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公开(公告)号:US08702278B2
公开(公告)日:2014-04-22
申请号:US13326766
申请日:2011-12-15
申请人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
发明人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
IPC分类号: F21V29/00
CPC分类号: F21V17/02 , F21K9/20 , F21K9/60 , F21V5/007 , F21V13/04 , F21V29/74 , F21V29/75 , F21V29/763 , F21V29/83 , F21W2131/103 , F21Y2101/00 , F21Y2113/00 , F21Y2115/10 , Y02B20/72
摘要: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.
摘要翻译: 本公开涉及路灯。 路灯包括基座,连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。
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公开(公告)号:US20130155673A1
公开(公告)日:2013-06-20
申请号:US13326766
申请日:2011-12-15
申请人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
发明人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
CPC分类号: F21V17/02 , F21K9/20 , F21K9/60 , F21V5/007 , F21V13/04 , F21V29/74 , F21V29/75 , F21V29/763 , F21V29/83 , F21W2131/103 , F21Y2101/00 , F21Y2113/00 , F21Y2115/10 , Y02B20/72
摘要: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.
摘要翻译: 本公开涉及路灯。 路灯包括基座,连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。
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公开(公告)号:US09006770B2
公开(公告)日:2015-04-14
申请号:US13110642
申请日:2011-05-18
申请人: Wei-Yu Yeh , Pei-Wen Ko , Chih-Hsuan Sun , Hsueh-Hung Fu
发明人: Wei-Yu Yeh , Pei-Wen Ko , Chih-Hsuan Sun , Hsueh-Hung Fu
CPC分类号: H01L33/641 , H01L33/62 , H01L2924/0002 , H01L2933/0075 , H05K1/0203 , H05K1/0206 , H05K1/05 , H05K2201/10106 , H05K2201/10969 , H01L2924/00
摘要: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.
摘要翻译: 发光二极管(LED)载体组件包括安装在硅基座上的LED管芯,设置在硅基座下方的导热和电隔离的中间层以及设置在中间层下方的印刷电路板(PCB)。 中间层与硅基座和PCB结合。
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公开(公告)号:US20130094180A1
公开(公告)日:2013-04-18
申请号:US13275550
申请日:2011-10-18
申请人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
发明人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
CPC分类号: F21V3/12 , F21K9/232 , F21K9/60 , F21V3/02 , F21V3/062 , F21V3/10 , F21V5/04 , F21V7/22 , F21V13/02 , F21V29/75 , F21V29/773 , F21Y2115/10 , Y10T29/49885
摘要: The present disclosure provides an illumination device. The illumination device includes a light emitting device (LED) on a substrate. A heat sink is thermally connected to the LED device. A cap is secured over the substrate and covers the LED device. The cap includes a coating material that comprises both diffusion and reflection characteristics.
摘要翻译: 本公开提供一种照明装置。 照明装置包括在基板上的发光装置(LED)。 散热片与LED器件热连接。 盖子固定在基板上并覆盖LED装置。 盖包括包括扩散和反射特性的涂层材料。
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公开(公告)号:US09222640B2
公开(公告)日:2015-12-29
申请号:US13275550
申请日:2011-10-18
申请人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
发明人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
IPC分类号: F21V9/16 , F21V3/04 , F21V3/02 , F21V7/22 , F21K99/00 , F21V29/75 , F21V29/77 , F21V5/04 , F21Y101/02 , F21V13/02
CPC分类号: F21V3/12 , F21K9/232 , F21K9/60 , F21V3/02 , F21V3/062 , F21V3/10 , F21V5/04 , F21V7/22 , F21V13/02 , F21V29/75 , F21V29/773 , F21Y2115/10 , Y10T29/49885
摘要: The present disclosure provides an illumination device. The illumination device comprises a light-emitting diode (LED) device on a substrate, a heat sink and a cap. The heat sink is thermally connected to the LED device. The cap is secured over the substrate and covering the LED device. The cap includes a coating material having diffusion and reflection characteristics, and the coating material is free of being in direct contact with the LED device. The coating material is applied on a first portion of an inner surface of the cap, but not on a second portion of the inner surface of the cap.
摘要翻译: 本公开提供一种照明装置。 照明装置包括在基板上的发光二极管(LED)装置,散热器和盖。 散热器与LED器件热连接。 盖子固定在基板上并覆盖LED装置。 盖包括具有扩散和反射特性的涂层材料,并且涂层材料不与LED装置直接接触。 涂层材料施加在盖的内表面的第一部分上,而不是在盖的内表面的第二部分上。
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公开(公告)号:US20130148346A1
公开(公告)日:2013-06-13
申请号:US13313153
申请日:2011-12-07
申请人: Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
发明人: Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
CPC分类号: F21K9/60 , B05D5/061 , B05D5/063 , F21K9/20 , F21K9/232 , F21K9/66 , F21V3/049 , F21V3/0625 , F21V3/10 , F21V7/0016 , F21V29/74 , F21V29/773 , F21Y2101/00 , F21Y2115/10
摘要: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.
