公开(公告)号：US20060220030A1

公开(公告)日：2006-10-05

申请号：US11081319

申请日：2005-03-16

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

IPC分类号： H01L33/00

CPC分类号： F21K9/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a lighting device with flipped side-structure of LEDs, which allows emitted lights to travel in parallel with the mounting surface. Single or plural LED chips are mounted on a substrate with their side surfaces facing the substrate surface. The lighting device can be further combined with optical protrusions on the substrate to form a light module for reflecting and mixing lights emitted from the LED chips. It does not require a conventional wire bonding process. The packaging structure also resolves the heat dissipation problem of the LEDs. Electrostatic discharge protection circuits can be included in the light module if desired. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.

摘要翻译： 公开了一种具有翻转的LED侧面结构的照明装置，其允许发射的光与安装表面平行地行进。 单个或多个LED芯片安装在基板上，其侧表面面向基板表面。 照明装置可以进一步与基板上的光学突起组合，以形成用于反射和混合从LED芯片发射的光的光模块。 它不需要常规的引线接合工艺。 封装结构也解决了LED散热问题。 如果需要，静电放电保护电路可以包括在灯模块中。 本发明实现了具有所需色度的组合光的均匀性和高强度。

公开(公告)号：US07381995B2

公开(公告)日：2008-06-03

申请号：US11081319

申请日：2005-03-16

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

IPC分类号： H01L31/12

CPC分类号： F21K9/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a lighting device with flipped side-structure of LEDs, which allows emitted lights to travel in parallel with the mounting surface. Single or plural LED chips are mounted on a substrate with their side surfaces facing the substrate surface. The lighting device can be further combined with optical protrusions on the substrate to form a light module for reflecting and mixing lights emitted from the LED chips. It does not require a conventional wire bonding process. The packaging structure also resolves the heat dissipation problem of the LEDs. Electrostatic discharge protection circuits can be included in the light module if desired. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.

摘要翻译： 公开了一种具有翻转的LED侧面结构的照明装置，其允许发射的光与安装表面平行地行进。 单个或多个LED芯片安装在基板上，其侧表面面向基板表面。 照明装置可以进一步与基板上的光学突起组合，以形成用于反射和混合从LED芯片发射的光的光模块。 它不需要常规的引线接合工艺。 封装结构也解决了LED散热问题。 如果需要，静电放电保护电路可以包括在灯模块中。 本发明实现了具有所需色度的组合光的均匀性和高强度。

公开(公告)号：US08026603B2

公开(公告)日：2011-09-27

申请号：US11408072

申请日：2006-04-21

申请人： Yung-Yu Hsu ,  Chih-Yuan Cheng ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

发明人： Yung-Yu Hsu ,  Chih-Yuan Cheng ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

IPC分类号： H01L23/52

CPC分类号： H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/209 ,  H01L2924/00

摘要： An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

摘要翻译： 因此，提供了与柔性包装的互连结构相关的集成电路和制造方法的互连结构。 互连结构包括第一和第二导电焊盘。 多个微小且导电的第一支柱分别形成在第一和第二垫上。 当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。 此外，互连结构也可以用于与由导电材料制成的纤维连接。 此外，支柱的密度越高，接触强度越强。 并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。 因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

公开(公告)号：US07354178B2

公开(公告)日：2008-04-08

申请号：US11223557

申请日：2005-09-09

申请人： Wei-Kuo Han ,  Ra-Min Tain ,  Chin-Lung Chen ,  Shyi-Ching Liau

发明人： Wei-Kuo Han ,  Ra-Min Tain ,  Chin-Lung Chen ,  Shyi-Ching Liau

IPC分类号： F21V7/00

CPC分类号： F21V7/09 ,  F21Y2115/10 ,  G03B21/2013 ,  G03B21/2033 ,  G03B21/208 ,  Y10S362/80

摘要： A structure of illuminating unit includes a point-like light-emitting device, having an optical axis. An initial-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The point-like light-emitting device is located at the convergent opening end and the optical axis is toward the divergent end for emitting light. The initial-stage conoid-like reflective surface and the optical axis include an initial-stage included angle. A final-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The convergent opening end of the final-stage conoid-like reflective surface is coupled with the divergent opening end of the initial-stage conoid-like reflective surface. The final-stage conoid-like reflective surface and the optical axis include a final-stage included angle. The initial-stage included angle is larger than the final-stage included angle.

摘要翻译： 照明单元的结构包括具有光轴的点状发光装置。 初级锥形反射面具有收敛的开口端和发散的开口端。 点状发光装置位于会聚开口端，光轴朝向发光端的发散端。 初级锥形反射面和光轴包括初始阶段夹角。 最后阶段的锥形反射表面具有收敛的开口端和发散的开口端。 最终级锥形反射表面的会聚开口端与初始阶段锥形反射表面的发散开口端相连。 最后阶段的锥形反射表面和光轴包括最终级夹角。 初始包角大于最终级夹角。

公开(公告)号：US20070128845A1

公开(公告)日：2007-06-07

申请号：US11408072

申请日：2006-04-21

申请人： Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

发明人： Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

IPC分类号： H01L21/4763 ,  H01L23/48

CPC分类号： H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/209 ,  H01L2924/00

摘要： An interconnect structure of an integrated circuit and manufacturing method therefor are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

摘要翻译： 提供了一种集成电路的互连结构及其制造方法，涉及柔性封装的互连结构。 互连结构包括第一和第二导电焊盘。 多个微小且导电的第一支柱分别形成在第一和第二垫上。 当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。 此外，互连结构也可以用于与由导电材料制成的纤维连接。 此外，支柱的密度越高，接触强度越强。 并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。 因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

