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    Method of making flexible printed circuits
    1.
    发明授权
    Method of making flexible printed circuits 失效
    制造柔性印刷电路的方法

    公开(公告)号：US4411982A

    公开(公告)日：1983-10-25

    申请号：US338907

    申请日：1982-01-12

    申请人： Chuji Shibuya ,  Satoshi Kaneda ,  Takashi Kanehisa ,  Masatoshi Kondo ,  Kenji Nogawa ,  Fumio Hasuike

    发明人： Chuji Shibuya ,  Satoshi Kaneda ,  Takashi Kanehisa ,  Masatoshi Kondo ,  Kenji Nogawa ,  Fumio Hasuike

    IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/28 ,  H05K3/42 ,  G03C5/00

    CPC分类号： H05K3/064 ,  H05K3/0097 ,  H05K3/02 ,  H05K1/0393 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/058 ,  H05K2203/1394 ,  H05K2203/1545 ,  H05K3/0094 ,  H05K3/28 ,  H05K3/427 ,  Y10T29/49155

    摘要： A disclosed method of continuous making flexible printed circuits for use in radio set or the like appliances, includes punching holes in a continuous copper-film clad insulating substrate, forming photopolymer films on the faces of the copper films exposing the photopolymer film to photochemical light of a predetermined pattern, developing the exposed photopolymer film, etching the copper film utilizing remaining parts of the photopolymer film as etching masks, removing the remaining photopolymer films 40 and printing solder-resist films on selected parts. The improvement is to provide and retain selected oblong parts of said conductor metal film disposed on and parallel to longitudinal direction of the continuous substrate by, for example, covering these parts by etching-resist films. The retained oblong parts of the metal film serve to prevent shrinkage of the substrate during the conduct of further manufacturing steps thereby assuring registration of the patterns of the printed circuits and the printed solder-resist films.

    摘要翻译： 公开的连续制造用于无线电设备或类似设备的柔性印刷电路的方法包括在连续的铜膜包覆绝缘基板中的冲孔，在将光聚合物膜暴露的铜膜的表面上形成光聚合物膜， 曝光的光聚合物膜显影，利用剩余部分的光聚合物膜作为蚀刻掩模蚀刻铜膜，除去剩余的光聚合物膜40并在选定的部分上印刷阻焊膜。 改进之处在于通过例如通过抗蚀剂膜覆盖这些部分来提供并保持设置在连续基板的纵向方向上且与其平行的所述导体金属膜的选定的长方形部分。 金属膜的保留的长方形部分用于在进一步制造步骤期间防止基板的收缩，从而确保印刷电路图案和印刷的阻焊膜的配准。