公开(公告)号：US20090117695A1

公开(公告)日：2009-05-07

申请号：US12260674

申请日：2008-10-29

申请人： Chih-Hsin Ko ,  Tzu-Juei Wang ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

发明人： Chih-Hsin Ko ,  Tzu-Juei Wang ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

IPC分类号： H01L21/8249

CPC分类号： H01L21/8249 ,  H01L21/823807 ,  H01L27/0623 ,  H01L29/7843

摘要： A BiCMOS device with enhanced performance by mechanical uniaxial strain is provided. A first embodiment of the present invention includes an NMOS transistor, a PMOS transistor, and a bipolar transistor formed on different areas of the substrate. A first contact etch stop layer with tensile stress is formed over the NMOS transistor, and a second contact etch stop layer with compressive stress is formed over the PMOS transistor and the bipolar transistor, allowing for an enhancement of each device. Another embodiment has, in addition to the stressed contact etch stop layers, strained channel regions in the PMOS transistor and the NMOS transistor, and a strained base in the BJT.

摘要翻译： 提供了通过机械单轴应变增强性能的BiCMOS器件。 本发明的第一实施例包括形成在衬底的不同区域上的NMOS晶体管，PMOS晶体管和双极晶体管。 具有拉伸应力的第一接触蚀刻停止层形成在NMOS晶体管上，并且在PMOS晶体管和双极晶体管上形成具有压应力的第二接触蚀刻停止层，从而允许每个器件的增强。 除了应力接触蚀刻停止层之外，另一实施例还包括PMOS晶体管和NMOS晶体管中的应变通道区域以及BJT中的应变基极。

公开(公告)号：US20060125121A1

公开(公告)日：2006-06-15

申请号：US11081416

申请日：2005-03-16

申请人： Chih-Hsin Ko ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi ,  Chung-Hu Ke

发明人： Chih-Hsin Ko ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi ,  Chung-Hu Ke

IPC分类号： H01L31/109

CPC分类号： H01L27/095 ,  H01L27/108 ,  H01L27/10802 ,  H01L27/10844 ,  H01L29/7841 ,  H01L29/812

摘要： A tunneling injection based Schottky source/drain memory cell comprising: a first semiconductor layer with a first conductivity type overlying an insulating layer, wherein the first semiconductor acts as a body region; a gate dielectric overlying the semiconductor layer; a gate electrode overlying the gate dielectric; a pair of spacers on sides of the gate electrodes; and a first Schottky barrier junction formed on a source region and a second Schottky barrier junction formed on a drain region on opposing sides of the body region. The source and the regions have an overlapping portion with the gate electrode and length of overlapping portion is preferably greater than about 5 Å. Interfacial layers are formed between the first and the second Schottky barrier regions.

摘要翻译： 一种基于隧道注入的肖特基源/漏存储单元，包括：第一半导体层，其具有覆盖绝缘层的第一导电类型，其中所述第一半导体作为体区; 覆盖半导体层的栅极电介质; 覆盖栅极电介质的栅电极; 栅电极侧面的一对间隔物; 以及形成在源区域上的第一肖特基势垒结和形成在身体区域的相对侧上的漏极区域上的第二肖特基势垒结。 源极和区域与栅电极具有重叠部分，并且重叠部分的长度优选大于约。 在第一和第二肖特基势垒区之间形成界面层。

公开(公告)号：US20110223727A1

公开(公告)日：2011-09-15

申请号：US13113530

申请日：2011-05-23

申请人： Chih-Hsin Ko ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

发明人： Chih-Hsin Ko ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

IPC分类号： H01L21/8238

CPC分类号： H01L21/823814 ,  H01L29/1054 ,  H01L29/165 ,  H01L29/47 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/66568 ,  H01L29/6659 ,  H01L29/66643 ,  H01L29/7843

摘要： A semiconductor structure includes a semiconductor substrate, and an NMOS device at a surface of the semiconductor substrate, wherein the NMOS device comprises a Schottky source/drain extension region. The semiconductor structure further includes a PMOS device at the surface of the semiconductor substrate, wherein the PMOS device comprises a source/drain extension region comprising only non-metal materials. Schottky source/drain extension regions may be formed for both PMOS and NMOS devices, wherein the Schottky barrier height of the PMOS device is reduced by forming the PMOS device over a semiconductor layer having a low valence band.

