公开(公告)号：US20180145059A1

公开(公告)日：2018-05-24

申请号：US15359517

申请日：2016-11-22

Applicant: Cree, Inc.

Inventor： Erin R.F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Christopher P. Hussell

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/64 ,  H01L33/48

Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.

公开(公告)号：US20170373045A1

公开(公告)日：2017-12-28

申请号：US15192790

申请日：2016-06-24

Applicant: Cree, Inc.

Inventor： Erin R.F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/56 ,  H01L33/62 ,  H01L23/538

CPC classification number: H01L25/0753 ,  H01L23/5386 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: Light emitter components and related methods are provided. In some aspects, light emitter components and related methods include a ceramic submount having a reflective surface. Light emitter components and related methods can include light emitter chips disposed over the reflective surface. Each light emitter chip can include a sapphire substrate, an epi area disposed over the sapphire substrate, and first and second electrical contacts disposed over the epi area. The first and second electrical contacts may face the reflective surface. A ratio between a combined epi area of the plurality of light emitter chips and a surface area of the reflective surface may be at least 0.4 or more, and a ratio between a combined planar surface area of the plurality of light emitter chips and a planar surface area of the reflective surface may be at least approximately 0.25 or more.