公开(公告)号：US20170003463A1

公开(公告)日：2017-01-05

申请号：US14790925

申请日：2015-07-02

Applicant: Cisco Technology, Inc.

Inventor： Mary NADEAU ,  Thomas DAUGHERTY ,  Ravi Sekhar TUMMIDI ,  Vipulkumar PATEL

IPC: G02B6/42 ,  H01S5/022 ,  H01S5/02 ,  G02B6/13

CPC classification number: H01S5/02272 ,  G02B6/4231 ,  G02B6/4238 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01S5/0224 ,  H01S5/02252 ,  H01L2924/00014

Abstract: Embodiments disclosed herein generally relate to a method for manufacturing a photonic device that facilitates precise alignment of a laser with a waveguide. The method generally includes disposing the laser on a support member on a substrate such that the laser contacts the support member. The support member may extend in a direction perpendicular to a base plane of the substrate, and solder may be disposed on the base plane such that a height of the solder in the direction perpendicular to the base plane is less than a height of the support member so that a gap is created between the solder and the laser. Once the laser has been properly aligned with the waveguide, the solder may be heated (e.g., reflowed) so that the solder contacts the laser.

Abstract translation: 本文公开的实施例一般涉及一种用于制造有助于激光与波导的精确对准的光子器件的方法。 该方法通常包括将激光器设置在基板上的支撑构件上，使得激光器接触支撑构件。 支撑构件可以在垂直于基底的基面的方向上延伸，并且焊料可以设置在基面上，使得焊料在垂直于基面的方向上的高度小于支撑构件的高度 从而在焊料和激光之间产生间隙。 一旦激光器已经正确地对准波导，则焊料可以被加热（例如回流），使得焊料接触激光器。

公开(公告)号：US20140248723A1

公开(公告)日：2014-09-04

申请号：US14276566

申请日：2014-05-13

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu SHASTRI ,  Vipulkumar PATEL ,  Mark WEBSTER ,  Prakash GOTHOSKAR ,  Ravinder KACHRU ,  Soham PATHAK ,  Rao V. YELAMARTY ,  Thomas DAUGHERTY ,  Bipin DAMA ,  Kaushik PATEL ,  Kishor DESAI

IPC: H01L25/00 ,  H01L25/16

CPC classification number: H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

Abstract translation: 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。