公开(公告)号：US5999452A

公开(公告)日：1999-12-07

申请号：US63688

申请日：1998-04-21

申请人： Pau-Ling Chen ,  Mike Van Buskirk ,  Shane Charles Hollmer ,  Binh Quang Le ,  Shoichi Kawamura ,  Chung-You Hu ,  Yu Sun ,  Sameer Haddad ,  Chi Chang

发明人： Pau-Ling Chen ,  Mike Van Buskirk ,  Shane Charles Hollmer ,  Binh Quang Le ,  Shoichi Kawamura ,  Chung-You Hu ,  Yu Sun ,  Sameer Haddad ,  Chi Chang

IPC分类号： G11C16/04 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792 ,  G11C13/00

CPC分类号： G11C16/0483

摘要： A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground. The two transistors in series are able to withstand a much higher voltage at the end of the NAND string without causing gated-diode junction or oxide breakdown in either the series or the source select transistor.

摘要翻译： 串联选择晶体管和源选择晶体管串联连接在浮动数据存储晶体管的NAND串的末端。 浮置栅极，串联选择栅极和源选择栅极都优选由多晶硅形成。 相同的隧道氧化物层用作串联选择晶体管和源极选择晶体管以及浮动栅极数据存储晶体管的栅极氧化物。 串联选择栅极和源极选择栅极中的两层多晶硅结合在一起。 串联选择晶体管连接到NAND串中的最后一个晶体管。 源选择晶体管连接到阵列Vss电源。 为了在另一NAND单元的编程期间编程禁止特定NAND单元，串联选择晶体管的栅极升高到Vcc，同时源极选择晶体管的栅极保持接地。 串联的两个晶体管能够在NAND串的末端承受高得多的电压，而不会在串联或源极选择晶体管中产生门极二极管结或氧化物击穿。

公开(公告)号：US5912489A

公开(公告)日：1999-06-15

申请号：US940674

申请日：1997-09-30

申请人： Pau-Ling Chen ,  Mike Van Buskirk ,  Shane Charles Hollmer ,  Binh Quang Le ,  Shoichi Kawamura ,  Chung-You Hu ,  Yu Sun ,  Sameer Haddad ,  Chi Chang

发明人： Pau-Ling Chen ,  Mike Van Buskirk ,  Shane Charles Hollmer ,  Binh Quang Le ,  Shoichi Kawamura ,  Chung-You Hu ,  Yu Sun ,  Sameer Haddad ,  Chi Chang

IPC分类号： G11C16/04 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792

CPC分类号： G11C16/0483

摘要： A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground. The two transistors in series are able to withstand a much higher voltage at the end of the NAND string without causing gated-diode junction or oxide breakdown in either the series or the source select transistor.

摘要翻译： 串联选择晶体管和源选择晶体管串联连接在浮动数据存储晶体管的NAND串的末端。 浮置栅极，串联选择栅极和源选择栅极都优选由多晶硅形成。 相同的隧道氧化物层用作串联选择晶体管和源极选择晶体管以及浮动栅极数据存储晶体管的栅极氧化物。 串联选择栅极和源极选择栅极中的两层多晶硅结合在一起。 串联选择晶体管连接到NAND串中的最后一个晶体管。 源选择晶体管连接到阵列Vss电源。 为了在另一NAND单元的编程期间编程禁止特定NAND单元，串联选择晶体管的栅极升高到Vcc，同时源极选择晶体管的栅极保持接地。 串联的两个晶体管能够在NAND串的末端承受高得多的电压，而不会在串联或源极选择晶体管中产生门极二极管结或氧化物击穿。

公开(公告)号：US06266275B1

公开(公告)日：2001-07-24

申请号：US09410512

申请日：1999-09-30

申请人： Paul-Ling Chen ,  Mike Van Buskirk ,  Shane Charles Hollmer ,  Binh Quang Le ,  Shoichi Kawamura ,  Chung-You Hu ,  Yu Sun ,  Sameer Haddad ,  Chi Chang

发明人： Paul-Ling Chen ,  Mike Van Buskirk ,  Shane Charles Hollmer ,  Binh Quang Le ,  Shoichi Kawamura ,  Chung-You Hu ,  Yu Sun ,  Sameer Haddad ,  Chi Chang

IPC分类号： G11C700

CPC分类号： G11C16/0483

摘要： A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground. The two transistors in series are able to withstand a much higher voltage at the end of the NAND string without causing gated-diode junction or oxide breakdown in either the series or the source select transistor.

