摘要:
A method and resulting structure for fabricating interconnects through an integrated circuit. The method includes adding more power lines 80, 100, 151 and/or increasing the width of power lines 120 and/or adding a power bus 140 near regions of high current flow. The resulting structure also provides more metallization near regions of high current flow. Similar to the method, the resulting structure may include additional power lines 80, 100, 151 and/or wider power lines 120 and/or a power bus 140 to increase the amount of metallization. An improved routing technique is also provided. Such routing technique includes providing an initial Ucs value and then adding additional lines near high current regions to decrease the Ucs value.
摘要:
A method and resulting structure for fabricating interconnects through an integrated circuit. The method includes adding more power lines 80, 100, 151 and/or increasing the width of power lines 120 and/or adding a power bus 140 near regions of high current flow. The resulting structure also provides more metallization near regions of high current flow. Similar to the method, the resulting structure may include additional power lines 80, 100, 151 and/or wider power lines 120 and/or a power bus 140 to increase the amount of metallization. An improved routing technique is also provided. Such routing technique includes providing an initial Ucs value and then adding additional lines near high current regions to decrease the Ucs value.
摘要:
A method of manufacturing a semiconductor device having a p-type field effect transistor and an n-type field effect transistor includes the steps of: forming an interface insulating layer and a high-permittivity layer on a substrate in the stated order; forming a pattern of a sacrifice layer on the high-permittivity layer; forming a metal-containing film containing metal elements therein on the high-permittivity layer in a first region where the sacrifice layer is formed and a second region where no sacrifice layer is formed; introducing the metal elements into an interface between the interface insulating layer and the high-permittivity layer in the second region by conducting a heat treatment; and removing the sacrifice layer by wet etching, wherein in the removing step, the sacrifice layer is etched easily more than the high-permittivity layer. With this configuration, the semiconductor device excellent in reliability is obtained.
摘要:
A permanent wave treatment apparatus comprises: a housing 3; a blower 1 which is installed within the housing to suck air and blow air; a steam separator 2 which is provided on the blower to remove water content from air sucked by suction force of the blower; an outlet hole formed in the housing through which air is spouted from the blower; hoods F mounted on the housing such that they are capable of being opened/closed freely; a plurality of rods R on which the hair of an object person is to be wound and in which air vent holes are formed; tubes 4 connected to the rods so as to keep the interior of the rods in a negative pressure by the suction force of the blower; and extraction member 5 which holds a plurality of the tubes such that they are capable of being extracted freely.
摘要:
An exhaust gas purification apparatus for an internal combustion engine includes an exhaust passage through which exhaust gas flows, a selective catalytic reduction (SCR) catalyst provided in the exhaust passage, a urea water supply device and a control unit for controlling amount of urea water to be supplied into the exhaust passage upstream of the SCR catalyst at predetermined intervals. The control unit further estimates amount of ammonia converted from adsorbed deposit which is converted from the urea water and adsorbed on the SCR catalyst during the predetermined interval based on a physical quantity of the internal combustion engine or the exhaust gas purification apparatus, and determines amount of urea water to be supplied into the exhaust passage based on the estimated amount of ammonia converted from the adsorbed deposit on the SCR catalyst.
摘要:
A semiconductor device is provided which has a capacitor insulating film made up of zirconium aliminate being an amorphous film obtained by having crystalline dielectric contain amorphous aluminum oxide and having its composition of AlXZr(1-X)OY (0.05≦x≦0.3), hereby being capable of preventing, in a process of forming a capacitor of MIM (Metal Insulator Metal) structure, dielectric breakdown of a capacitor insulating film while a relative dielectric constant of a metal oxide film used as the capacitor insulating film is kept high.
摘要翻译:提供了一种半导体器件,其具有由锆合金制成的电容器绝缘膜,其是通过具有包含无定形氧化铝并且其组成为Al x Zr(1- (0.05 <= x <= 0.3),因此能够在形成MIM(金属绝缘体金属)结构的电容器的过程中防止介电击穿 电容绝缘膜,而用作电容器绝缘膜的金属氧化物膜的相对介电常数保持较高。
摘要:
A semiconductor device is provided which has a capacitor insulating film made up of zirconium aliminate being an amorphous film obtained by having crystalline dielectric contain amorphous aluminum oxide and having its composition of AlXZr(1−X)OY (0.05≦X≦0.3), hereby being capable of preventing, in a process of forming a capacitor of MIM (Metal Insulator Metal) structure, dielectric breakdown of a capacitor insulating film while a relative dielectric constant of a metal oxide film used as the capacitor insulating film is kept high.
摘要翻译:提供了一种半导体器件,其具有由锆合金制成的电容器绝缘膜,其是通过具有包含无定形氧化铝并且其组成为Al x Zr(1- (0.05 <= X <= 0.3),因此在形成MIM(金属绝缘体金属)结构的电容器的工艺中能够防止介电击穿 电容绝缘膜,而用作电容器绝缘膜的金属氧化物膜的相对介电常数保持较高。
摘要:
In a semiconductor device including at least one p-channel type MOS transistor, a silicon dioxide layer is formed on a silicon substrate, and a gate electrode is formed on the silicon dioxide layer. The gate electrode silicon has a three-layered structure including a silicon-seed layer formed on the silicon dioxide layer, a silicon/germanium layer formed on the silicon-seed layer, and a polycrystalline silicon layer on the silicon/germanium layer. An average grain size of polycrystalline silicon in the polycrystalline silicon layer is at most 100 nm, and p-type impurities are substantially uniformly distributed in the gate electrode along a height thereof, and the germanium atoms are diffused from the silicon/germanium layer into the silicon-seed layer at high density.
摘要:
In a semiconductor device including at least one p-channel type MOS transistor, a silicon dioxide layer is formed on a silicon substrate, and a gate electrode is formed on the silicon dioxide layer. The gate electrode silicon has a three-layered structure including a silicon-seed layer formed on the silicon dioxide layer, a silicon/germanium layer formed on the silicon-seed layer, and a polycrystalline silicon layer on the silicon/germanium layer. An average grain size of polycrystalline silicon in the polycrystalline silicon layer is at most 100 nm, and p-type impurities are substantially uniformly distributed in the gate electrode along a height thereof, and the germanium atoms are diffused from the silicon/germanium layer into the silicon-seed layer at high density.
摘要:
A compound represented by the following Formula (I): (wherein A represents oxygen atom or —NR3— (R3 represents hydrogen atom or lower alkyl group); R1 represents nitro group, lower alkoxycarbonyl group, carbamoyl group unsubstituted or mono- or di-substituted by lower alkyl group, unprotected or protected hydroxyl group, unprotected or protected carboxyl group, lower alkyl group substituted by unprotected or protected hydroxyl group, or tetrazolyl group; and R2 represents hydrogen atom, cyano group or lower alkylsulfonyl group, provided that when A is —NR3—, it is excluded that R1 represents unprotected or protected hydroxyl group or lower alkyl group substituted by unprotected or protected hydroxyl group) or its salt, and method for producing the compound, and a pharmaceutical composition containing the compound as active ingredient.