Mask reduction of LPTS-TFT array by use of photo-sensitive low-K dielectrics
    2.
    发明申请
    Mask reduction of LPTS-TFT array by use of photo-sensitive low-K dielectrics 有权
    通过使用光敏低K电介质来降低LPTS-TFT阵列的掩模

    公开(公告)号:US20060099746A1

    公开(公告)日:2006-05-11

    申请号:US10984792

    申请日:2004-11-10

    IPC分类号: H01L21/84

    摘要: The present invention discloses a method of mask reduction of low-temperature polysilicon thin film transistor array by use of photo-sensitive low-K dielectric, which comprises the steps of: defining a polysilicon-island on a preprocessed glass substrate; forming a gate oxide layer and a first metal layer in sequence; patterning the first metal layer to define a gate; forming a photosensitive dielectric layer; patterning the photosensitive dielectric layer and the gate oxide layer to form a plurality of contact holes; forming a transmissive pixel layer and patterning the same; and forming a reflective pixel electrode layer and patterning the same.

    摘要翻译: 本发明公开了一种通过使用光敏低K电介质来降低低温多晶硅薄膜晶体管阵列的方法,该方法包括以下步骤:在预处理的玻璃基板上限定多晶硅岛; 依次形成栅氧化层和第一金属层; 图案化第一金属层以限定栅极; 形成光敏介电层; 图案化光敏电介质层和栅极氧化物层以形成多个接触孔; 形成透射像素层并对其进行图案化; 并形成反射像素电极层并对其进行图案化。

    Optical coating equipment and ultraviolet irradiative device
    3.
    发明申请
    Optical coating equipment and ultraviolet irradiative device 有权
    光学镀膜设备和紫外线照射装置

    公开(公告)号:US20070176127A1

    公开(公告)日:2007-08-02

    申请号:US11410655

    申请日:2006-04-25

    IPC分类号: G01J3/10

    CPC分类号: B05D3/067

    摘要: An optical coating equipment, which includes a delivery device, a coater head, and an ultraviolet irradiative device. The delivery device delivers a film. A liquid coating is coated on the film by the coater head. The ultraviolet irradiative-device includes a board assembly. When the coated film is delivered through the ultraviolet irradiative device, irradiative dose is controlled by the board assembly of the ultraviolet irradiative device.

    摘要翻译: 一种光学涂层设备,其包括输送装置,涂布机头和紫外线照射装置。 输送装置传送胶卷。 通过涂布机头将液体涂层涂覆在膜上。 紫外线照射装置包括板组件。 当涂膜通过紫外线照射装置传送时,照射剂量由紫外线照射装置的板组件控制。

    Integral thermo-press molding complex brassiere cup structure
    4.
    发明申请
    Integral thermo-press molding complex brassiere cup structure 失效
    整体热压成型复合胸罩杯结构

    公开(公告)号:US20060160468A1

    公开(公告)日:2006-07-20

    申请号:US11034881

    申请日:2005-01-14

    申请人: Chin Chen

    发明人: Chin Chen

    IPC分类号: A41C3/10

    CPC分类号: A41C5/005 A41C3/146

    摘要: The present invention discloses an integral thermo-press complex brassiere cup structure which comprises an external lining body, an internal lining body, a bag, bag covering layer coupled on the surface of the bag and made of a soft poor conductor, and a material adhering layer disposed at the attaching surface of the internal and external lining bodies. The material adhering layer adheres the surface of the bag covering layer at an appropriate position between the internal and external lining bodies, and places both internal and external lining bodies into a high-temperature thermo-press mold for an integral molding process. The heat produced by the high-temperature mold is conducted through the internal and external lining bodies and delayed or blocked by the bag covering layer as to weaken the heat conducted to the bag. The bag covering layer restricts the extent of deformation of the bag due to the thermal expansion and avoids cracking due to the melting or deformation of the bag during the thermo-press molding of the brassiere cup structure to assure the integrity of the bag and further improve the yield rate of the product.

    摘要翻译: 本发明公开了一种整体热压复合胸罩杯结构,其包括外衬体,内衬体,袋,袋覆盖层,其耦合在袋的表面上,由软的不良导体制成, 层设置在内部和外部衬里体的附接表面。 材料粘合层将袋子覆盖层的表面粘附在内部和外部衬里体之间的适当位置,并将内部和外部衬里体放置在高温热压模具中用于整体模制过程。 由高温模具产生的热量通过内部和外部衬里体进行,并被袋子覆盖层延迟或阻塞,以减弱传导到袋子的热量。 袋子覆盖层由于热膨胀而限制袋的变形程度,并且避免了在胸罩杯结构的热压成型期间由于袋的熔化或变形引起的开裂,以确保袋的完整性并进一步改善 产品的产率。

    MOTOR STRUCTURE
    5.
    发明申请
    MOTOR STRUCTURE 有权
    电机结构

    公开(公告)号:US20060197392A1

    公开(公告)日:2006-09-07

    申请号:US11069519

    申请日:2005-03-02

    申请人: Ching Yang Chin Chen

    发明人: Ching Yang Chin Chen

    摘要: A motor structure comprises a rotor having a driving portion and a magnetic element; the magnetic element being assembled to a lower end of the driving portion; and a stator including an electrode sheet, a coil, and a seat; the coil winding around a stator flame assembling the seat; a magnetic induction portion being protruded from the electrode sheet; and the electrode sheet being installed to the seat. The rotor is pivotally installed to the stator and the magnetic induction portion of the electrode sheet is arranged corresponding to the magnetic element so that after conduction, the coil is interacted with the magnetic element by using phase differences therebetween.