摘要翻译： 串联选择晶体管和源选择晶体管串联连接在浮动数据存储晶体管的NAND串的末端。 浮置栅极，串联选择栅极和源选择栅极都优选由多晶硅形成。 相同的隧道氧化物层用作串联选择晶体管和源极选择晶体管以及浮动栅极数据存储晶体管的栅极氧化物。 串联选择栅极和源极选择栅极中的两层多晶硅结合在一起。 串联选择晶体管连接到NAND串中的最后一个晶体管。 源选择晶体管连接到阵列Vss电源。 为了在另一NAND单元的编程期间编程禁止特定NAND单元，串联选择晶体管的栅极升高到Vcc，同时源极选择晶体管的栅极保持接地。 串联的两个晶体管能够在NAND串的末端承受高得多的电压，而不会在串联或源极选择晶体管中产生门极二极管结或氧化物击穿。

公开(公告)号：US5793677A

公开(公告)日：1998-08-11

申请号：US668632

申请日：1996-06-18

申请人： Chung-You Hu ,  Yu Sun ,  Chi Chang ,  Sameer Haddad

发明人： Chung-You Hu ,  Yu Sun ,  Chi Chang ,  Sameer Haddad

IPC分类号： G11C16/04 ,  G11C13/00 ,  H01L27/115

CPC分类号： G11C16/0483

摘要： The present invention facilitates programming of selected floating gate devices while successfully inhibiting the programming of unselected devices, without the need for growing multiple thicknesses of oxides. The preferred embodiment of the present invention utilizes a multiple select gate device. In particular, the select gate device is preferably a dual floating gate device rather than the conventional transistor (or device functioning as a conventional transistor) used in the current Flash memory systems as a select gate device.

摘要翻译： 本发明有助于编程所选择的浮动栅极器件，同时成功地禁止对未选择器件的编程，而不需要生长多个厚度的氧化物。 本发明的优选实施例利用多选择栅极器件。 特别地，选择栅极器件优选地是双浮置栅极器件，而不是在当前闪存存储器系统中用作选择栅极器件的常规晶体管（或用作常规晶体管的器件）。

公开(公告)号：US6001713A

公开(公告)日：1999-12-14

申请号：US154074

申请日：1998-09-16

申请人： Mark T. Ramsbey ,  Vei-Han Chan ,  Sameer Haddad ,  Chi Chang ,  Yu Sun ,  Raymond Yu

发明人： Mark T. Ramsbey ,  Vei-Han Chan ,  Sameer Haddad ,  Chi Chang ,  Yu Sun ,  Raymond Yu

IPC分类号： H01L21/28 ,  H01L21/265

CPC分类号： H01L21/28273

摘要： Methods are provided for significantly reducing electron trapping in semiconductor devices having a floating gate and an overlying dielectric layer. The methods form a nitrogen-rich region within the floating gate near the interface to an overlying dielectric layer. The methods include selectively introducing nitrogen into the floating gate prior to forming the overlying dielectric layer. This forms an initial nitrogen concentration profile within the floating gate. An initial portion of the overlying dielectric layer is then formed of a high temperature oxide (HTO). The temperature within the floating gate is purposely raised to an adequately high temperature to cause the initial nitrogen concentration profile to change due to the migration of the majority of the nitrogen towards the interface with the overlying dielectric layer and an interface with an underlying layer. Consequently, the floating gate is left with a first nitrogen-rich region near the interface to the overlying dielectric layer and a second nitrogen-rich region near the interface to the underlying layer. The first nitrogen-rich region has been found to reduce electron trapping within the floating gate, which could lead to false programming of the floating gate. Unlike a conventional thermally grown oxide film, the high temperature oxide film within the interpoly dielectric layer advantageously prevents the surface of the floating gate from becoming too granular. As such, the resulting interpoly dielectric layer, which typically includes several films, can be formed more evenly.

摘要翻译： 提供了用于显着减少具有浮置栅极和上覆电介质层的半导体器件中的电子俘获的方法。 该方法在与上覆电介质层的界面附近的浮栅内形成富氮区。 所述方法包括在形成上覆电介质层之前将氮气选择性地引入浮栅。 这在浮动栅极内形成初始氮浓度分布。 然后由上覆电介质层的初始部分由高温氧化物（HTO）形成。 浮置栅极内的温度有意地升高到足够高的温度，以使得初始氮浓度分布由于大部分氮向与上覆介质层的界面的迁移以及与下层的界面而改变。 因此，浮置栅极在与上覆电介质层的界面附近的第一富氮区域和与下层的界面附近的第二富氮区域留下。 已经发现第一个富氮区域减少了浮动栅极内的电子俘获，这可能导致浮动栅极的错误编程。 与传统的热生长氧化膜不同，多聚电介质层内的高温氧化膜有利地防止浮栅的表面变得太细。 因此，可以更均匀地形成通常包括几个膜的所得到的互间介电层。

