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    MEMORY CARD AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    MEMORY CARD AND METHOD OF FABRICATING THE SAME 失效
    记忆卡及其制作方法

    公开(公告)号：US20060071313A1

    公开(公告)日：2006-04-06

    申请号：US10904974

    申请日：2004-12-08

    申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    IPC分类号： H01L23/02

    CPC分类号： H01L23/5388 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/117 ,  H05K3/284 ,  H05K5/0256 ,  H05K5/064 ,  H05K2203/1316 ,  H01L2224/0401

    摘要： A memory card. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electively connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electively connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.

    摘要翻译： 一张记忆卡 存储卡包括基板，多个电子封装装置，模塑料和塑料成形材料。 衬底具有至少多个外部触点和多个内部触点，并且外部触点选择性地连接到内部触点。 电子封装器件位于衬底上，并且电子封装器件分别选择性地连接到内部触点。 模塑料覆盖电子封装装置和相应的内部触点。 塑料成型材料覆盖模塑料和基材，塑料成型材料暴露外触点。

    Memory card structure and manufacturing method thereof
    2.
    发明授权
    Memory card structure and manufacturing method thereof 失效
    存储卡结构及其制造方法

    公开(公告)号：US07205644B2

    公开(公告)日：2007-04-17

    申请号：US10904975

    申请日：2004-12-08

    申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    IPC分类号： H01L23/02 ,  H01L23/28

    CPC分类号： B82Y10/00 ,  G11C5/02 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

    摘要翻译： 提供一种包括基板，多个存储芯片，一些封装材料和超薄塑料外壳的存储卡结构。 为了制造存储卡，提供具有第一表面和第二表面的基板。 第一表面具有多个外部触点，并且第二表面具有至少一个空腔。 在空腔周围有多个内部接触。 此外，外触点和内触头彼此电连接。 存储器芯片堆叠在腔内并电连接到衬底的内部触点。 然后，使用模塑料封装存储芯片和内触点。 此后，将超薄塑料外壳放置在第二表面上并附着到基板上。 覆盖存储芯片的超薄塑料外壳的厚度约为0.1〜0.15mm。

    MEMORY CARD STRUCTURE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    MEMORY CARD STRUCTURE AND MANUFACTURING METHOD THEREOF 失效
    记忆卡结构及其制造方法

    公开(公告)号：US20060077749A1

    公开(公告)日：2006-04-13

    申请号：US10904975

    申请日：2004-12-08

    申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    IPC分类号： G11C8/02

    CPC分类号： B82Y10/00 ,  G11C5/02 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

    摘要翻译： 提供一种包括基板，多个存储芯片，一些封装材料和超薄塑料外壳的存储卡结构。 为了制造存储卡，提供具有第一表面和第二表面的基板。 第一表面具有多个外部触点，并且第二表面具有至少一个空腔。 在空腔周围有多个内部接触。 此外，外触点和内触头彼此电连接。 存储器芯片堆叠在腔内并电连接到衬底的内部触点。 然后，使用模塑料封装存储芯片和内触点。 此后，将超薄塑料外壳放置在第二表面上并附着到基板上。 覆盖存储芯片的超薄塑料外壳的厚度约为0.1〜0.15mm。

    Memory card
    5.
    发明授权
    Memory card 失效
    存储卡

    公开(公告)号：US07230279B2

    公开(公告)日：2007-06-12

    申请号：US10904974

    申请日：2004-12-08

    申请人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    发明人： Cheng-Hsien Kuo ,  Ming-Jhy Jiang ,  Cheng-Kang Yu ,  Hui-Chuan Chuang

    IPC分类号： H01L27/15

    CPC分类号： H01L23/5388 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/117 ,  H05K3/284 ,  H05K5/0256 ,  H05K5/064 ,  H05K2203/1316 ,  H01L2224/0401

    摘要： A memory card is provided. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electrically connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electrically connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.