摘要翻译: 本公开提供一种照明装置。 照明装置包括盖结构。 盖结构部分地涂覆有可反射光的反射材料。 照明装置包括设置在盖结构内的一个或多个发光装置。 发光装置可以是发光二极管(LED)芯片。 照明装置还包括散热结构。 散热结构在第一方向上连接到盖结构。 散热结构和盖结构具有耦合接口。 联接接口在基本上垂直于第一方向的第二方向上延伸。 散热结构具有以一定角度与耦合接口相交的部分。 根据一些实施例,该角度在约60度至约90度的范围内。
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公开(公告)号:US08668366B2
公开(公告)日:2014-03-11
申请号:US13313153
申请日:2011-12-07
申请人: Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
发明人: Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
IPC分类号: F21V7/00
CPC分类号: F21K9/60 , B05D5/061 , B05D5/063 , F21K9/20 , F21K9/232 , F21K9/66 , F21V3/049 , F21V3/0625 , F21V3/10 , F21V7/0016 , F21V29/74 , F21V29/773 , F21Y2101/00 , F21Y2115/10
摘要: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.
摘要翻译: 本公开提供一种照明装置。 照明装置包括盖结构。 盖结构部分地涂覆有可反射光的反射材料。 照明装置包括设置在盖结构内的一个或多个发光装置。 发光装置可以是发光二极管(LED)芯片。 照明装置还包括散热结构。 散热结构在第一方向上连接到盖结构。 散热结构和盖结构具有耦合接口。 联接接口在基本上垂直于第一方向的第二方向上延伸。 散热结构具有以一定角度与耦合接口相交的部分。 根据一些实施例,该角度在约60度至约90度的范围内。
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公开(公告)号:US20120113639A1
公开(公告)日:2012-05-10
申请号:US12940151
申请日:2010-11-05
申请人: Hsiao-Wen Lee , Hsueh-Hung Fu , Jin-Hua Wang , Chien-Liang Yeh
发明人: Hsiao-Wen Lee , Hsueh-Hung Fu , Jin-Hua Wang , Chien-Liang Yeh
CPC分类号: F21V29/006 , F21V19/0055 , F21V23/02 , F21V29/507 , F21V29/51 , F21V29/70 , F21Y2115/10
摘要: The present disclosure relates to light emitting diode (LED) devices and methods for fabricating the same. An LED device includes a housing adapted to combine a heat sink with a vapor chamber to form an enclosed space interposed therebetween. The LED device includes light emitting diode modules attached to the housing adjacent to the vapor chamber. The vapor chamber is adapted to uniformly disperse heat generated from the LED modules within the enclosed space to form a uniform temperature field on the heat sink to thereby provide effective heat dissipation.
摘要翻译: 本发明涉及发光二极管(LED)器件及其制造方法。 LED装置包括适于将散热器与蒸气室组合以形成插入其间的封闭空间的壳体。 LED装置包括附接到壳体的发光二极管模块,其邻近蒸气室。 蒸汽室适于将LED模块产生的热均匀地分散在封闭空间内,以在散热器上形成均匀的温度场,从而提供有效的散热。
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公开(公告)号:US08529098B2
公开(公告)日:2013-09-10
申请号:US12940151
申请日:2010-11-05
申请人: Hsiao-Wen Lee , Hsueh-Hung Fu , Jin-Hua Wang , Chien-Liang Yeh
发明人: Hsiao-Wen Lee , Hsueh-Hung Fu , Jin-Hua Wang , Chien-Liang Yeh
IPC分类号: F21V29/00
CPC分类号: F21V29/006 , F21V19/0055 , F21V23/02 , F21V29/507 , F21V29/51 , F21V29/70 , F21Y2115/10
摘要: The present disclosure relates to light emitting diode (LED) devices and methods for fabricating the same. An LED device includes a housing adapted to combine a heat sink with a vapor chamber to form an enclosed space interposed therebetween. The LED device includes light emitting diode modules attached to the housing adjacent to the vapor chamber. The vapor chamber is adapted to uniformly disperse heat generated from the LED modules within the enclosed space to form a uniform temperature field on the heat sink to thereby provide effective heat dissipation.
摘要翻译: 本发明涉及发光二极管(LED)器件及其制造方法。 LED装置包括适于将散热器与蒸气室组合以形成插入其间的封闭空间的壳体。 LED装置包括附接到壳体的发光二极管模块,其邻近蒸气室。 蒸汽室适于将LED模块产生的热均匀地分散在封闭空间内,以在散热器上形成均匀的温度场,从而提供有效的散热。
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公开(公告)号:US20120293782A1
公开(公告)日:2012-11-22
申请号:US13564085
申请日:2012-08-01
申请人: Hsiao-Tzu Lu , Hung Chang Hsieh , Kuei Shun Chen , Hsueh-Hung Fu , Ching-Hua Hsieh , Shau-Lin Shue
发明人: Hsiao-Tzu Lu , Hung Chang Hsieh , Kuei Shun Chen , Hsueh-Hung Fu , Ching-Hua Hsieh , Shau-Lin Shue
IPC分类号: G03B27/42
CPC分类号: G03F7/70725 , G03F7/70358 , G03F7/70783 , H01L21/67288
摘要: Methods and systems for lithographically exposing a substrate based on a curvature profile of the substrate.
摘要翻译: 基于基板的曲率轮廓光刻曝光基板的方法和系统。
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