Multiple-gate MOSFET device and associated manufacturing methods
    1.
    发明授权
    Multiple-gate MOSFET device and associated manufacturing methods 有权
    多栅MOSFET器件及相关制造方法

    公开(公告)号:US07960234B2

    公开(公告)日:2011-06-14

    申请号:US11726516

    申请日:2007-03-22

    IPC分类号: H01L21/336

    摘要: One embodiment of the present invention relates to a method of fabricating a multi-gate transistor. During the method a second gate electrode material is selectively removed from a semiconductor structure from which the multi-gate transistor is formed, thereby exposing at least one surface of a first gate electrode material. The exposed surface of the first gate electrode material is deglazed. Subsequently, the first gate electrode material is removed. Other methods and devices are also disclosed.

    摘要翻译: 本发明的一个实施例涉及一种制造多栅极晶体管的方法。 在该方法期间,从形成多栅极晶体管的半导体结构中选择性地去除第二栅电极材料,从而暴露第一栅电极材料的至少一个表面。 第一栅电极材料的暴露表面被去角质化。 随后,去除第一栅电极材料。 还公开了其它方法和装置。

    Multiple-gate MOSFET device and associated manufacturing methods
    2.
    发明申请
    Multiple-gate MOSFET device and associated manufacturing methods 有权
    多栅MOSFET器件及相关制造方法

    公开(公告)号:US20080233697A1

    公开(公告)日:2008-09-25

    申请号:US11726516

    申请日:2007-03-22

    IPC分类号: H01L21/336

    摘要: One embodiment of the present invention relates to a method of fabricating a multi-gate transistor. During the method a second gate electrode material is selectively removed from a semiconductor structure from which the multi-gate transistor is formed, thereby exposing at least one surface of a first gate electrode material. The exposed surface of the first gate electrode material is deglazed. Subsequently, the first gate electrode material is removed. Other methods and devices are also disclosed.

    摘要翻译: 本发明的一个实施例涉及一种制造多栅极晶体管的方法。 在该方法期间,从形成多栅极晶体管的半导体结构中选择性地去除第二栅电极材料,从而暴露第一栅极电极材料的至少一个表面。 第一栅电极材料的暴露表面被去角质化。 随后,去除第一栅电极材料。 还公开了其它方法和装置。

    VARYING MUGFET WIDTH TO ADJUST DEVICE CHARACTERISTICS
    5.
    发明申请
    VARYING MUGFET WIDTH TO ADJUST DEVICE CHARACTERISTICS 审中-公开
    改变MUGFET宽度以调整设备特性

    公开(公告)号:US20080303095A1

    公开(公告)日:2008-12-11

    申请号:US11759710

    申请日:2007-06-07

    IPC分类号: H01L29/76 H01L21/8234

    摘要: One embodiment of the present invention relates to an integrated circuit that includes a first multi-gate transistor that has a first fin width and a first threshold voltage. The integrated circuit also includes a second multi-gate transistor that has a second fin width that is greater than the first width and a second threshold voltage that is less than the first threshold voltage. Other circuits and methods are also disclosed.

    摘要翻译: 本发明的一个实施例涉及一种集成电路,其包括具有第一鳍宽度和第一阈值电压的第一多栅极晶体管。 集成电路还包括具有大于第一宽度的第二鳍宽度和小于第一阈值电压的第二阈值电压的第二多栅极晶体管。 还公开了其它电路和方法。

    METHOD OF ADJUSTING FDSOI THRESHOLD VOLTAGE THROUGH OXIDE CHARGES GENERATION IN THE BURIED OXIDE
    7.
    发明申请
    METHOD OF ADJUSTING FDSOI THRESHOLD VOLTAGE THROUGH OXIDE CHARGES GENERATION IN THE BURIED OXIDE 有权
    通过氧化硅氧化物生成的氧化物电压调节方法

    公开(公告)号:US20090253253A1

    公开(公告)日:2009-10-08

    申请号:US12062968

    申请日:2008-04-04

    IPC分类号: H01L21/425

    摘要: Different performance MOSFET Fully Depleted devices can be achieved on a single chip by varying the Vt through ion implantation. The integration of multiple Vt can be achieved through the selection of a metal gate stack with suitable effective WF for one semiconductor device to be included on a chip. Then, an ion implantation, with a dopant such as F, can be selectively performed to achieve proper Vt for other semiconductor devices on the chip.