摘要翻译： 半导体结构包括半导体衬底和在半导体衬底的表面处的NMOS器件，其中NMOS器件包括肖特基源极/漏极延伸区域。 半导体结构还包括在半导体衬底的表面处的PMOS器件，其中PMOS器件包括仅包含非金属材料的源极/漏极延伸区域。 可以为PMOS器件和NMOS器件形成肖特基源极/漏极延伸区域，其中通过在具有低价带的半导体层上形成PMOS器件来减小PMOS器件的肖特基势垒高度。

公开(公告)号：US07803718B2

公开(公告)日：2010-09-28

申请号：US12260674

申请日：2008-10-29

申请人： Chih-Hsin Ko ,  Tzu-Juei Wang ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

发明人： Chih-Hsin Ko ,  Tzu-Juei Wang ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

IPC分类号： H01L23/31

CPC分类号： H01L21/8249 ,  H01L21/823807 ,  H01L27/0623 ,  H01L29/7843

摘要： A BiCMOS device with enhanced performance by mechanical uniaxial strain is provided. A first embodiment of the present invention includes an NMOS transistor, a PMOS transistor, and a bipolar transistor formed on different areas of the substrate. A first contact etch stop layer with tensile stress is formed over the NMOS transistor, and a second contact etch stop layer with compressive stress is formed over the PMOS transistor and the bipolar transistor, allowing for an enhancement of each device. Another embodiment has, in addition to the stressed contact etch stop layers, strained channel regions in the PMOS transistor and the NMOS transistor, and a strained base in the BJT.

摘要翻译： 提供了通过机械单轴应变增强性能的BiCMOS器件。 本发明的第一实施例包括形成在衬底的不同区域上的NMOS晶体管，PMOS晶体管和双极晶体管。 具有拉伸应力的第一接触蚀刻停止层形成在NMOS晶体管上，并且在PMOS晶体管和双极晶体管上形成具有压应力的第二接触蚀刻停止层，从而允许每个器件的增强。 除了应力接触蚀刻停止层之外，另一实施例还包括PMOS晶体管和NMOS晶体管中的应变通道区域以及BJT中的应变基极。

公开(公告)号：US20070052027A1

公开(公告)日：2007-03-08

申请号：US11220176

申请日：2005-09-06

申请人： Chung-Hu Ke ,  Chih-Hsin Ko ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi

发明人： Chung-Hu Ke ,  Chih-Hsin Ko ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi

IPC分类号： H01L27/01

CPC分类号： H01L21/823807 ,  H01L21/823821 ,  H01L21/823878 ,  H01L21/8252 ,  H01L21/8258 ,  H01L21/84 ,  H01L27/0922 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/785

摘要： A CMOS device is provided. A semiconductor device comprises a substrate, the substrate having a first region and a second region, the first region having a first crystal orientation represented by a family of Miller indices comprising {i,j,k}, the second region having a second crystal orientation represented a family of Miller indices comprising {l,m,n}, wherein l2+m2+n2>i2+j2+k2. Alternative embodiments further comprise an NMOSFET formed on the first region, and a PMOSFET formed on the second region. Embodiments further comprise a Schottky contact formed with at least one of a the NMOSFET or PMOSFET.

