公开(公告)号：US08757845B2

公开(公告)日：2014-06-24

申请号：US13194538

申请日：2011-07-29

Applicant: Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Sheng-Shin Guo ,  Pei-Wen Ko ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Sheng-Shin Guo ,  Pei-Wen Ko ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: F21V7/07

CPC classification number: F21K9/50 ,  F21K9/60 ,  F21K9/90 ,  F21V3/02 ,  F21V3/0625 ,  F21V5/008 ,  F21V5/04 ,  F21V7/0091 ,  F21V29/77 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/58 ,  H01L2933/0091 ,  Y10T29/49826

Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.

Abstract translation: 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管（LED）装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖，其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。

公开(公告)号：US20120088397A1

公开(公告)日：2012-04-12

申请号：US12899999

申请日：2010-10-07

Applicant: Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: H01R43/24 ,  H01R43/18 ,  B29C45/14 ,  H01R13/00

CPC classification number: B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

公开(公告)号：US20120287635A1

公开(公告)日：2012-11-15

申请号：US13557315

申请日：2012-07-25

Applicant: Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: F21V29/00 ,  F21V31/00 ,  F21V5/04

CPC classification number: B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

公开(公告)号：US08905600B2

公开(公告)日：2014-12-09

申请号：US13273850

申请日：2011-10-14

Applicant: Chih-Hsuan Sun ,  Hsiao-Wen Lee

Inventor： Chih-Hsuan Sun ,  Hsiao-Wen Lee

IPC: F21V29/02 ,  F21K99/00 ,  F21V29/00 ,  F21V3/00 ,  F21Y101/02

CPC classification number: F21K9/232 ,  F21K9/90 ,  F21V3/00 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  Y10T29/49117

Abstract: A Light-Emitting Diode (LED) lamp includes a heat sink with a number of passive air flow ducts defined at least partially by fins of the heat sink and a cover plate over the fins. The heat sink includes a body with a cavity, a number of fins radiating outwards from the body, and a cover plate covering the fins. Each passive air flow duct includes top and bottom openings for air flow.

Abstract translation: 发光二极管（LED）灯包括散热器，其具有至少部分地由散热器的鳍片限定的多个被动空气流动管道和鳍片上方的盖板。 散热器包括具有空腔的主体，从主体向外辐射的多个翅片以及覆盖翅片的盖板。 每个被动气流管道包括用于空气流动的顶部和底部开口。

公开(公告)号：US08591251B2

公开(公告)日：2013-11-26

申请号：US13557315

申请日：2012-07-25

Applicant: Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: H01R13/00

CPC classification number: B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

公开(公告)号：US20130027946A1

公开(公告)日：2013-01-31

申请号：US13194538

申请日：2011-07-29

Applicant: Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Sheng-Shin Guo ,  Pei-Wen Ko ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Chi Xiang Tseng ,  Hsiao-Wen Lee ,  Sheng-Shin Guo ,  Pei-Wen Ko ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: F21V5/04 ,  B23P11/00 ,  F21V29/00

CPC classification number: F21K9/50 ,  F21K9/60 ,  F21K9/90 ,  F21V3/02 ,  F21V3/0625 ,  F21V5/008 ,  F21V5/04 ,  F21V7/0091 ,  F21V29/77 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/58 ,  H01L2933/0091 ,  Y10T29/49826

Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.

Abstract translation: 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管（LED）装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖，其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。

公开(公告)号：US08257110B2

公开(公告)日：2012-09-04

申请号：US12899999

申请日：2010-10-07

Applicant: Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: H01R4/24

CPC classification number: B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

公开(公告)号：US08702278B2

公开(公告)日：2014-04-22

申请号：US13326766

申请日：2011-12-15

Applicant: Jin-Hua Wang ,  Hsueh-Hung Fu ,  Pei-Wen Ko ,  Chih-Hsuan Sun

Inventor： Jin-Hua Wang ,  Hsueh-Hung Fu ,  Pei-Wen Ko ,  Chih-Hsuan Sun

IPC: F21V29/00

CPC classification number: F21V17/02 ,  F21K9/20 ,  F21K9/60 ,  F21V5/007 ,  F21V13/04 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21V29/83 ,  F21W2131/103 ,  F21Y2101/00 ,  F21Y2113/00 ,  F21Y2115/10 ,  Y02B20/72

Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.

Abstract translation: 本公开涉及路灯。 路灯包括基座，连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。

公开(公告)号：US20130148346A1

公开(公告)日：2013-06-13

申请号：US13313153

申请日：2011-12-07

Applicant: Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu ,  Dong Jung Suen

Inventor： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu ,  Dong Jung Suen

IPC: F21V29/00 ,  F21V7/00

CPC classification number: F21K9/60 ,  B05D5/061 ,  B05D5/063 ,  F21K9/20 ,  F21K9/232 ,  F21K9/66 ,  F21V3/049 ,  F21V3/0625 ,  F21V3/10 ,  F21V7/0016 ,  F21V29/74 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2115/10

Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

Abstract translation: 本公开提供一种照明装置。 照明装置包括盖结构。 盖结构部分地涂覆有可反射光的反射材料。 照明装置包括设置在盖结构内的一个或多个发光装置。 发光装置可以是发光二极管（LED）芯片。 照明装置还包括散热结构。 散热结构在第一方向上连接到盖结构。 散热结构和盖结构具有耦合接口。 联接接口在基本上垂直于第一方向的第二方向上延伸。 散热结构具有以一定角度与耦合接口相交的部分。 根据一些实施例，该角度在约60度至约90度的范围内。

公开(公告)号：US20120299019A1

公开(公告)日：2012-11-29

申请号：US13117320

申请日：2011-05-27

Applicant: Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

Inventor： Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: H01L33/52 ,  H01L21/52

CPC classification number: H01L33/58 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

Abstract translation: 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。