    摘要翻译: 电机结构包括具有驱动部分和磁性元件的转子; 所述磁性元件被组装到所述驱动部分的下端; 以及包括电极片,线圈和座的定子; 线圈缠绕在定子火焰上组装座椅; 磁感应部分从电极片突出; 电极片安装在座椅上。 转子枢转地安装到定子上,电极片的磁感应部分对应于磁性元件设置,使得在导电之后,线圈通过使用它们之间的相位差与磁性元件相互作用。

    Direct type backlight unit having liftable frame structure
    6.
    发明申请
    Direct type backlight unit having liftable frame structure 有权
    具有可升降框架结构的直型背光单元

    公开(公告)号:US20050088839A1

    公开(公告)日:2005-04-28

    申请号:US10975668

    申请日:2004-10-29

    申请人: Hsin Huang Chin Chen

    发明人: Hsin Huang Chin Chen

    摘要: A direct type backlight unit having liftable frame structure comprises a housing, an upper frame and a plurality of lamps, wherein the plurality of lamps disposed on a cavity defined by the housing and at least one has a foggy region; the upper frame is configured to accommodate a plurality of optical films and a liquid crystal panel and has two clip members for engaging with two connection hole of the housing such that the upper frame can be easily fixed on the housing. A plurality of lamp connection units are disposed within the cavity and each comprises a conductive clamp member for clamping the conductive electrode of the lamp, thereby facilitating the replacement of the lamps.

    摘要翻译: 具有可升降框架结构的直立型背光单元包括壳体,上框架和多个灯,其中设置在由壳体限定的空腔中的多个灯具具有雾区域; 上框架被配置为容纳多个光学膜和液晶面板,并且具有用于与壳体的两个连接孔接合的两个夹子构件,使得上框架可以容易地固定在壳体上。 多个灯连接单元设置在腔内,并且每个灯连接单元包括用于夹持灯的导电电极的导电夹持构件,从而便于更换灯。

    Heat dissipating assembly with composite heat dissipating structure
    7.
    发明申请
    Heat dissipating assembly with composite heat dissipating structure 审中-公开
    具有复合散热结构的散热组件

    公开(公告)号:US20060219386A1

    公开(公告)日:2006-10-05

    申请号:US11187942

    申请日:2005-07-25

    申请人: Alex Hsia Chin Chen

    发明人: Alex Hsia Chin Chen

    IPC分类号: H05K7/20

    摘要: A heat dissipating assembly includes a fan and a composite heat dissipating structure. The composite heat dissipating structure includes a first heat sink and a second heat sink disposed adjacent to the first heat sink. The first and the second heat sinks include a plurality of first fins and a plurality of second fins respectively. The arrangement of the first fins is different from that of the second fins so as to flexibly regulate heat dissipation. Also, the fan dissipates heat accumulated in the composite heat dissipating structure and facilitates heat transmitted by the composite heat dissipating structure to dissipate more efficiently.

    摘要翻译: 散热组件包括风扇和复合散热结构。 复合散热结构包括第一散热器和邻近第一散热器设置的第二散热器。 第一和第二散热器分别包括多个第一散热片和多个第二散热片。 第一散热片的布置与第二散热片的布置不同,以便灵活地调节散热。 此外,风扇散发积聚在复合散热结构中的热量,并且便于由复合散热结构传播的热量以更有效地散发。

    Heat dissipation device incorporating fan duct
    9.
    发明申请
    Heat dissipation device incorporating fan duct 失效
    散热装置结合风扇导管

    公开(公告)号:US20050041392A1

    公开(公告)日:2005-02-24

    申请号:US10901611

    申请日:2004-07-28

    申请人: Chin Chen

    发明人: Chin Chen

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20727

    摘要: A heat dissipation device includes two heat sinks (30) mounted on two electronic components (16) which is mounted within a server (10), two fans (40) mounted on a mounting plate (14) of the server facing the heat sinks for blowing cooling air to the heat sinks, and a fan duct (20). The fan duct includes a top plate (24), a pair of side plates (22) extending from opposite sides of the top plate, a pair of partition walls (26) extending from a middle portion of the top plate, and a stop wall (264) connected between ends of the partition walls. The fan duct is hermetically connected to the mounting plate and the bottom plate thereby cooperatively forming a sealed passage therebetween. The passage includes an inlet (28) adjacent the fans and two separate outlets (29) between the side plates and the partition walls respectively for accommodating the heat sinks therein.

    摘要翻译: 散热装置包括安装在安装在服务器(10)内的两个电子部件(16)上的两个散热器(30),安装在面向散热器的服务器的安装板(14)上的两个风扇(40) 将冷却空气吹向散热器,以及风扇导管(20)。 风扇导管包括顶板(24),从顶板的相对侧延伸的一对侧板(22),从顶板的中间部分延伸的一对分隔壁(26)和止动壁 (264)连接在分隔壁的端部之间。 风扇导管与安装板和底板气密连接,从而在其间形成密封通道。 通道包括与风扇相邻的入口(28)和分别在侧板和分隔壁之间的两个分开的出口(29),用于容纳散热器。