摘要翻译： 提供CMOS器件。 半导体器件包括衬底，衬底具有第一区域和第二区域，第一区域具有由包括{i，j，k}的米勒指数族代表的第一晶体取向，第二区域具有第二晶体取向 代表了包含{l，m，n}的米勒指数族，其中l 2+ + m 2 + 2 + 2 2 / 2 + 2＆lt; 2＆gt; 2＆gt; 2＆lt; 2＆gt; 替代实施例还包括形成在第一区域上的NMOSFET和形成在第二区域上的PMOSFET。 实施例还包括由NMOSFET或PMOSFET中的至少一个形成的肖特基接触。

公开(公告)号：US07737532B2

公开(公告)日：2010-06-15

申请号：US11220176

申请日：2005-09-06

申请人： Chung-Hu Ke ,  Chih-Hsin Ko ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi

发明人： Chung-Hu Ke ,  Chih-Hsin Ko ,  Hung-Wei Chen ,  Wen-Chin Lee ,  Min-Hwa Chi

IPC分类号： H01L29/04

CPC分类号： H01L21/823807 ,  H01L21/823821 ,  H01L21/823878 ,  H01L21/8252 ,  H01L21/8258 ,  H01L21/84 ,  H01L27/0922 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/785

摘要： A CMOS device is provided. A semiconductor device comprises a substrate, the substrate having a first region and a second region, the first region having a first crystal orientation represented by a family of Miller indices comprising {i,j,k}, the second region having a second crystal orientation represented a family of Miller indices comprising {l,m,n}, wherein l2+m2+n2>i2+j2+k2. Alternative embodiments further comprise an NMOSFET formed on the first region, and a PMOSFET formed on the second region. Embodiments further comprise a Schottky contact formed with at least one of a the NMOSFET or PMOSFET.

摘要翻译： 提供CMOS器件。 半导体器件包括衬底，衬底具有第一区域和第二区域，第一区域具有由包括{i，j，k}的米勒指数族代表的第一晶体取向，第二区域具有第二晶体取向 表示包括{l，m，n}的米勒指数族，其中l2 + m2 + n2> i2 + j2 + k2。 替代实施例还包括形成在第一区域上的NMOSFET和形成在第二区域上的PMOSFET。 实施例还包括由NMOSFET或PMOSFET中的至少一个形成的肖特基接触。

公开(公告)号：US07511348B2

公开(公告)日：2009-03-31

申请号：US11717450

申请日：2007-03-13

申请人： Chih-Hsin Ko ,  Wen-Chin Lee ,  Chung-Hu Ke ,  Hung-Wei Chen

发明人： Chih-Hsin Ko ,  Wen-Chin Lee ,  Chung-Hu Ke ,  Hung-Wei Chen

IPC分类号： H01L29/76

CPC分类号： H01L21/823807 ,  H01L21/28052 ,  H01L21/823835 ,  H01L21/823842 ,  H01L21/82385 ,  H01L29/4933 ,  H01L29/517 ,  H01L29/665 ,  H01L29/7843 ,  H01L29/7845

摘要： The channels of first and second CMOS transistors can be selectively stressed. A gate structure of the first transistor includes a stressor that produces stress in the channel of the first transistor. A gate structure of the second transistor is disposed in contact with a layer of material that produces stress in the channel of the second transistor.

摘要翻译： 第一和第二CMOS晶体管的通道可以选择性地受到压力。 第一晶体管的栅极结构包括在第一晶体管的沟道中产生应力的应力源。 第二晶体管的栅极结构设置成与在第二晶体管的沟道中产生应力的材料层接触。

公开(公告)号：US07466008B2

公开(公告)日：2008-12-16

申请号：US11717484

申请日：2007-03-13

申请人： Chih-Hsin Ko ,  Tzu-Juei Wang ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

发明人： Chih-Hsin Ko ,  Tzu-Juei Wang ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

IPC分类号： H01L27/06 ,  H01L27/07

CPC分类号： H01L21/8249 ,  H01L21/823807 ,  H01L27/0623 ,  H01L29/7843

摘要： A BiCMOS device with enhanced performance by mechanical uniaxial strain is provided. A first embodiment of the present invention includes an NMOS transistor, a PMOS transistor, and a bipolar transistor formed on different areas of the substrate. A first contact etch stop layer with tensile stress is formed over the NMOS transistor, and a second contact etch stop layer with compressive stress is formed over the PMOS transistor and the bipolar transistor, allowing for an enhancement of each device. Another embodiment has, in addition to the stressed contact etch stop layers, strained channel regions in the PMOS transistor and the NMOS transistor, and a strained base in the BJT.

