公开(公告)号：US20170351031A1

公开(公告)日：2017-12-07

申请号：US15169836

申请日：2016-06-01

Applicant: Cisco Technology, Inc.

Inventor： Kal Shastri ,  Rao YELAMARTY ,  Neeraj DUBEY ,  David PIEDE ,  Weizhuo LI

IPC: G02B6/30 ,  G02B6/136 ,  G02B6/36 ,  G02B6/12

CPC classification number: G02B6/30 ,  G02B6/136 ,  G02B6/3652 ,  G02B6/3692 ,  G02B2006/12097 ,  G02B2006/121

Abstract: Embodiments herein include an optical system that passively aligns a fiber array connector (FAC) to a waveguide in a photonic chip. A substrate of the FAC is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the FAC. To align the fibers to the photonic chip, one of the fibers is disposed in an alignment trench which has a width that is substantially the same as the diameter of the fiber. When the fiber registers with the alignment trench, the fiber is aligned with a waveguide disposed at the end of the trench. Because the pitch between the fibers can be precisely controlled, aligning one of the fibers using the alignment trench results in the other fibers becoming passively aligned to respective waveguides in the photonic chip.

公开(公告)号：US20140294334A1

公开(公告)日：2014-10-02

申请号：US14218634

申请日：2014-03-18

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu SHASTRI ,  Bipin DAMA ,  Mark WEBSTER ,  David PIEDE

IPC: H01P3/00 ,  G02F1/01

CPC classification number: H01P3/00 ,  G02F1/011 ,  G02F1/0121 ,  G02F1/0327 ,  G02F1/225 ,  G02F1/2255 ,  G02F2201/124 ,  G02F2201/126 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/10121

Abstract: A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

Abstract translation: 在常规电子集成电路（IC）和光电子组件之间布置电信号的配置被形成为在相邻路径上承载相反信号的信号路径阵列，以降低与IC和IC之间的连接相关联的电感 光电子组件。 信号路径阵列可以采取在IC和子组件之间的引线阵列的形式，形成在光电子组件上的导电迹线阵列，或两者。