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公开(公告)号：US06512291B2
公开(公告)日：2003-01-28
申请号：US09790811
申请日：2001-02-23
IPC分类号： H01L2310
CPC分类号： H01L35/34 , H01L23/38 , H01L23/4985 , H01L35/08 , H01L2224/16 , H01L2924/01046 , H01L2924/01079 , H01L2924/12044 , Y10S257/93
摘要： A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negatively-doped elements electrically coupled together, are positioned between a pair of flex panels. Each panel has connector sites at which connectors such as solder balls are located. The thermoelectric cooling devices may be arranged between the panels to create two or more device support areas having different temperature regimes. The thermoelectric cooling devices may be connected to the panels by placing the panels, connectors and thermoelectric cooling devices in a reflow chamber, exposing them to a reducing atmosphere, and heating to a temperature sufficient to reflow the connectors.
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公开(公告)号：US06514791B2
公开(公告)日：2003-02-04
申请号：US09790526
申请日：2001-02-23
IPC分类号： H01L2144
CPC分类号： H01L35/34
摘要： A system and method for fabricating a thermoelectric cooling (TEC) device and a semiconductor device using such a TEC device are described. Adhesive-containing support structures are used to secure, respectively, positively-doped and negatively-doped TEC elements. The elements are intermeshed and an encapsulating material is applied to the intermeshed array. The support structures are then released and the ends of the encapsulated elements are smoothed and electrically coupled together. If desired, panels are secured to the ends of the elements and a heat sink may also be provided. The TEC device may be used to control and/or tune a laser device.
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3.发明授权Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom 有权用于互连半导体元件以形成热电冷却器和由其形成的热电冷却器的方法公开(公告)号：US06555413B1
公开(公告)日：2003-04-29
申请号：US09790810
申请日：2001-02-23
IPC分类号： H01L2144
摘要： A method for electrically coupling thermoelectric cooling (TEC) elements together is described. The TEC elements are encased within an encapsulating material, such as epoxy, and a resist layer is laid on either end of the encapsulating material, covering the ends of the TEC elements. The resist layers are selectively developed to open locations in the resist layers in between adjacent elements. Conductive material, such as gold, is sputter deposited into the locations to provide electrical coupling of the elements.
摘要翻译： 描述了将热电冷却（TEC）元件电耦合在一起的方法。 TEC元件封装在诸如环氧树脂的封装材料中，并且将抗蚀剂层铺设在封装材料的任一端上，覆盖TEC元件的端部。 选择性地显影抗蚀剂层以在相邻元件之间的抗蚀剂层中打开位置。 诸如金的导电材料被溅射沉积到这些位置以提供元件的电耦合。
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公开(公告)号：US06549550B2
公开(公告)日：2003-04-15
申请号：US09781995
申请日：2001-02-14
IPC分类号： H01S304
CPC分类号： H01S5/02208 , G02B6/4204 , G02B6/4266 , G02B6/4271 , G02B6/4273 , G02B6/4274 , H01L35/00 , H01S5/02276 , H01S5/02284 , H01S5/02415 , H01S5/042
摘要： Flexible ground connectors are adapted to withstand temperature-induced stresses. The connectors may be formed of low thermal conductivity materials. The connectors may be used within a semiconductor package that also encloses a thermoelectric cooling device, a conductive submount, and a semiconductor light source. The submount may be grounded to the package wall by locating a pair of the flexible ground connectors across a gap to a ledge in the wall. The ground connectors may be formed of stainless steel, and they may be gold plated for improved electrical conductivity.
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公开(公告)号：US07149399B2
公开(公告)日：2006-12-12
申请号：US10488569
申请日：2002-09-09
CPC分类号： C03C8/245 , C03C25/1061 , C03C27/06 , G02B6/08 , G02B6/362 , G02B6/3636 , G02B6/3652 , G02B6/3855 , G02B6/4238
摘要： In accordance with the present invention a fiber optic array is provided. The array includes a substrate having a fiber support surface. The array further includes an optical fiber having a fiber portion that includes an un-jacketed, un-buffered optical core segment. The un-jacketed, un-buffered optical core segment is placed in contact with the fiber support surface to orient the optical core segment at a selected position relative to the support surface. In addition, the array includes a solder glass chemically bonded to the optical core segment and the fiber support surface so that the optical core segment is secured at a predetermined location relative to the support surface of the substrate. A method for fabricating such a fiber optic array is also provided.
摘要翻译： 根据本发明，提供一种光纤阵列。 阵列包括具有纤维支撑表面的基底。 该阵列还包括具有光纤部分的光纤，该光纤部分包括未夹套的未缓冲光核心段。 未夹套的未缓冲光纤芯段被放置成与纤维支撑表面接触，以将光纤芯段定位在相对于支撑表面的选定位置。 此外，该阵列包括化学键合到光学芯段和光纤支撑表面的焊料玻璃，使得光学芯段相对于衬底的支撑表面固定在预定位置。 还提供了一种制造这种光纤阵列的方法。
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公开(公告)号：US06902098B2
公开(公告)日：2005-06-07
申请号：US10126491
申请日：2002-04-19
IPC分类号： B23K35/00 , B23K35/28 , B23K35/30 , H01L21/60 , H01L23/485 , H05K3/34 , B23K31/00 , H01L21/44
CPC分类号： H01L24/13 , B23K35/007 , B23K35/28 , B23K35/30 , B23K35/3013 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H05K3/3463 , H01L2924/00
摘要： A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.