摘要翻译： 提供了通过机械单轴应变增强性能的BiCMOS器件。 本发明的第一实施例包括形成在衬底的不同区域上的NMOS晶体管，PMOS晶体管和双极晶体管。 具有拉伸应力的第一接触蚀刻停止层形成在NMOS晶体管上，并且在PMOS晶体管和双极晶体管上形成具有压应力的第二接触蚀刻停止层，从而允许每个器件的增强。 除了应力接触蚀刻停止层之外，另一实施例还包括PMOS晶体管和NMOS晶体管中的应变通道区域以及BJT中的应变基极。

公开(公告)号：US20080191285A1

公开(公告)日：2008-08-14

申请号：US11704402

申请日：2007-02-09

申请人： Chih-Hsin Ko ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

发明人： Chih-Hsin Ko ,  Hung-Wei Chen ,  Chung-Hu Ke ,  Wen-Chin Lee

IPC分类号： H01L29/78 ,  H01L21/8238

CPC分类号： H01L21/823814 ,  H01L29/1054 ,  H01L29/165 ,  H01L29/47 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/66568 ,  H01L29/6659 ,  H01L29/66643 ,  H01L29/7843

摘要： A semiconductor structure includes a semiconductor substrate, and an NMOS device at a surface of the semiconductor substrate, wherein the NMOS device comprises a Schottky source/drain extension region. The semiconductor structure further includes a PMOS device at the surface of the semiconductor substrate, wherein the PMOS device comprises a source/drain extension region comprising only non-metal materials. Schottky source/drain extension regions may be formed for both PMOS and NMOS devices, wherein the Schottky barrier height of the PMOS device are reduced by forming the PMOS device over a semiconductor layer having a low valence band.

摘要翻译： 半导体结构包括半导体衬底和在半导体衬底的表面处的NMOS器件，其中NMOS器件包括肖特基源极/漏极延伸区域。 半导体结构还包括在半导体衬底的表面处的PMOS器件，其中PMOS器件包括仅包含非金属材料的源极/漏极延伸区域。 可以为PMOS器件和NMOS器件形成肖特基源极/漏极延伸区域，其中通过在具有低价带的半导体层上形成PMOS器件来减小PMOS器件的肖特基势垒高度。

公开(公告)号：US20070267694A1

公开(公告)日：2007-11-22

申请号：US11438711

申请日：2006-05-22

申请人： Chih-Hsin Ko ,  Chung-Hu Ke ,  Hung-Wei Chen ,  Wen-Chin Lee

发明人： Chih-Hsin Ko ,  Chung-Hu Ke ,  Hung-Wei Chen ,  Wen-Chin Lee

IPC分类号： H01L29/76

CPC分类号： H01L29/6656 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7843

摘要： A MOS device having optimized stress in the channel region and a method for forming the same are provided. The MOS device includes a gate over a substrate, a gate spacer on a sidewall of the gate wherein a non-silicide region exists under the gate spacer, a source/drain region comprising a recess in the substrate, and a silicide region on the source/drain region. A step height is formed between a higher portion of the silicide region and a lower portion of the silicide region. The recess is spaced apart from a respective edge of a non-silicide region by a spacing. The step height and the spacing preferably have a ratio of less than or equal to about 3. The width of the non-silicide region and the step height preferably have a ratio of less than or equal to about 3. The MOS device is preferably an NMOS device.

摘要翻译： 提供了在通道区​​域中具有优化的应力的MOS器件及其形成方法。 MOS器件包括在衬底上的栅极，栅极侧壁上的栅极间隔物，其中在栅极间隔物下方存在非硅化物区域，在衬底中包含凹陷的源极/漏极区域和源极上的硅化物区域 /漏区。 在硅化物区域的较高部分和硅化物区域的下部之间形成台阶高度。 凹槽与非硅化物区域的相应边缘间隔一定距离。 台阶高度和间距优选具有小于或等于约3的比率。非硅化物区域的宽度和台阶高度优选具有小于或等于约3的比率。MOS器件优选为 NMOS器件。