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公开(公告)号：US20100006884A1
公开(公告)日：2010-01-14
申请号：US12585420
申请日：2009-09-15
申请人： Chen Ou , Chen-Ke Hsu , Chia-Ming Chuang
发明人： Chen Ou , Chen-Ke Hsu , Chia-Ming Chuang
IPC分类号： H01L33/00
CPC分类号： H01L33/40 , H01L33/0095 , H01L33/22 , H01L2924/0002 , H01L2924/00
摘要： The application relates to a structure of a light emitting device and the manufacturing method thereof. The application discloses a method of forming a bonding pad of the light emitting device by chemical deposition method. The light emitting device includes a substrate, a semiconductor stack deposited on the substrate wherein the semiconductor stack includes at least a p-type semiconductor layer, an n-type semiconductor layer, and an active layer disposed between the p-type semiconductor layer and the n-type semiconductor layer. A bonding pad is formed on at least one of the p-type semiconductor layer and the n-type semiconductor layer wherein the bonding pad includes a seed layer formed by physical deposition method, and a chemically-deposited layer formed by chemical deposition method. The thickness of the seed layer is smaller than that of the chemically-deposited layer.
摘要翻译： 本发明涉及一种发光器件的结构及其制造方法。 本申请公开了一种通过化学沉积法形成发光器件的焊盘的方法。 发光器件包括衬底，沉积在衬底上的半导体堆叠，其中半导体堆叠至少包括p型半导体层，n型半导体层和设置在p型半导体层和p型半导体层之间的有源层 n型半导体层。 在p型半导体层和n型半导体层中的至少一个上形成接合焊盘，其中焊盘包括通过物理沉积方法形成的晶种层，以及通过化学沉积方法形成的化学沉积层。 种子层的厚度小于化学沉积层的厚度。
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公开(公告)号：US20100200885A1
公开(公告)日：2010-08-12
申请号：US12703964
申请日：2010-02-11
申请人： Chen Ke HSU , Win Jim Su , Chia-Ming Chuang , Chen Ou
发明人： Chen Ke HSU , Win Jim Su , Chia-Ming Chuang , Chen Ou
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L33/0095 , H01L33/20
摘要： A light emitting device and a method of fabricating thereof are provided. The method of fabricating the light emitting device comprises: providing a substrate having a first major surface and a second major surface; forming a plurality of light-emitting stacks on the first major surface; forming an etching protection layer on each of the light emitting stacks; forming a plurality of holes by a discontinuous laser beam on the substrate; etching the plurality of holes; and slicing off the substrate along the plurality of holes to form a light emitting device. The light emitting device has a substrate wherein the sidewall of the substrate comprising a first area with a substantially flat surface and a second area with substantially textured surface.
摘要翻译： 提供一种发光器件及其制造方法。 制造发光器件的方法包括：提供具有第一主表面和第二主表面的衬底; 在所述第一主表面上形成多个发光堆叠; 在每个发光堆上形成蚀刻保护层; 通过基板上的不连续激光束形成多个孔; 蚀刻多个孔; 并且沿着所述多个孔切割所述基板以形成发光器件。 发光器件具有衬底，其中衬底的侧壁包括具有基本平坦表面的第一区域和具有基本纹理表面的第二区域。
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公开(公告)号：US08492780B2
公开(公告)日：2013-07-23
申请号：US12703964
申请日：2010-02-11
申请人： Chen Ke Hsu , Win Jim Su , Chia-Ming Chuang , Chen Ou
发明人： Chen Ke Hsu , Win Jim Su , Chia-Ming Chuang , Chen Ou
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L33/0095 , H01L33/20
摘要： A light emitting device and a method of fabricating thereof are provided. The method of fabricating the light emitting device comprises: providing a substrate having a first major surface and a second major surface; forming a plurality of light-emitting stacks on the first major surface; forming an etching protection layer on each of the light emitting stacks; forming a plurality of holes by a discontinuous laser beam on the substrate; etching the plurality of holes; and slicing off the substrate along the plurality of holes to form a light emitting device. The light emitting device has a substrate wherein the sidewall of the substrate comprising a first area with a substantially flat surface and a second area with substantially textured surface.
