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    Lighting device with flipped side-structure of LEDs
    1.
    发明申请
    Lighting device with flipped side-structure of LEDs 失效
    具有LED翻转侧面结构的照明装置

    公开(公告)号：US20060220030A1

    公开(公告)日：2006-10-05

    申请号：US11081319

    申请日：2005-03-16

    申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

    发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

    IPC分类号： H01L33/00

    CPC分类号： F21K9/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a lighting device with flipped side-structure of LEDs, which allows emitted lights to travel in parallel with the mounting surface. Single or plural LED chips are mounted on a substrate with their side surfaces facing the substrate surface. The lighting device can be further combined with optical protrusions on the substrate to form a light module for reflecting and mixing lights emitted from the LED chips. It does not require a conventional wire bonding process. The packaging structure also resolves the heat dissipation problem of the LEDs. Electrostatic discharge protection circuits can be included in the light module if desired. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.

    摘要翻译： 公开了一种具有翻转的LED侧面结构的照明装置，其允许发射的光与安装表面平行地行进。 单个或多个LED芯片安装在基板上，其侧表面面向基板表面。 照明装置可以进一步与基板上的光学突起组合，以形成用于反射和混合从LED芯片发射的光的光模块。 它不需要常规的引线接合工艺。 封装结构也解决了LED散热问题。 如果需要，静电放电保护电路可以包括在灯模块中。 本发明实现了具有所需色度的组合光的均匀性和高强度。

    Lighting device with flipped side-structure of LEDs
    2.
    发明授权
    Lighting device with flipped side-structure of LEDs 失效
    具有LED翻转侧面结构的照明装置

    公开(公告)号：US07381995B2

    公开(公告)日：2008-06-03

    申请号：US11081319

    申请日：2005-03-16

    申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

    发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

    IPC分类号： H01L31/12

    CPC分类号： F21K9/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a lighting device with flipped side-structure of LEDs, which allows emitted lights to travel in parallel with the mounting surface. Single or plural LED chips are mounted on a substrate with their side surfaces facing the substrate surface. The lighting device can be further combined with optical protrusions on the substrate to form a light module for reflecting and mixing lights emitted from the LED chips. It does not require a conventional wire bonding process. The packaging structure also resolves the heat dissipation problem of the LEDs. Electrostatic discharge protection circuits can be included in the light module if desired. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.

    摘要翻译： 公开了一种具有翻转的LED侧面结构的照明装置，其允许发射的光与安装表面平行地行进。 单个或多个LED芯片安装在基板上，其侧表面面向基板表面。 照明装置可以进一步与基板上的光学突起组合，以形成用于反射和混合从LED芯片发射的光的光模块。 它不需要常规的引线接合工艺。 封装结构也解决了LED散热问题。 如果需要，静电放电保护电路可以包括在灯模块中。 本发明实现了具有所需色度的组合光的均匀性和高强度。

    Wafer-To-Wafer Stacking
    4.
    发明申请
    Wafer-To-Wafer Stacking 有权
    晶圆到晶片堆叠

    公开(公告)号：US20100020502A1

    公开(公告)日：2010-01-28

    申请号：US12180360

    申请日：2008-07-25

    申请人： Ra-Min Tain ,  Shu-Ming Chang ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee ,  Chi-Shih Chang

    发明人： Ra-Min Tain ,  Shu-Ming Chang ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee ,  Chi-Shih Chang

    IPC分类号： H05K7/20

    CPC分类号： H01L25/0657 ,  H01L23/562 ,  H01L25/50 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

    摘要： a wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate.

    摘要翻译： 提供了其中形成有密封结构的晶片到晶片堆叠。 晶片堆叠包括第一晶片，其包括第一衬底和其上具有至少一个芯片和至少一个低k​​材料层的第一器件层，设置在第一晶片上方并具有第二衬底的第二晶片，以及闭合 结构设置在所述至少一个芯片上并且布置在所述至少一个芯片的切割边缘内，其中所述封闭结构从所述第一器件层的远离所述第一衬底的一侧延伸到与所述第一衬底相邻的另一侧 。

    Side structure of a bare LED and backlight module thereof
    6.
    发明授权
    Side structure of a bare LED and backlight module thereof 有权
    裸LED及其背光模块的侧面结构

    公开(公告)号：US07312478B2

    公开(公告)日：2007-12-25

    申请号：US11023487

    申请日：2004-12-29

    申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

    发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

    IPC分类号： H01L29/22

    CPC分类号： H01L33/486 ,  H01L33/385 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.

    摘要翻译： 本发明公开了一种裸露LED的侧面结构及其背光模块，其中，背光模块优选为LCD装置等显示装置的光源。 背光模块包括被导热电介质材料覆盖的平板，放置在平板上并与导热介电材料接触的裸露LED的多个侧面结构，以及多个反射部分 平板，每个裸LED的每个侧面结构包括裸LED和分别耦合到裸LED的侧结构的两个焊盘的两个导电材料，并且定位在其平板上。

    HEAT-PIPE ELECTRIC-POWER GENERATING DEVICE
    7.
    发明申请
    HEAT-PIPE ELECTRIC-POWER GENERATING DEVICE 有权
    热管式发电装置

    公开(公告)号：US20070151969A1

    公开(公告)日：2007-07-05

    申请号：US11562420

    申请日：2006-11-22

    申请人： Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

    发明人： Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

    IPC分类号： H05B6/10

    CPC分类号： F01K13/006 ,  F01K21/02

    摘要： A heat-pipe electric-power generating device capable of converting thermal energy to electrical energy is provided. The device includes a heat pipe and the heat pipe has a sealed internal space that can produce a steam-flow from an evaporating end to a condensing end according to a pressure difference caused by a temperature difference between the ends. A steam-flow electric-power generating device has at least a rotating portion disposed in the internal space for generating electric power when driven by a steam-flow. An electrode structure is used for leading the electric power out. The heat pipe is maintained in a sealed condition. In addition, several heat-pipe electric-power generating devices can be arranged into an array to form a heat electric-power generator or disposed inside an apparatus with a heat source for recycling the conventional waste thermal energy into useful electrical energy.

    摘要翻译： 提供了一种能够将热能转换成电能的热管式发电装置。 该装置包括热管，并且热管具有密封的内部空间，其可以根据由端部之间的温度差引起的压力差而产生从蒸发端到冷凝端的蒸汽流。 蒸汽流动发电装置至少具有设置在内部空间中的旋转部分，用于在由蒸汽流动驱动时产生电力。 电极结构用于引出电力。 热管保持密封状态。 此外，若干热管式发电装置可以排列成阵列以形成热发电机，或设置在具有用于将常规废热热能再循环到有用电能的热源的装置内。

    WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL
    9.
    发明申请
    WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL 有权
    带支撑垫的散热器堆叠

    公开(公告)号：US20110156249A1

    公开(公告)日：2011-06-30

    申请号：US12982046

    申请日：2010-12-30

    申请人： Chi-Shih Chang ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee

    发明人： Chi-Shih Chang ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee

    IPC分类号： H01L23/48

    CPC分类号： H01L23/481 ,  H01L23/552 ,  H01L23/60 ,  H01L23/642 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.

    摘要翻译： 提供具有堆叠结构的电子设备。 电子设备包括第一电子层，设置在第一电子层上的第二电子层和至少一个柱。 第一电子层具有第一界面，并且包括第一基板和设置在第一基板上的第一装置层。 第一接口位于第一基板和第一器件层之间，并且第一器件层具有与第一接口相对的表面。 该柱布置在第​​一器件层中，并且从第一界面延伸到第一器件层的表面。