公开(公告)号：US10735101B2

公开(公告)日：2020-08-04

申请号：US15664981

申请日：2017-07-31

Applicant: Cisco Technology, Inc.

Inventor： Stefan Pfnuer ,  Ravi Kachru ,  John Fangman ,  Utpal Chakrabarti

IPC: H04B10/50 ,  G02B6/42 ,  H01L33/64 ,  H01L33/52 ,  H05K13/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/02 ,  H01S5/026 ,  H01L25/16

Abstract: A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

公开(公告)号：US09755752B2

公开(公告)日：2017-09-05

申请号：US14153494

申请日：2014-01-13

Applicant: Cisco Technology, Inc.

Inventor： Stefan Pfnuer ,  Ravi Kachru ,  John Fangman ,  Utpal Chakrabarti

IPC: H04B10/50 ,  G02B6/42 ,  H05K13/00 ,  H01L33/64 ,  H01L33/52 ,  H01S5/022 ,  H01S5/024 ,  H01S5/02 ,  H01S5/026

CPC classification number: H04B10/503 ,  G02B6/4208 ,  G02B6/4236 ,  G02B6/4249 ,  G02B6/4251 ,  G02B6/4271 ,  H01L33/52 ,  H01L33/64 ,  H01S5/02 ,  H01S5/02236 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/0265 ,  H05K13/00 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49778 ,  Y10T29/49815 ,  Y10T29/49826 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.

公开(公告)号：US20170331557A1

公开(公告)日：2017-11-16

申请号：US15664981

申请日：2017-07-31

Applicant: Cisco Technology, Inc.

Inventor： Stefan Pfnuer ,  Ravi Kachru ,  John Fangman ,  Utpal Chakrabarti

IPC: H04B10/50 ,  G02B6/42 ,  H01L33/52 ,  H05K13/00 ,  H01L33/64 ,  H01S5/026 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024

Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.

公开(公告)号：US20150121683A1

公开(公告)日：2015-05-07

申请号：US14153494

申请日：2014-01-13

Applicant: Cisco Technology, Inc.

Inventor： Stefan Pfnuer ,  Ravi Kachru ,  John Fangman ,  Utpal Chakrabarti

IPC: H05K13/00

CPC classification number: H04B10/503 ,  G02B6/4208 ,  G02B6/4236 ,  G02B6/4249 ,  G02B6/4251 ,  G02B6/4271 ,  H01L33/52 ,  H01L33/64 ,  H01S5/02 ,  H01S5/02236 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/0265 ,  H05K13/00 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49778 ,  Y10T29/49815 ,  Y10T29/49826 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.

Abstract translation: 在一个实施例中，公开了一种制造光通信设备的方法。 光学子组件和光学平台可以形成光通信设备。 预定义的断裂线被放置在载体晶片上。 晶片可以容纳调制器子座和激光子座。 使用加工工艺将调制器子座安装在光学平台上，激光子座与热电冷却器相邻。 激光子座可以密封并对准以与调制器子座连通。