公开(公告)号：US20140012943A1

公开(公告)日：2014-01-09

申请号：US13891200

申请日：2013-05-10

申请人： Chung-Jen Yang ,  Yung-Chih Tsao ,  Shin-Che Feng ,  Ko-Wei Lin ,  Wen-Sheng Chang ,  Chang-Ching Hung ,  Chia-Chun Chang

发明人： Chung-Jen Yang ,  Yung-Chih Tsao ,  Shin-Che Feng ,  Ko-Wei Lin ,  Wen-Sheng Chang ,  Chang-Ching Hung ,  Chia-Chun Chang

IPC分类号： H04L29/08

CPC分类号： H04L67/1097 ,  G06F12/00 ,  H04W4/80

摘要： A method and a storage apparatus for switching a data transmission path to transmit data are provided. The storage apparatus comprises a storage element, an interface connector, a connector control interface connected with the storage element and the interface connector, a wireless transmission module, and an apparatus controller connected with the storage element and the wireless transmission module. In the method, the apparatus controller receives a connection request from a remote apparatus by using the wireless transmission module, and accordingly transmits an inquiry message to the remote apparatus to ask whether to establish a wireless data transmission path. When a confirmation message returned from the remote apparatus is received, the apparatus controller closes the connector control interface and establishes a wireless data transmission path to provide the remote apparatus to access the data in the storage element.

摘要翻译： 提供了一种用于切换数据传输路径以发送数据的方法和存储装置。 存储装置包括存储元件，接口连接器，与存储元件和接口连接器连接的连接器控制接口，无线传输模块和与存储元件和无线传输模块连接的设备控制器。 在该方法中，设备控制器通过使用无线传输模块从远程设备接收连接请求，并且相应地向远程设备发送查询消息以询问是否建立无线数据传输路径。 当接收到从远程设备返回的确认消息时，设备控制器关闭连接器控制接口并建立无线数据传输路径，以提供远程设备访问存储元件中的数据。

公开(公告)号：US08389869B2

公开(公告)日：2013-03-05

申请号：US12554340

申请日：2009-09-04

申请人： Ko-Wei Lin

发明人： Ko-Wei Lin

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

摘要： A circuit board including a substrate, a conductive pattern and a solder mask layer is provided. The conductive pattern includes a pad, a tail trace and a signal trace. The tail trace connects with the edge of the pad and the signal trace connects with the edge of the pad. An angle between a portion of the signal trace neighboring the pad and the tail trace is larger than 0 degree and smaller than 180 degree. The solder mask layer is disposed on the substrate and covers a portion of conductive pattern. The solder mask layer has an opening exposing the whole pad.

摘要翻译： 提供了包括基板，导电图案和焊料掩模层的电路板。 导电图案包括垫，尾迹和信号迹线。 尾迹与焊盘的边缘相连，信号迹线与焊盘的边缘相连。 与焊盘相邻的信号迹线的一部分与尾迹之间的角度大于0度且小于180度。 焊接掩模层设置在基板上并覆盖导电图案的一部分。 焊接掩模层具有暴露整个焊盘的开口。

公开(公告)号：US08089164B2

公开(公告)日：2012-01-03

申请号：US12586491

申请日：2009-09-23

申请人： Ko-Wei Lin ,  Yun-Hsiang Tien ,  Kun-Ting Hung

发明人： Ko-Wei Lin ,  Yun-Hsiang Tien ,  Kun-Ting Hung

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/28

CPC分类号： H01L23/49838 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/023 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/111 ,  H05K2201/10674 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention relates to a substrate having optional circuits and a structure of flip chip bonding. The substrate includes a substrate body, at least one substrate pad, a first conductive trace and a second conductive trace. The substrate body has a surface. The substrate pad is disposed on the surface of the substrate body. The first conductive trace is connected to a first circuit, and has a first breaking area so it forms a discontinuous line. The second conductive trace is connected to a second circuit, and has a second breaking area so tit forms a discontinuous line. The second conductive trace and the first conductive trace are connected to the same substrate pad. Thus, the substrate can choose to connect different circuits, so the substrate can be applied to different products by connecting the desired circuit, thus reducing the manufacturing cost.

