公开(公告)号：US06329610B1

公开(公告)日：2001-12-11

申请号：US09088095

申请日：1998-06-01

申请人： Chiaki Takubo ,  Yoshizumi Sato ,  Tomitsugu Kojima ,  Go Takeda

发明人： Chiaki Takubo ,  Yoshizumi Sato ,  Tomitsugu Kojima ,  Go Takeda

IPC分类号： H01R1204

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4688 ,  H05K3/4691 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2203/1189 ,  H01L2224/05599

摘要： A first via land of a wiring layer on a first surface of a first insulation layer that is a rigid layer and a second via land of a wiring layer on a second surface of a second insulation layer that is a flexible layer are electrically and mechanically connected with a conductive pillar pierced through a third insulation layer disposed between the first insulation layer and the second insulation layer. In such a structure, a wiring board that can mount a highly integrated semiconductor device, that is small and thin, and that has high reliability can be accomplished.

摘要翻译： 在作为柔性层的第二绝缘层的第二表面上的第一绝缘层的刚性层和布线层的第二通孔焊盘的第一表面上的布线层的第一通孔焊盘电连接和机械连接 其中导电柱穿过设置在第一绝缘层和第二绝缘层之间的第三绝缘层。 在这种结构中，可以实现能够安装小而薄并且具有高可靠性的高度集成的半导体器件的布线板。