摘要翻译： 提供了一种包括第一焊盘和在衬底上由焊后合金组合物组成的第二焊盘的装置。 该合金组合物包含两种或更多种元素，并且第一焊盘的后焊合金组合物与第二焊垫的合金组成不同的两种或更多种元素的量。 制造焊料焊盘的方法包括：掩蔽包含至少第一焊料焊盘和第二焊料焊盘的衬底，其中所述掩模暴露所述第一焊盘的较大面积，使得所沉积的元件成为所述第一焊盘 在焊接时焊锡垫，从而改变第一焊盘的熔点。
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7.发明授权Method for cleaving integrated optic waveguides to provide a smooth waveguide endface 失效用于切割集成光波导以提供光滑波导端面的方法公开(公告)号：US06788853B2
公开(公告)日：2004-09-07
申请号：US09878486
申请日：2001-06-11
IPC分类号： G02B630
摘要： In an integrated optical waveguide device including a first top portion on the substrate, and a plurality of juxtaposed waveguide cores within cladding layers on a second top portion of the substrate, the waveguide cores having respective inner endfaces parallel to a longitudinal open slotway formed in the substrate between the first and second top portions, the substrate being undercut from the slotway to produce a cantilevered section of the waveguide cores and cladding layers, for permitting the plurality of waveguide cores and associated cladding layers to be simultaneously cleaved, thereby providing a smooth endface thereacross.
摘要翻译： 在包括基板上的第一顶部和在基板的第二顶部上的包覆层内的多个并置的波导芯的集成光波导装置中，波导芯具有平行于形成在该基板中的纵向开放槽道的相应的内端面 衬底在第一和第二顶部之间，衬底从槽道底切以产生波导芯和包层的悬臂部分，以允许多个波导芯和相关的包层同时被切割，从而提供平滑的端面 在那里
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公开(公告)号：US06277206B1
公开(公告)日：2001-08-21
申请号：US09366347
申请日：1999-08-02
IPC分类号： B08B700
CPC分类号： H01L21/67138 , B23K1/018 , B23K2101/40
摘要： A method for unblocking a vacuum collet channel clogged with solder includes moving a solder-clogged collet into contact with a preform of solder, and melting the solder clog and the preform into a single melted mass, cooling the melted mass to solidify it, and moving the collet away from the cooled mass, leaving the clog behind.
摘要翻译： 用于阻止由焊料堵塞的真空夹头通道的方法包括将焊料堵塞的夹头移动与焊料预成型件接触，并将焊料堵塞和预成型件熔化成单个熔化的质量，冷却熔化的质量以使其固化并移动 夹头远离冷却的质量，留下堵塞。
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公开(公告)号：US4946236A
公开(公告)日：1990-08-07
申请号：US358912
申请日：1989-05-30
申请人： Mindaugas F. Dautartas , Yinon Degani , Richard T. Kraetsch , Richard J. Pimpinella , King L. Tai
发明人： Mindaugas F. Dautartas , Yinon Degani , Richard T. Kraetsch , Richard J. Pimpinella , King L. Tai
CPC分类号： G02B6/3508 , G02B6/3558 , G02B6/3562 , G02B6/3572
摘要： An m-input/n-output (e.g., 2.times.2) optical fiber switch is disclosed which alters the location of the fibers by the application of an external force. Illustratively, the switch uses a housing with a diamond-shaped opening extending therethrough, with pairs of optical fibers positioned in orthogonally located V-grooves. Upon the application of an external force, the fibers are moved into the remaining, vacant V-grooves formed by the diamond-shaped opening. In a preferred embodiment, a (2.times.2) switch is magnetically activated.
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公开(公告)号：US07290321B2
公开(公告)日：2007-11-06
申请号：US11500061
申请日：2006-08-07
IPC分类号： B23Q3/00
CPC分类号： G02B6/4231 , G02B6/4204 , G02B6/423 , Y10T29/49133 , Y10T29/49895
摘要： An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus includes a first depression which cooperates with an alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the first substrate and a second depression which cooperates with a second alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the second substrate. The first and second depression of the alignment apparatus and the alignment spheres cooperate to passively align micro-components disposed on each of the substrates.
摘要翻译： 一种用于在基板不包括彼此面对的图案化表面的情况下被动地对准具有设置在其上的微元件的第一和第二基板的装置。 该设备包括与对准球配合以与设置在第一基板的前表面上的对应的凹部机械接合的第一凹陷部以及与第二对准球体配合的第二凹陷部， 第二基板。 对准装置和对准球的第一和第二凹陷配合以被动地对准布置在每个基底上的微组件。
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