摘要:
The invention provides an illumination apparatus (10) and a method of assembling the illumination apparatus. The illumination apparatus comprises a light source (101) having a plurality of LED arrays, wherein at least two of the plurality of LED arrays have different lumen degradations as a function of junction temperature of the respective LED arrays; and a heat dissipation unit (102) configured to be capable of dissipating heat generated by the light source, wherein the heat dissipation unit is mounted on a first surface of the light source in such a way that there is a gap between the first surface and the heat dissipation unit when the light source is not in operation, and the gap is narrowed or can be deemed to disappear when the light source reaches a preset temperature, so that the heat dissipation efficiency of the heat dissipation unit is improved.
摘要:
The invention provides an illumination apparatus (10) and a method of assembling the illumination apparatus. The illumination apparatus comprises a light source (101) having a plurality of LED arrays, wherein at least two of the plurality of LED arrays have different lumen degradations as a function of junction temperature of the respective LED arrays; and a heat dissipation unit (102) configured to be capable of dissipating heat generated by the light source, wherein the heat dissipation unit is mounted on a first surface of the light source in such a way that there is a gap between the first surface and the heat dissipation unit when the light source is not in operation, and the gap is narrowed or can be deemed to disappear when the light source reaches a preset temperature, so that the heat dissipation efficiency of the heat dissipation unit is improved.
摘要:
There is provided a lighting device 100 comprising a light source, a driver arranged for powering the light source, which is separated in space from the light source. The lighting device has two separate heat sinks, a light source heat sink 112 to which the light source is thermally coupled, and a driver heat sink 115 to which the driver is thermally coupled. The light source heat sink and the driver heat sink are separated by an air gap 114 to provide thermal decoupling of the light source heat sink and the driver heat sink.
摘要:
There is provided a lighting device 100 comprising a light source, a driver arranged for powering the light source, which is separated in space from the light source. The lighting device has two separate heat sinks, a light source heat sink 112 to which the light source is thermally coupled, and a driver heat sink 115 to which the driver is thermally coupled. The light source heat sink and the driver heat sink are separated by an air gap 114 to provide thermal decoupling of the light source heat sink and the driver heat sink.
摘要:
Methods and systems for generating an inspection process for a wafer are provided. One computer-implemented method includes separately determining a value of a local attribute for different locations within a design for a wafer based on a defect that can cause at least one type of fault mechanism at the different locations. The method also includes determining a sensitivity with which defects will be reported for different locations on the wafer corresponding to the different locations within the design based on the value of the local attribute. In addition, the method includes generating an inspection process for the wafer based on the determined sensitivity. Groups may be generated based on the value of the local attribute thereby assigning pixels that will have at least similar noise statistics to the same group, which can be important for defect detection algorithms. Better segmentation may lead to better noise statistics estimation.
摘要:
A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.
摘要:
A housing of electronic product includes an accommodating space and at least one heat dissipating opening, wherein the heat dissipating opening is formed on an upper surface of the housing so as to allow a heat dissipating device received in the accommodating space to dissipate heat generated by operation of electronic components received in the accommodating space to improve heat dissipating efficiency.
摘要:
The present invention discloses a method and system for transferring TDM services in GPON, the method includes the steps of: in the case of performing the GPON ranging process, buffering the uplink TDM service data received by an optical signal transceiver in an Input Buffer, reading out and transferring the uplink TDM service data buffered in an Output Buffer. The present invention eliminates the possible interruption of TDM services during the GPON ranging process by buffering the uplink services at the OLT and ONU/ONT side and relevant processes, and therefore realizes the TDM service transmission without any loss during the GPON system ranging process.
摘要:
A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.
摘要:
A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.