    摘要翻译： 提供存储卡。 存储卡包括基板，多个电子封装装置，模塑料和塑料成形材料。 基板具有至少多个外部触点和多个内部触点，并且外部触头电连接到内部触点。 电子封装器件位于衬底上，电子封装器件分别电连接到内触点。 模塑料覆盖电子封装装置和相应的内部触点。 塑料成型材料覆盖模塑料和基材，塑料成型材料暴露外触点。

    FOREIGN OBJECT DETECTING APPARATUS IN A BILL PASSAGEWAY
    9.
    发明申请
    FOREIGN OBJECT DETECTING APPARATUS IN A BILL PASSAGEWAY 有权
    外部对象检测设备在通行证

    公开(公告)号：US20100271203A1

    公开(公告)日：2010-10-28

    申请号：US12480902

    申请日：2009-06-09

    申请人： Tien-Yuan Chien ,  Cheng-Kang Yu ,  Fu-Yuan Chang

    发明人： Tien-Yuan Chien ,  Cheng-Kang Yu ,  Fu-Yuan Chang

    IPC分类号： G08B21/00

    CPC分类号： G07D11/0042

    摘要： A foreign object detecting apparatus in bill passageway includes a laser light source, a first light detector and a second light detector. The laser light source is arranged in a first lateral side to emit a coherent laser beam toward a second lateral side. The first light detector is arranged in the second lateral side to receive the coherent laser beam and to measure the intensity of the coherent laser beam. The second light detector is arranged in one of a top side and a bottom side, wherein when a foreign object is presence in the bill passageway, the intensity of the coherent laser beam received by the first light detector is decreased by the blocking of the foreign object, and at least a portion of the coherent laser beam which is reflected, refracted, diffracted or scattered by the foreign object is received by the second light detector.

    摘要翻译： 纸币通道中的异物检测装置包括激光光源，第一光检测器和第二光检测器。 激光源被布置在第一横向侧以朝向第二侧面发射相干激光束。 第一光检测器布置在第二横向侧以接收相干激光束并测量相干激光束的强度。 第二光检测器布置在顶侧和底侧中的一个中，其中当异物存在于纸币通道中时，由第一光检测器接收的相干激光束的强度通过阻挡外来物体而减小 物体，并且由异物反射，折射，衍射或散射的相干激光束的至少一部分被第二光检测器接收。

    BILL ACCEPTOR THAT PREVENTS ARCHING OF EACH RECEIVED BILL
    10.
    发明申请
    BILL ACCEPTOR THAT PREVENTS ARCHING OF EACH RECEIVED BILL 审中-公开
    收到每个收到的条例草案的收件人

    公开(公告)号：US20100320056A1

    公开(公告)日：2010-12-23

    申请号：US12852953

    申请日：2010-08-09

    申请人： Cheng-Kang Yu ,  Wei-Jr Chen ,  Shih-Chia Chen

    发明人： Cheng-Kang Yu ,  Wei-Jr Chen ,  Shih-Chia Chen

    IPC分类号： G07F7/04 ,  G07F9/02

    CPC分类号： G07D11/175 ,  G07D11/14

    摘要： A bill acceptor includes a bill acceptor main unit having a bill insertion slot, a bill transfer mechanism for transferring each inserted bill through a bill passage to a bill outlet, a bill recognition unit for recognizing the authenticity and value of each inserted bill and a bill pusher for pushing each inserted bill out of the bill outlet, and a bill box having a front opening facing the bill pusher, two elongated stop members disposed at two opposite lateral sides of the front opening in a parallel manner, a bill-receiving bearing board supported on spring members inside the box body of the bill acceptor for receiving each bill that is pushed away from the bill outlet into the bill box and a baffle pivotally mounted in the box body at the top side of front opening adjacent to the bill outlet and biasable for letting each inserted bill be pushed by the bill pusher out of the bill outlet onto the bill-receiving bearing board and reversible to hold down each received bill on the bill-receiving bearing board in a smooth condition to avoid bill jams.

    摘要翻译： 纸币接收器包括具有纸币插入口的纸币接收器主单元，用于通过纸币通道将每个插入的纸币传送到纸币出口的纸币传送机构，用于识别每个插入的纸币的真实性和价值的纸币识别单元， 用于将每个插入的纸币推出纸币出口的推动器和具有面向钞票推动器的前开口的钞票盒，两个细长止动元件，以平行的方式设置在前开口的两个相对的横向侧面处，纸币接收轴承板 支撑在纸币收件人的箱体内的弹簧构件，用于接收从纸币出口被推出到纸币盒中的每个纸币;以及挡板，其在与纸币出口相邻的前开口的顶侧处可枢转地安装在箱体中， 用于使每个插入的纸币被钞票推动器从纸币出口推出到纸币接收轴承板上并且可逆地将每个接收的纸币按压在纸币上 接收轴承板顺利进行，以避免卡纸。