公开(公告)号：US20250019294A1

公开(公告)日：2025-01-16

申请号：US18714246

申请日：2022-11-18

Applicant: CORNING INCORPORATED

Inventor： Patrick Scott Leslie ,  Craig John Mancusi Ungaro

IPC: C03C15/00 ,  B32B3/30 ,  B32B17/00 ,  C03C23/00

Abstract: A method of forming recesses in a glass-based laminate, the method comprising: irradiating a portion of a first clad layer of a glass laminate with a pulsed laser beam, the glass-based laminate comprising the first clad layer, the irradiating producing an irradiated portion of the first clad layer and a non-irradiated portion of the first clad layer; and etching the first clad layer with an etchant that selectively etches the irradiated portion of the first clad layer relative to the non-irradiated portion of the first clad layer and selectively etches the irradiated portion of the first clad layer relative to the core layer, wherein irradiating with a pulsed laser beam is one of (1) irradiating with a focused pulsed laser beam producing damage or other physical or chemical alteration in the first clad layer to a depth not more than the first clad layer thickness and within 0.1 to 20 μm distance from the core layer, and (2) irradiating with a quasi-non-diffracting beam having a beam path and a beam intensity along a beam path in a direction of beam propagation in the first clad layer and the core layer which intensity remains within a range of from 40 to 100 percent of maximum in the first clad layer other than within a distance from the core layer in the range of from 0 to 50 μm and remains to within a range of from 40 to 0.1 percent of maximum (low intensity portion) within the core layer.

公开(公告)号：US20220153632A1

公开(公告)日：2022-05-19

申请号：US17439541

申请日：2020-03-20

Applicant: CORNING INCORPORATED

Inventor： Patrick Scott Leslie

IPC: C03C15/00 ,  C03C23/00 ,  B23K26/382 ,  B23K26/402

Abstract: A method of forming a through hole in a glass substrate is provided. The method includes irradiating a surface of a glass substrate with a mid-infrared or far-infrared laser to form a pilot hole including a plurality of cracks extending radially outward from the pilot hole. The pilot hole is etched to expand a diameter of the pilot hole to at least encompass the plurality of cracks to form a through hole having a through hole entry diameter of about 200 micrometers to about 1.5 millimeters.

公开(公告)号：US20230339042A1

公开(公告)日：2023-10-26

申请号：US18011875

申请日：2021-06-18

Applicant: CORNING INCORPORATED

Inventor： Patrick Scott Leslie ,  Craig John Mancusi Ungaro

IPC: B23K26/0622 ,  B23K26/06 ,  B23K26/55

CPC classification number: B23K26/0622 ,  B23K26/0648 ,  B23K26/55

Abstract: A method of laser processing a transparent workpiece (160) includes directing a laser beam (112) into the transparent workpiece (160) wherein a portion of the laser beam (112) directed into the transparent workpiece (160) includes a laser beam focal column (113) and generates an induced absorption to produce a defect column (172) within the transparent workpiece (160), the laser beam focal column (113) having a radius of maximum beam intensity that is variable along a length of the laser beam focal column (113) such that the radius of maximum beam intensity has at least two non-zero angles of propagation with respect to a center line of the laser beam focal column (113) along the length of the laser beam focal column (113).

公开(公告)号：US20230207385A1

公开(公告)日：2023-06-29

申请号：US17928363

申请日：2021-06-14

Applicant: CORNING INCORPORATED

Inventor： Patrick Scott Leslie ,  Chukwudi Azubuike Okoro

IPC: H01L21/768 ,  B23K26/0622 ,  B23K26/06 ,  B23K26/386 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L21/76825 ,  B23K26/386 ,  B23K26/0624 ,  B23K26/0648 ,  H01L21/486 ,  H01L23/49827 ,  B23K2101/40

Abstract: Systems, devices, and techniques for creating blind annular vias for metallized vias are described. For example, a vortex beam may be applied to an optically transmissive substrate, where the vortex beam may modify a portion of the substrate in an annular shape. The annular shape may extend from a surface of the substrate to a depth that is less than a thickness of the substrate, and the annular shape may have an annular width (e.g., a ring width) that is the same for various diameters of the annular shape. A blind annular via may be formed by etching the modified portion of the substrate, where the blind annular via may include a pillar comprising the same material as the surrounding substrate. In addition, a metallized annular via may be created by filling the blind annular via with a conductive material, and removing a portion of the substrate opposite the surface.

公开(公告)号：US20220057561A1

公开(公告)日：2022-02-24

申请号：US17421176

申请日：2020-01-07

Applicant: Corning Incorporated

Inventor： Patrick Scott Leslie ,  Shenping Li ,  Leonard Thomas Masters ,  Johannes Moll ,  Craig John Mancusi Ungaro

IPC: F21V8/00

Abstract: Apparatus can comprise a light source and a light guide plate. The light guide plate can comprise a plurality of features within an interior of the light guide plate. A feature of the plurality of features can comprise a first refractive index that is different from a refractive index of the light guide plate. A spacing between a pair of adjacent features of the plurality of features can be from about 20 micrometers to about 200 micrometers. The apparatus can be used to direct light out of the light guide plate with a peak radiance oriented from 0° to 30° from a direction normal to the first major surface of the light guide plate. Methods of making the apparatus can comprise emitting a burst of pulses from a laser. Methods can comprise focusing the burst of pulses into a line focus within the light guide plate.

公开(公告)号：US20210359185A1

公开(公告)日：2021-11-18

申请号：US17286271

申请日：2019-10-09

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Patrick Scott Leslie ,  Barada Kanta Nayak ,  Michael Lesley Sorensen ,  Rajesh Vaddi

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/44 ,  H01L25/16 ,  B23K26/55 ,  B23K26/16

Abstract: A device includes a glass substrate, a plurality of electronic components, a metallization layer, and a plurality of vias. The plurality of electronic components are on a first surface of the glass substrate. The metallization layer is on a second surface of the glass substrate opposite to the first surface. The plurality of vias extend through the glass substrate. At least one via is in electrical communication with an electronic component and the metallization layer.