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公开(公告)号:US08759959B2
公开(公告)日:2014-06-24
申请号:US13029736
申请日:2011-02-17
申请人: Choong-Bin Yim , Seung-Kon Mok , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim
发明人: Choong-Bin Yim , Seung-Kon Mok , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim
CPC分类号: H01L25/50 , H01L24/73 , H01L25/105 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2924/00012
摘要: Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.
摘要翻译: 半导体封装包括第一半导体封装,包括第一印刷电路板和安装在第一印刷电路板上的第一半导体器件,以及堆叠在第一半导体封装上的第二半导体封装,并且包括第二印刷电路板和第二半导体 装置安装在第二印刷电路板上。 半导体封装包括至少一个第一通孔,其通过第一半导体器件将第二半导体封装电连接到第一印刷电路板。
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公开(公告)号:US20110215451A1
公开(公告)日:2011-09-08
申请号:US13029736
申请日:2011-02-17
申请人: Choong-Bin Yim , Seung-Kon Mok , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim
发明人: Choong-Bin Yim , Seung-Kon Mok , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim
IPC分类号: H01L25/11
CPC分类号: H01L25/50 , H01L24/73 , H01L25/105 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2924/00012
摘要: Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.
摘要翻译: 半导体封装包括第一半导体封装,包括第一印刷电路板和安装在第一印刷电路板上的第一半导体器件,以及堆叠在第一半导体封装上的第二半导体封装,并且包括第二印刷电路板和第二半导体 装置安装在第二印刷电路板上。 半导体封装包括至少一个第一通孔,其通过第一半导体器件将第二半导体封装电连接到第一印刷电路板。
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公开(公告)号:US20090065949A1
公开(公告)日:2009-03-12
申请号:US12228500
申请日:2008-08-13
申请人: Choong-Bin Yim , Tae-Je Cho
发明人: Choong-Bin Yim , Tae-Je Cho
IPC分类号: H01L23/52
CPC分类号: H01L25/105 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/5389 , H01L2224/48227 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331
摘要: A semiconductor package can include a semiconductor chip, an insulating substrate, first bond fingers, and pads. The insulating substrate can be attached to edge portions of the semiconductor chip. The first bond fingers can be arranged on edge portions of an upper surface of the insulating substrate. Further, the first bond fingers can be electrically connected to the semiconductor chip. The pads can be arranged on a central portion of the upper surface of the insulating substrate. Further, the pads can be electrically connected to the first bond fingers. Thus, types of stackable devices that can be mounted on or in the semiconductor package need not be restricted.
摘要翻译: 半导体封装可以包括半导体芯片,绝缘基板,第一粘合指和焊盘。 绝缘基板可以附接到半导体芯片的边缘部分。 第一接合指可以布置在绝缘基板的上表面的边缘部分上。 此外,第一接合指状物可以电连接到半导体芯片。 焊盘可以布置在绝缘基板的上表面的中心部分上。 此外,焊盘可以电连接到第一焊接指。 因此,不需要限制可以安装在半导体封装中或半导体封装中的可堆叠装置的类型。
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