公开(公告)号：US06252276B1

公开(公告)日：2001-06-26

申请号：US09377183

申请日：1999-08-19

申请人： Mark Ramsbey ,  Sameer Haddad ,  Vei-Han Chan ,  Yu Sun ,  Chi Chang

发明人： Mark Ramsbey ,  Sameer Haddad ,  Vei-Han Chan ,  Yu Sun ,  Chi Chang

IPC分类号： H01L2978

CPC分类号： H01L21/28202 ,  H01L21/28273 ,  H01L29/518 ,  H01L29/66825

摘要： Methods and arrangements are provided for introducing nitrogen into a tunnel oxide layer within a stacked gate structure of a non-volatile memory cell. The nitrogen is advantageously introduced into only a select portion of the tunnel oxide, preferably nearer the source region of the memory cell. This prevents the unwanted or residual nitrogen from detrimentally affecting other devices within the semiconductor integrated circuit.

摘要翻译： 提供了将氮气引入非易失性存储单元的堆叠栅极结构内的隧道氧化物层中的方法和装置。 有利地，氮被引入隧道氧化物的选择部分，优选地更接近存储器单元的源极区域。 这防止了不需要的或残留的氮气有害地影响半导体集成电路内的其它器件。

公开(公告)号：US5972751A

公开(公告)日：1999-10-26

申请号：US143090

申请日：1998-08-28

申请人： Mark Ramsbey ,  Sameer Haddad ,  Vei-Han Chan ,  Yu Sun ,  Chi Chang

发明人： Mark Ramsbey ,  Sameer Haddad ,  Vei-Han Chan ,  Yu Sun ,  Chi Chang

IPC分类号： H01L21/28 ,  H01L21/336 ,  H01L29/51

CPC分类号： H01L21/28202 ,  H01L21/28273 ,  H01L29/518 ,  H01L29/66825

摘要： Methods and arrangements are provided for introducing nitrogen into a tunnel oxide layer within a stacked gate structure of a non-volatile memory cell. The nitrogen is advantageously introduced into only a select portion of the tunnel oxide, preferably nearer the source region of the memory cell. This prevents the unwanted or residual nitrogen from detrimentally affecting other devices within the semiconductor integrated circuit.

摘要翻译： 提供了将氮气引入非易失性存储单元的堆叠栅极结构内的隧道氧化物层中的方法和装置。 有利地，氮被引入隧道氧化物的选择部分，优选地更接近存储器单元的源极区域。 这防止了不需要的或残留的氮气有害地影响半导体集成电路内的其它器件。

公开(公告)号：US06989319B1

公开(公告)日：2006-01-24

申请号：US10718707

申请日：2003-11-24

申请人： Mark Ramsbey ,  Sameer Haddad ,  Vei-Han Chan ,  Yu Sun ,  Chi Chang

发明人： Mark Ramsbey ,  Sameer Haddad ,  Vei-Han Chan ,  Yu Sun ,  Chi Chang

IPC分类号： H01L21/265

CPC分类号： H01L21/265 ,  H01L21/28176 ,  H01L21/28273

摘要： Methods and arrangements are provided for significantly reducing electron trapping in semiconductor devices having a polysilicon feature and an overlying dielectric layer. The methods and arrangements employ a nitrogen-rich region within the polysilicon feature near the interface to the overlying dielectric layer. The methods include selectively implanting nitrogen ions through at least a portion of the overlying dielectric layer and into the polysilicon feature to form an initial nitrogen concentration profile within the polysilicon feature. Next, the temperature within the polysilicon feature is raised to an adequately high temperature, for example using rapid thermal anneal (RTA) techniques, which cause the initial nitrogen concentration profile to change due to the migration of the majority of the nitrogen towards either the interface with the overlying dielectric layer or the interface with an underlying layer. Consequently, the polysilicon feature has a first nitrogen-rich region near the interface to the overlying dielectric layer and a second nitrogen-rich region near the interface to the underlying layer. The migration of nitrogen further forms a contiguous reduced-nitrogen region located between the first nitrogen-rich region and the second nitrogen-rich region. The contiguous reduced-nitrogen region has a lower concentration of nitrogen than does the first nitrogen-rich region and the second nitrogen-rich region. The first nitrogen-rich region has been found to reduce electron trapping within the polysilicon feature. Thus, for example, in a non-volatile memory device wherein the polysilicon feature is a floating gate, false programming of the memory device can be significantly avoided by reducing the number of trapped electrons in the floating gate.

