摘要:
A notebook computer includes a host and a display device. The display device includes a casing and a liquid crystal display module. The casing is pivoted to the host. The liquid crystal display module includes a back cover, a light guide plate, a liquid crystal panel, a light source, and an antenna. The back cover is disposed in the casing. The light guide plate is disposed on and supported by the back cover. The liquid crystal panel is disposed on and supported by the back cover, and the light guide plate is located between the back cover and the liquid crystal panel. The light source is disposed on a side surface of the light guide plate. The antenna is integrally connected to the back cover.
摘要:
An anti punch-through leakage current MOS transistor and a manufacturing method thereof are provided. A high voltage deep first type well region and a first type light doping region are formed in a second type substrate. A mask with a dopant implanting opening is formed on the second type substrate. An anti punch-through leakage current structure is formed by implanting the first type dopant through the dopant implanting opening. A doping concentration of the first type dopant of the high voltage deep first type well region is less than that of the anti punch-through leakage current structure and greater than that of the high voltage deep first type well region. A second type body is formed by implanting a second type dopant through the dopant implanting opening. A gate structure is formed on the second type substrate.
摘要:
An anti punch-through leakage current MOS transistor and a manufacturing method thereof are provided. A high voltage deep first type well region and a first type light doping region are formed in a second type substrate. A mask with a dopant implanting opening is formed on the second type substrate. An anti punch-through leakage current structure is formed by implanting the first type dopant through the dopant implanting opening. A doping concentration of the first type dopant of the high voltage deep first type well region is less than that of the anti punch-through leakage current structure and greater than that of the high voltage deep first type well region. A second type body is formed by implanting a second type dopant through the dopant implanting opening. A gate structure is formed on the second type substrate.
摘要:
A method of fabricating a semiconductor device utilizes a substrate including a high voltage circuit area, a medium voltage circuit area and a low voltage circuit area. A first well of a first conductivity type is formed. Two separate second wells of a second conductivity type are formed in the first well and two separate isolation structures are formed respectively in the second wells in each of the high voltage circuit area and the medium voltage circuit area. A first gate dielectric layer is formed in the high voltage circuit area. A second gate dielectric layer that is thinner than the first gate dielectric layer is formed in each of the medium voltage circuit area and the low voltage circuit area. A gate is formed. Two source and drain regions of the second conductivity type are respectively formed. The method is simple and low-cost and meets the market requirement.
摘要:
The present invention pertains to a high-voltage MOS device. The high-voltage MOS device includes a substrate, a first well, a first field oxide layer enclosing a drain region, a second field oxide enclosing a source region, and a third field oxide layer encompassing the first and second field layers with a device isolation region in between. A channel region is situated between the first and second field oxide layers. A gate oxide layer is provided on the channel region. A gate is stacked on the gate oxide layer. A device isolation diffusion layer is provided in the device isolation region.
摘要:
A solder spray jig includes: a main body having an opening acting as a spray outlet for solder, and recesses formed on two opposite sides of the main body and communicating with the spray outlet; a movable unit disposed on each of the two opposite sides of the main body, for covering and exposing a corresponding one of the recesses; and a driving device mounted to the movable units, for allowing the movable units to be operationally associated with each other to cover and expose the recesses. The spray outlet of the main body can keep abutting against a mold that covers a circuit board having electronic components when the main body is being moved horizontally in relation to the mold, so as to spray the solder via the spray outlet to effectively fix the electronic components to the circuit board.
摘要:
A heat dissipation device (40) includes at least a heat pipe (45) and a plurality of metal fins (43) thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (431). An extension flange (433) extends outwardly from the metal fin and surrounds the aperture. The extension flange defines therein a plurality of slits (435). The apertures and extension flanges of the metal fins are aligned together. The heat pipe is received in the aligned apertures and soldered by a thermal medium material to the metal fins via the aligned extension flanges. During the soldering process, rosin content contained in the thermal medium material can be discharged away via the slits formed in the extension flange.
摘要:
A grease cover (50) for protecting grease spread on a bottom surface of a heat sink (20) includes a base wall (51), a plurality of sidewalls (52a, 52b, 52c, 52d), a protecting space (53) between the base wall and the sidewalls, a holding space in an upper portion of the protecting space, and two projections (54). The protecting space is for accommodating the grease. The holding space is for receiving the heat sink therein. The projections extend from two opposite sidewalls of the grease cover. A top surface of each of the projections spaces a distance from the base wall, for supporting the bottom surface of the heat sink to enable the grease away from the base wall, when the heat sink is received in the holding space.
摘要:
A temple assembly for a pair of glasses includes a temple, a pivotal member, a positioning member, a bolt mounted in a receptacle of the temple for retaining the positioning member, and an elastic element mounted in the receptacle and between the positioning member and a head of the bolt. An end of the pivotal member is pivotally connected to an end of a frame of a pair of glasses. The other end of the pivotal member is mounted in the receptacle of the temple and has a reduced section. The positioning member is mounted to the second end of the pivotal member and includes a peripheral edge that is deformed and in tight contact with a perimeter wall delimiting the receptacle of the temple. The deformed portion of the peripheral edge of the positioning member is in space above the reduced portion of the pivotal member.
摘要:
An operation method of an interactive service system is disclosed. The method includes the following steps: (1) providing a first menu, wherein the first menu has a plurality of first options arranged in a first array marked by a label selected from the group consisting of a numeral, icon, word and color; (2) selecting one of the first options in the first menu; and (3) providing an interactive service or a next layer menu according to the selected first option.