摘要翻译： 提供一种发光器件及其制造方法。 制造发光器件的方法包括：提供具有第一主表面和第二主表面的衬底; 在所述第一主表面上形成多个发光堆叠; 在每个发光堆上形成蚀刻保护层; 通过基板上的不连续激光束形成多个孔; 蚀刻多个孔; 并且沿着所述多个孔切割所述基板以形成发光器件。 发光器件具有衬底，其中衬底的侧壁包括具有基本平坦表面的第一区域和具有基本纹理表面的第二区域。
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公开(公告)号：US20120138991A1
公开(公告)日：2012-06-07
申请号：US13310255
申请日：2011-12-02
IPC分类号： H01L33/60
CPC分类号： H01L33/145 , H01L33/10 , H01L33/22
摘要： This invention provides a high-efficiency light-emitting device and the manufacturing method thereof The high-efficiency light-emitting device includes a substrate; a reflective layer; a bonding layer; a first semiconductor layer; an active layer; and a second semiconductor layer formed on the active layer. The second semiconductor layer includes a first surface having a first lower region and a first higher region.
摘要翻译： 本发明提供一种高效率的发光装置及其制造方法。高效率发光装置包括：基板; 反射层; 接合层; 第一半导体层; 活性层 以及形成在所述有源层上的第二半导体层。 第二半导体层包括具有第一下部区域和第一较高区域的第一表面。
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公开(公告)号：US08097897B2
公开(公告)日：2012-01-17
申请号：US12073284
申请日：2008-03-04
CPC分类号： H01L33/145 , H01L33/10 , H01L33/22
摘要： This invention provides a high-efficiency light-emitting device and the manufacturing method thereof. The high-efficiency light-emitting device includes a substrate; a reflective layer; a bonding layer; a first semiconductor layer; an active layer; and a second semiconductor layer formed on the active layer. The second semiconductor layer includes a first surface having a first lower region and a first higher region.
摘要翻译： 本发明提供一种高效率的发光装置及其制造方法。 高效率的发光装置包括：基板; 反射层; 接合层; 第一半导体层; 活性层 以及形成在所述有源层上的第二半导体层。 第二半导体层包括具有第一下部区域和第一较高区域的第一表面。
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公开(公告)号：US20080157115A1
公开(公告)日：2008-07-03
申请号：US12073284
申请日：2008-03-04
IPC分类号： H01L33/00
CPC分类号： H01L33/145 , H01L33/10 , H01L33/22
摘要： This invention provides a high-efficiency light-emitting device and the manufacturing method thereof. The high-efficiency light-emitting device includes a substrate; a reflective layer; a bonding layer; a first semiconductor layer; an active layer; and a second semiconductor layer formed on the active layer. The second semiconductor layer includes a first surface having a first lower region and a first higher region.
摘要翻译： 本发明提供一种高效率的发光装置及其制造方法。 高效率的发光装置包括：基板; 反射层; 接合层; 第一半导体层; 活性层 以及形成在所述有源层上的第二半导体层。 第二半导体层包括具有第一下部区域和第一较高区域的第一表面。
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公开(公告)号：US09461202B2
公开(公告)日：2016-10-04
申请号：US13310255
申请日：2011-12-02
CPC分类号： H01L33/145 , H01L33/10 , H01L33/22
摘要： This invention provides a high-efficiency light-emitting device and the manufacturing method thereof The high-efficiency light-emitting device includes a substrate; a reflective layer; a bonding layer; a first semiconductor layer; an active layer; and a second semiconductor layer formed on the active layer. The second semiconductor layer includes a first surface having a first lower region and a first higher region.