    摘要翻译: 通过改变Vt通过离子注入,可以在单个芯片上实现不同性能的MOSFET完全耗尽的器件。 可以通过选择具有合适的有效WF的金属栅极堆叠来实现多个Vt的集成,一个半导体器件将被包括在芯片上。 然后,可以选择性地执行具有诸如F的掺杂剂的离子注入,以为芯片上的其它半导体器件实现适当的Vt。

    SOI MuGFETs having single gate electrode level
    9.
    发明授权
    SOI MuGFETs having single gate electrode level 有权
    具有单栅电极层的SOI MuGFET

    公开(公告)号:US08581317B2

    公开(公告)日:2013-11-12

    申请号:US12199041

    申请日:2008-08-27

    IPC分类号: H01L27/115

    摘要: A silicon on insulator (SOI) multi-gate field effect transistor electrically Programmable Read-Only Memory (MuFET EPROM) includes a substrate having a dielectric surface. A first semiconducting region is in or on the dielectric surface. A source region, a drain region and a channel region interposed between the source and drain are formed in first semiconducting region. A gate dielectric layer is on the channel region. At least a second semiconducting region in or on the dielectric surface is spaced apart from the first semiconducting region. A first electrode layer comprises a first electrode portion including a transistor gate electrode and a control gate electrode electrically isolated from one another. The transistor gate overlies the channel region to form a transistor. The control gate extends to overlay a portion of the second semiconducting region. The transistor gate and thus the transistor and the control gate are capacitively coupled to one another by at least one MOS coupling capacitor, with one plate of the MOS coupling capacitor ohmically coupled to or including the second semiconducting region.

    摘要翻译: 绝缘体上硅(SOI)多栅极场效应晶体管电可编程只读存储器(MuFET EPROM)包括具有电介质表面的衬底。 第一半导电区域位于电介质表面中或其上。 源极区域,漏极区域和介于源极和漏极之间的沟道区域形成在第一半导体区域中。 栅介质层位于沟道区上。 电介质表面中或电介质表面上的至少第二半导体区域与第一半导体区域间隔开。 第一电极层包括第一电极部分,其包括晶体管栅电极和彼此电隔离的控制栅电极。 晶体管栅极覆盖沟道区以形成晶体管。 控制门延伸以覆盖第二半导体区域的一部分。 晶体管栅极,因此晶体管和控制栅极通过至少一个MOS耦合电容器彼此电容耦合,MOS耦合电容的一个板欧姆耦合到或包括第二半导体区域。

    Method of adjusting FDSOI threshold voltage through oxide charges generation in the buried oxide
    10.
    发明授权
    Method of adjusting FDSOI threshold voltage through oxide charges generation in the buried oxide 有权
    通过掩埋氧化物中氧化物电荷产生来调整FDSOI阈值电压的方法

    公开(公告)号:US07939393B2

    公开(公告)日:2011-05-10

    申请号:US12062968

    申请日:2008-04-04

    IPC分类号: H01L21/337

    摘要: Different performance MOSFET Fully Depleted devices can be achieved on a single chip by varying the Vt through ion implantation. The integration of multiple Vt can be achieved through the selection of a metal gate stack with suitable effective WF for one semiconductor device to be included on a chip. Then, an ion implantation, with a dopant such as F, can be selectively performed to achieve proper Vt for other semiconductor devices on the chip.

    摘要翻译: 通过改变Vt通过离子注入,可以在单个芯片上实现不同性能的MOSFET完全耗尽的器件。 可以通过选择具有合适的有效WF的金属栅极堆叠来实现多个Vt的集成,一个半导体器件将被包括在芯片上。 然后,可以选择性地执行具有诸如F的掺杂剂的离子注入,以为芯片上的其它半导体器件实现适当的Vt。