中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.014 seconds)

    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES
    2.
    发明申请
    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES 审中-公开

    公开(公告)号：US20190177203A1

    公开(公告)日：2019-06-13

    申请号：US16276909

    申请日：2019-02-15

    Applicant: Corning Incorporated

    Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

    IPC: C03B33/02 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K26/38 ,  B23K26/0622

    Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES
    4.
    发明申请
    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES 审中-公开
    激光切割温度基板

    公开(公告)号：US20160200621A1

    公开(公告)日：2016-07-14

    申请号：US14993236

    申请日：2016-01-12

    Applicant: Corning Incorporated

    Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

    IPC: C03B33/02 ,  B23K26/402 ,  B23K26/38

    CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  B23K2103/54 ,  Y02P40/57

    Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

    Abstract translation: 公开了用于激光切割热回火衬底的系统和方法。 在一个实施例中，分离热回火衬底的方法包括引导激光束焦线，使得激光束焦线的至少一部分在热回火衬底的主体内。 聚焦的脉冲激光束被脉冲以形成包括一个或多个子脉冲的脉冲串序列。 激光束焦线沿着激光束焦线在回火基板的主体内产生损伤轨迹。 在聚焦的脉冲激光束和回火衬底之间提供相对运动，使得脉冲激光束在回火衬底内形成一系列损伤轨迹。 损伤轨迹序列的单个损伤轨迹由横向间隔分开，并且一个或多个微裂纹连接损坏轨迹序列的相邻损伤轨迹。

    METHOD AND APPARATUS FOR EDGE FINISHING OF HIGH MECHANICAL STRENGTH THIN GLASS SUBSTRATES
    5.
    发明申请
    METHOD AND APPARATUS FOR EDGE FINISHING OF HIGH MECHANICAL STRENGTH THIN GLASS SUBSTRATES 有权

    公开(公告)号：US20220339751A1

    公开(公告)日：2022-10-27

    申请号：US17621049

    申请日：2020-06-11

    Applicant: CORNING INCORPORATED

    Inventor： Jonas Bankaitis ,  Duc Anh Bui ,  Scott Steven Cronk ,  Christopher Paul Daigler ,  Christina Marie Laskowski ,  Neil Eugene Partridge ,  Uwe Stute ,  Sergio Tsuda ,  Chad Michael Wilcox

    IPC: B24B9/10

    Abstract: Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.

    Laser cutting of thermally tempered substrates
    8.
    发明授权
    Laser cutting of thermally tempered substrates 有权

    公开(公告)号：US10252931B2

    公开(公告)日：2019-04-09

    申请号：US14993236

    申请日：2016-01-12

    Applicant: Corning Incorporated

    Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

    IPC: B32B3/10 ,  C03B33/02 ,  B23K26/38 ,  B23K26/402 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  B23K103/00

    Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

Patent Agency Ranking