摘要翻译： 本发明提供一种高效率的发光装置及其制造方法。高效率发光装置包括：基板; 反射层; 接合层; 第一半导体层; 活性层 以及形成在所述有源层上的第二半导体层。 第二半导体层包括具有第一下部区域和第一较高区域的第一表面。
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公开(公告)号：US20130136958A1
公开(公告)日：2013-05-30
申请号：US13371426
申请日：2012-02-11
CPC分类号： H01M2/105 , H01M2/1094 , H01M2/20 , H01M2/204 , H01M10/486 , H01M10/613 , H01M10/623 , H01M10/643 , H01M10/653 , H01M10/654 , H01M10/659 , H01M2200/103
摘要： The invention relates to a battery assembly with high thermal conductivity. The battery assembly comprises a metal case having a hollow accommodation cavity formed therein, a plurality of battery cores installed parallel to one another within the metal case, and a common electrode for connection to the other electrode in each of the battery cores. Each of the battery cores has two electrodes, with one of the electrodes that corresponds to those of the rest of the battery cores being connected in a thermally conductive manner to the metal case. The invention takes advantage of high thermal conductivity of metallic material and dissipates heat by connecting the metal case to the battery electrodes. The invention further comprises fixation troughs formed on the metal case, thereby reducing the size of the assembly.
摘要翻译： 本发明涉及具有高导热性的电池组件。 电池组件包括金属外壳，其中形成有中空的容纳腔，在金属外壳内彼此平行安装的多个电池芯，以及用于连接到每个电池芯中的另一个电极的公共电极。 每个电池芯具有两个电极，其中一个电极对应于其余电池芯的电极以导热方式连接到金属外壳。 本发明利用金属材料的高导热性，并且通过将金属壳体连接到电池电极来散热。 本发明还包括形成在金属外壳上的固定槽，从而减小了组件的尺寸。
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公开(公告)号：US08278573B2
公开(公告)日：2012-10-02
申请号：US12972516
申请日：2010-12-19
申请人： Chia-Ming Chuang
发明人： Chia-Ming Chuang
IPC分类号： H01R33/96
CPC分类号： H01R13/6275 , H01R13/6335
摘要： A high power system provided with a circuit breaker is disclosed, in which the circuit breaker controls the electrical connection in the system. The circuit breaker has a switch device and a connecting device. Two conductive terminals provided in the connecting device are spaced apart from each other and connected to a power source. The connecting device is equipped with a safety latch for transmitting a signal demanding the establishment of electrical connection to an interrupting control circuit. A conductive element provided in the switch device is electrically connected to the conductive terminals of the connecting device, and then a latch releasing element provided in the switch device drives the safety latch to activate the interrupting control circuit, so as to permit power transmission in the high power system.
摘要翻译： 公开了一种设置有断路器的大功率系统，其中断路器控制系统中的电连接。 断路器具有开关装置和连接装置。 设置在连接装置中的两个导电端子彼此间隔开并连接到电源。 连接装置配备有用于传送要求建立与中断控制电路的电连接的信号的安全锁存器。 设置在开关装置中的导电元件电连接到连接装置的导电端子，然后设置在开关装置中的闩锁释放元件驱动安全闩锁以激活中断控制电路，以便允许在 大功率系统
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公开(公告)号：US20110148201A1
公开(公告)日：2011-06-23
申请号：US12972518
申请日：2010-12-20
申请人： Chia-Ming Chuang
发明人： Chia-Ming Chuang
CPC分类号： H01H85/0017 , H01H3/60 , H01H85/0241 , H01H2085/025 , H01M2/206 , H01M2200/103 , Y10T307/50
摘要： A fuse element having a damping structure is disclosed. The fuse element includes a fuse body having two ends, a housing for encapsulating the fuse body and two extending anchor sections connected to the two ends. A meltable portion is coupled between the two ends and housed by the housing, so that the metable portion, when melted, will not contaminate the surrounding space. At least one of the anchor sections has at least one flexible conductive portion. If the fuse element is mounted in a circuit and subjected to shock and vibration, the flexible conductive portion will absorb the mechanical stresses placed on the terminals and the fuse body. As a result, the safety and reliability of the fuse element and the apparatus to which it is connected is significantly enhanced.
摘要翻译： 公开了一种具有阻尼结构的熔丝元件。 保险丝元件包括具有两端的保险丝本体，用于封装保险丝本体的壳体和连接到两端的两个延伸锚固部分。 可熔部分联接在两端之间并由壳体容纳，使得可熔部分在熔化时不会污染周围空间。 锚定部分中的至少一个具有至少一个柔性导电部分。 如果保险丝元件安装在电路中并受到冲击和振动，则柔性导电部分将吸收放置在端子和熔断体上的机械应力。 结果，保险丝元件及其连接的装置的安全性和可靠性显着提高。
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