摘要翻译： 本发明涉及具有可选电路和倒装芯片接合结构的基板。 衬底包括衬底主体，至少一个衬底焊盘，第一导电迹线和第二导电迹线。 基体具有表面。 衬底垫设置在衬底本体的表面上。 第一导电迹线连接到第一电路，并具有第一断开区域，从而形成不连续线。 第二导电迹线连接到第二电路，并且具有第二断开区域，因此峰形成不连续线。 第二导电迹线和第一导电迹线连接到相同的衬底焊盘。 因此，基板可以选择连接不同的电路，因此可以通过连接所需的电路将基板应用于不同的产品，从而降低制造成本。

公开(公告)号：US20100212948A1

公开(公告)日：2010-08-26

申请号：US12554340

申请日：2009-09-04

申请人： Ko-Wei Lin

发明人： Ko-Wei Lin

IPC分类号： H01R12/04

CPC分类号： H05K1/111 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

摘要： A circuit board including a substrate, a conductive pattern and a solder mask layer is provided. The conductive pattern includes a pad, a tail trace and a signal trace. The tail trace connects with the edge of the pad and the signal trace connects with the edge of the pad. An angle between a portion of the signal trace neighboring the pad and the tail trace is larger than 0 degree and smaller than 180 degree. The solder mask layer is disposed on the substrate and covers a portion of conductive pattern. The solder mask layer has an opening exposing the whole pad.

摘要翻译： 提供了包括基板，导电图案和焊料掩模层的电路板。 导电图案包括垫，尾迹和信号迹线。 尾迹与焊盘的边缘相连，信号迹线与焊盘的边缘相连。 与焊盘相邻的信号迹线的一部分与尾迹之间的角度大于0度且小于180度。 焊接掩模层设置在基板上并覆盖导电图案的一部分。 焊接掩模层具有暴露整个焊盘的开口。

公开(公告)号：US20100176516A1

公开(公告)日：2010-07-15

申请号：US12586491

申请日：2009-09-23

申请人： Ko-Wei Lin ,  Yun-Hsiang Tien ,  Kun-Ting Hung

发明人： Ko-Wei Lin ,  Yun-Hsiang Tien ,  Kun-Ting Hung

IPC分类号： H01L23/488 ,  H05K1/03

CPC分类号： H01L23/49838 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/023 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/111 ,  H05K2201/10674 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention relates to a substrate having optional circuits and a structure of flip chip bonding. The substrate includes a substrate body, at least one substrate pad, a first conductive trace and a second conductive trace. The substrate body has a surface. The substrate pad is disposed on the surface of the substrate body. The first conductive trace is connected to a first circuit, and has a first breaking area so it forms a discontinuous line. The second conductive trace is connected to a second circuit, and has a second breaking area so tit forms a discontinuous line. The second conductive trace and the first conductive trace are connected to the same substrate pad. Thus, the substrate can choose to connect different circuits, so the substrate can be applied to different products by connecting the desired circuit, thus reducing the manufacturing cost.

摘要翻译： 本发明涉及具有可选电路和倒装芯片接合结构的基板。 衬底包括衬底主体，至少一个衬底焊盘，第一导电迹线和第二导电迹线。 基体具有表面。 衬底垫设置在衬底本体的表面上。 第一导电迹线连接到第一电路，并具有第一断开区域，从而形成不连续线。 第二导电迹线连接到第二电路，并且具有第二断开区域，因此峰形成不连续线。 第二导电迹线和第一导电迹线连接到相同的衬底焊盘。 因此，基板可以选择连接不同的电路，因此可以通过连接所需的电路将基板应用于不同的产品，从而降低制造成本。