公开(公告)号：US20120178212A1

公开(公告)日：2012-07-12

申请号：US13424926

申请日：2012-03-20

申请人： Chi-Shih Chang ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee

发明人： Chi-Shih Chang ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee

IPC分类号： H01L21/98

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/552 ,  H01L23/562 ,  H01L23/60 ,  H01L23/642 ,  H01L24/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： A novel three dimensional wafer stack and the manufacturing method therefor are provided. The three dimensional wafer stack includes a first wafer having a first substrate and a first device layer having thereon at least one chip, a second wafer disposed above the first wafer and having a second substrate, and at least one pedestal arranged between and extending from the first substrate to the second substrate. The pedestal arranged in the device layer is used for preventing the low-k materials existing in the device layer from being damaged by the stresses.

摘要翻译： 提供了一种新颖的三维晶片叠层及其制造方法。 三维晶片堆叠包括具有第一基板的第一晶片和在其上具有至少一个芯片的第一器件层，设置在第一晶片上方并具有第二基板的第二晶片，以及布置在第一基板之间并从其延伸的至少一个基座 第一衬底到第二衬底。 布置在器件层中的基座用于防止存在于器件层中的低k材料被应力损坏。

公开(公告)号：US20100020502A1

公开(公告)日：2010-01-28

申请号：US12180360

申请日：2008-07-25

申请人： Ra-Min Tain ,  Shu-Ming Chang ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee ,  Chi-Shih Chang

发明人： Ra-Min Tain ,  Shu-Ming Chang ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee ,  Chi-Shih Chang

IPC分类号： H05K7/20

CPC分类号： H01L25/0657 ,  H01L23/562 ,  H01L25/50 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： a wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate.

摘要翻译： 提供了其中形成有密封结构的晶片到晶片堆叠。 晶片堆叠包括第一晶片，其包括第一衬底和其上具有至少一个芯片和至少一个低k​​材料层的第一器件层，设置在第一晶片上方并具有第二衬底的第二晶片，以及闭合 结构设置在所述至少一个芯片上并且布置在所述至少一个芯片的切割边缘内，其中所述封闭结构从所述第一器件层的远离所述第一衬底的一侧延伸到与所述第一衬底相邻的另一侧 。

公开(公告)号：US07314291B2

公开(公告)日：2008-01-01

申请号：US10963401

申请日：2004-10-12

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

IPC分类号： F21V29/00 ,  H01L29/22

CPC分类号： H05B33/0857 ,  F21K9/00 ,  F21V7/0008 ,  F21V29/51 ,  F21V29/67 ,  F21V29/677 ,  F21V29/74 ,  F21Y2107/30 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803

摘要： An LED lamp includes LED chips, an axle, and a lampshade. The LED chips are mounted on surface of the axle. The axle extends across the lampshade. A heat pipe is installed inside the axle for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.

摘要翻译： LED灯包括LED芯片，轴和灯罩。 LED芯片安装在轴的表面上。 车轴延伸穿过灯罩。 轴内安装有热管，用于将LED芯片产生的热量传递到灯罩的外部，并获得更好的散热。

公开(公告)号：US07312478B2

公开(公告)日：2007-12-25

申请号：US11023487

申请日：2004-12-29

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

IPC分类号： H01L29/22

CPC分类号： H01L33/486 ,  H01L33/385 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.

摘要翻译： 本发明公开了一种裸露LED的侧面结构及其背光模块，其中，背光模块优选为LCD装置等显示装置的光源。 背光模块包括被导热电介质材料覆盖的平板，放置在平板上并与导热介电材料接触的裸露LED的多个侧面结构，以及多个反射部分 平板，每个裸LED的每个侧面结构包括裸LED和分别耦合到裸LED的侧结构的两个焊盘的两个导电材料，并且定位在其平板上。

公开(公告)号：US20070151969A1

公开(公告)日：2007-07-05

申请号：US11562420

申请日：2006-11-22

申请人： Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

发明人： Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

IPC分类号： H05B6/10

CPC分类号： F01K13/006 ,  F01K21/02

摘要： A heat-pipe electric-power generating device capable of converting thermal energy to electrical energy is provided. The device includes a heat pipe and the heat pipe has a sealed internal space that can produce a steam-flow from an evaporating end to a condensing end according to a pressure difference caused by a temperature difference between the ends. A steam-flow electric-power generating device has at least a rotating portion disposed in the internal space for generating electric power when driven by a steam-flow. An electrode structure is used for leading the electric power out. The heat pipe is maintained in a sealed condition. In addition, several heat-pipe electric-power generating devices can be arranged into an array to form a heat electric-power generator or disposed inside an apparatus with a heat source for recycling the conventional waste thermal energy into useful electrical energy.

摘要翻译： 提供了一种能够将热能转换成电能的热管式发电装置。 该装置包括热管，并且热管具有密封的内部空间，其可以根据由端部之间的温度差引起的压力差而产生从蒸发端到冷凝端的蒸汽流。 蒸汽流动发电装置至少具有设置在内部空间中的旋转部分，用于在由蒸汽流动驱动时产生电力。 电极结构用于引出电力。 热管保持密封状态。 此外，若干热管式发电装置可以排列成阵列以形成热发电机，或设置在具有用于将常规废热热能再循环到有用电能的热源的装置内。