to the excess film with a bearing surface sufficient to receive such pressure on the opposite side of the excess film. The system may be rotated such that the film is trimmed around the entire hoop assembly at the position of the pressure applying member. The bearing surface may be part of the support for the system or incorporated into the hoops.
摘要翻译： 提供一种用于从箍组件修整过量的乙烯基膜的系统。 箍组件可用于制造半导体工件。 该系统使用施加到多余膜上的压力施加构件，该压力施加构件具有足以在多余膜的相对侧上承受这种压力的支承表面。 系统可以旋转，使得膜在压力施加构件的位置处围绕整个箍组件修剪。 轴承表面可以是系统的支撑件的一部分或结合到箍中。
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公开(公告)号：US4230967A
公开(公告)日：1980-10-28
申请号：US928959
申请日：1978-07-28
CPC分类号： G06F3/041
摘要： The disclosure is of a cathode ray tube having a face plate for displaying information and carrying an electrode assembly which is curved to adhere smoothly to the face plate. The electrode assembly includes a shield against radio frequency interference and an insulating support sheet having an inner surface and an outer surface, on each of which an array of rows and columns of conductive areas is formed. On the inner surface, the rows of conductive areas are electrically connected together to output contact pads at a side edge of the sheet, and, on the outer surface, the columns of conductive areas are electrically connected together to output contact pads along the lower edge of the sheet. Each outer conductive area overlies and is capacitively coupled to an inner conductive area. A column conductor which extends from a contact pad at an edge of the outer surface of the sheet is capacitively coupled to each column of outer conductive areas. The conductive areas on the outer surface are intimately capacitively coupled to the column conductors so that optimum signal coupling is achieved.
摘要翻译： 本发明是一种阴极射线管，其具有用于显示信息的面板，并且携带弯曲的电极组件以平滑地粘附到面板。 所述电极组件包括抵抗射频干扰的屏蔽件和具有内表面和外表面的绝缘支撑片材，每个所述绝缘支撑片材形成有导电区域的行和列阵列。 在内表面上，导电区域的行被电连接在一起以在片材的侧边缘处输出接触焊盘，并且在外表面上，导电区域的列电连接在一起以沿着下边缘输出接触焊盘 的表格。 每个外部导电区域覆盖并电容耦合到内部导电区域。 在片材的外表面的边缘处从接触垫延伸的柱导体电容耦合到每个导电区域列。 外表面上的导电区域紧密地电容耦合到列导体，从而实现最佳的信号耦合。
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10.发明授权Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom 有权用于互连半导体元件以形成热电冷却器和由其形成的热电冷却器的方法公开(公告)号：US06555413B1
公开(公告)日：2003-04-29
申请号：US09790810
申请日：2001-02-23
IPC分类号： H01L2144
摘要： A method for electrically coupling thermoelectric cooling (TEC) elements together is described. The TEC elements are encased within an encapsulating material, such as epoxy, and a resist layer is laid on either end of the encapsulating material, covering the ends of the TEC elements. The resist layers are selectively developed to open locations in the resist layers in between adjacent elements. Conductive material, such as gold, is sputter deposited into the locations to provide electrical coupling of the elements.
摘要翻译： 描述了将热电冷却（TEC）元件电耦合在一起的方法。 TEC元件封装在诸如环氧树脂的封装材料中，并且将抗蚀剂层铺设在封装材料的任一端上，覆盖TEC元件的端部。 选择性地显影抗蚀剂层以在相邻元件之间的抗蚀剂层中打开位置。 诸如金的导电材料被溅射沉积到这些位置以提供元件的电耦合。
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