Customizing a namespace in a decentralized storage environment
    3.
    发明授权
    Customizing a namespace in a decentralized storage environment 有权
    在分散存储环境中自定义命名空间

    公开(公告)号:US08190741B2

    公开(公告)日:2012-05-29

    申请号:US11395118

    申请日:2006-03-31

    IPC分类号: G06F15/173

    CPC分类号: G06F17/30079 G06F17/30212

    摘要: Systems and methods to customize a namespace using a synthetic namespace. A NAS switch provides file migrations in a NAS storage network that are transparent to the clients. The NAS switch file handles are used to customize a namespace. More specifically, a synthetic namespace is generated from one or more file location tables that map the switch file handles to NAS file handles. The NAS file handles are independent of a physical export containing the objects referred to by the NAS file handles. In one example, the synthetic namespace presents a home directory corresponding to a location of a user.

    摘要翻译: 使用合成命名空间来定制命名空间的系统和方法。 NAS交换机提供对客户端透明的NAS存储网络中的文件迁移。 NAS交换机文件句柄用于自定义命名空间。 更具体地说,从映射交换机文件句柄到NAS文件句柄的一个或多个文件位置表生成合成命名空间。 NAS文件句柄与包含NAS文件句柄所指对象的物理导出无关。 在一个示例中,合成命名空间呈现对应于用户位置的主目录。

    SMD chip handling apparatus
    5.
    发明授权
    SMD chip handling apparatus 失效
    SMD芯片处理设备

    公开(公告)号:US07337534B2

    公开(公告)日:2008-03-04

    申请号:US11100585

    申请日:2005-04-07

    IPC分类号: B23P19/00

    摘要: The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander formed on an elongated rod slidably mounted within a vertical tubular housing. An SMD chip may be safely fetched by pressing the rod on the top of the SMD with a continuous depressing motion until the fingers clasp the SMD chip safely therebetween. A soldering unit with a bifurcate soldering head located juxtaposed to the fingers is operative to solder the SMD chip to the printed circuit board while the SMD chip is safely held in place.

    摘要翻译: 该装置用于将SMD芯片安全地取出并定位在印刷电路板上并将其焊接到电路板上。 两个弹簧板通过形成在可滑动地安装在垂直管状壳体中的细长杆上的膨胀器形成楔形分离的宽度大于SMD芯片的宽度的夹紧指状物。 通过按压SMD的顶部的杆,可以通过连续的按压运动来安全地取得SMD芯片,直到手指将SMD芯片安全地夹在其间。 具有与指状物并置的分叉焊接头的焊接单元可操作以将SMD芯片焊接到印刷电路板,同时将SMD芯片安全地保持在适当位置。

    Method and apparatus for making smart card solder contacts
    6.
    发明授权
    Method and apparatus for making smart card solder contacts 失效
    制造智能卡焊接触点的方法和装置

    公开(公告)号:US06857552B2

    公开(公告)日:2005-02-22

    申请号:US10414768

    申请日:2003-04-17

    申请人: Chi Ming Wong

    发明人: Chi Ming Wong

    摘要: A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal opening with melted solder retained therein. The solder pre-coated terminal ends are maintained in a secured contact with the terminal contacts of the IC module by heating coils mounted at a free front end of two pivotal elongated cantilever arms. A piece of predetermined amount of solder is dropped into the cavity of each heating coil, and the heating coils are actuated with a low electrical current to generate a concentrated intense heat to melt the piece of solder to form secure permanent solder joints between the terminal ends of the antenna to the contact terminals of the IC module.

    摘要翻译: 示出了用于焊接嵌入塑料智能卡中的天线的端部以接触设置在卡上的IC模块的端子的方法和装置。 漆包线天线端子端部用具有水平开口的加热器的焊料预涂覆,熔融的焊料保留在其中。 通过加热安装在两个枢转细长悬臂的自由前端的线圈,将焊料预涂覆的端子保持与IC模块的端子触点的牢固接触。 预定量的焊料落在每个加热线圈的空腔中,并且加热线圈以低电流致动以产生集中的强烈热量,以熔化该焊料片,以在终端之间形成牢固的永久焊接点 的天线连接到IC模块的接触端子。