摘要翻译： 提供了用于显着减少具有多晶硅特征和上覆电介质层的半导体器件中的电子俘获的方法和装置。 所述方法和装置在靠近覆盖的介电层的界面附近使用多晶硅特征内的富氮区域。 所述方法包括通过至少部分上覆介质层选择性地注入氮离子并进入多晶硅特征以在多晶硅特征内形成初始氮浓度分布。 接下来，将多晶硅特征中的温度升高到足够高的温度，例如使用快速热退火（RTA）技术，其使得初始氮浓度分布由于大部分氮朝着界面迁移而改变 与上层电介质层或与下层的界面。 因此，多晶硅特征具有在与上覆电介质层的界面附近的第一富氮区域和与下层的界面附近的第二富氮区域。 氮的迁移进一步形成位于第一富氮区和第二富氮区之间的连续的还原氮区。 连续的还原氮区域具有比第一富氮区域和第二富氮区域低的氮浓度。 已发现第一富氮区域减少多晶硅特征内的电子俘获。 因此，例如，在其中多晶硅特征是浮动栅极的非易失性存储器件中，可以通过减少浮置栅极中的俘获电子的数量来显着地避免存储器件的伪编程。

公开(公告)号：US06737703B1

公开(公告)日：2004-05-18

申请号：US10095512

申请日：2002-03-12

申请人： Richard Fastow ,  Sameer Haddad ,  Yu Sun

发明人： Richard Fastow ,  Sameer Haddad ,  Yu Sun

IPC分类号： H01L218247

CPC分类号： H01L27/11521 ,  H01L27/115

摘要： In a memory device, a substrate has a plurality of source/drain regions in the substrate. Between the source/drain regions are trenches filled with oxide. Individual bit lines in the form of conductive regions are provided in the substrate, each bit line being under and running along the oxide in a trench. Each bit line connects to source/drain regions by means of connecting conductive regions extending from that bit line to source/drain regions.

摘要翻译： 在存储器件中，衬底在衬底中具有多个源极/漏极区域。 在源极/漏极区之间是填充有氧化物的沟槽。 导电区域形式的单个位线设置在衬底中，每个位线沿着沟槽中的氧化物在下面并且沿着其延伸。 每个位线通过将从该位线延伸的导电区域连接到源极/漏极区域而连接到源极/漏极区域。

公开(公告)号：US06583009B1

公开(公告)日：2003-06-24

申请号：US10178106

申请日：2002-06-24

申请人： Angela T. Hui ,  Kelwin Ko ,  Hiroyuki Kinoshita ,  Sameer Haddad ,  Yu Sun

发明人： Angela T. Hui ,  Kelwin Ko ,  Hiroyuki Kinoshita ,  Sameer Haddad ,  Yu Sun

IPC分类号： H01L218247

CPC分类号： H01L27/11521 ,  H01L27/115 ,  Y10S438/952

摘要： The present invention relates to a method of forming a stacked gate flash memory cell and comprises forming a tunnel oxide layer, a first conductive layer, an interpoly dielectric layer, and a second conductive layer in succession over a semiconductor substrate. The method further comprises forming a sacrificial layer over the second conductive layer, and patterning the sacrificial layer to form a sacrificial layer feature having at least one lateral sidewall edge associated therewith. A sidewall spacer is then formed against the lateral sidewall edge of the sacrificial layer, wherein the spacer has a width associated therewith, and the patterned sacrificial layer feature is removed. Finally, the second conductive layer, the interpoly dielectric and the first conductive layer are patterned using the spacer as a hard mask, and defining the stacked gate, wherein a width of the stacked gate is a function of the spacer width.

摘要翻译： 本发明涉及一种形成层叠栅极闪存单元的方法，包括在半导体衬底上连续形成隧道氧化物层，第一导电层，多晶硅间介质层和第二导电层。 该方法还包括在第二导电层上形成牺牲层，以及图案化牺牲层以形成具有与其相关联的至少一个侧向侧壁边缘的牺牲层特征。 然后在牺牲层的横向侧壁边缘上形成侧壁间隔物，其中间隔件具有与其相关联的宽度，并且去除图案化的牺牲层特征。 最后，使用间隔物作为硬掩模来图案化第二导电层，多晶硅间电介质和第一导电层，并且限定堆叠栅极，其中堆叠栅极的宽度是间隔物宽度的函数。