公开(公告)号：US20170179350A9

公开(公告)日：2017-06-22

申请号：US14860483

申请日：2015-09-21

Applicant: Cree, Inc.

Inventor： Eric Mayer ,  Jae Park ,  Manuel L. Breva

IPC: H01L33/60 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/08 ,  H01L33/382 ,  H01L33/405 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Described herein are LED chips incorporating self-aligned floating mirror layers that can be configured with contact vias. These mirror layers can be utilized to reduce dim areas seen around the contact vias due to underlying material layers without the need for the mirror layer to be designed at some tolerance distance from the electrical via. This increases mirror area, eliminating lower light reflection in the proximity of the via and producing higher light output with greater light emission uniformity. In some embodiments, the mirror layer is formed with a contact via. This allows for a self-aligning process and results in the mirror layer extending substantially from the edge of the via.

公开(公告)号：US10186644B2

公开(公告)日：2019-01-22

申请号：US14860483

申请日：2015-09-21

Applicant: Cree, Inc.

Inventor： Eric Mayer ,  Jae Park ,  Manuel L. Breva

IPC: H01L27/15 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075 ,  H01L33/40 ,  H01L33/46 ,  H01L33/08 ,  H01L33/38

Abstract: Described herein are LED chips incorporating self-aligned floating mirror layers that can be configured with contact vias. These mirror layers can be utilized to reduce dim areas seen around the contact vias due to underlying material layers without the need for the mirror layer to be designed at some tolerance distance from the electrical via. This increases mirror area, eliminating lower light reflection in the proximity of the via and producing higher light output with greater light emission uniformity. In some embodiments, the mirror layer is formed with a contact via. This allows for a self-aligning process and results in the mirror layer extending substantially from the edge of the via.

公开(公告)号：US20160087173A1

公开(公告)日：2016-03-24

申请号：US14860483

申请日：2015-09-21

Applicant: Cree, Inc.

Inventor： Eric Mayer ,  Jae Park ,  Manuel L. Breva

IPC: H01L33/60 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/08 ,  H01L33/382 ,  H01L33/405 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Described herein are LED chips incorporating self-aligned floating mirror layers that can be configured with contact vias. These mirror layers can be utilized to reduce dim areas seen around the contact vias due to underlying material layers without the need for the mirror layer to be designed at some tolerance distance from the electrical via. This increases mirror area, eliminating lower light reflection in the proximity of the via and producing higher light output with greater light emission uniformity. In some embodiments, the mirror layer is formed with a contact via. This allows for a self-aligning process and results in the mirror layer extending substantially from the edge of the via.

Abstract translation: 这里描述的是包括可以配置有接触孔的自对准浮动镜层的LED芯片。 这些镜面层可以用于减少由于下层材料层而在接触孔周围看到的暗淡区域，而不需要将镜面层设计在与电气通孔相距的一定距离处。 这增加了镜面积，消除了通孔附近的较低的光反射，并且产生更高的光输出并且具有更大的发光均匀性。 在一些实施例中，镜层形成有接触通孔。 这允许自对准过程并且导致镜面层基本上从通孔的边缘延伸。

公开(公告)号：US20150249196A1

公开(公告)日：2015-09-03

申请号：US14699302

申请日：2015-04-29

Applicant: CREE, INC.

Inventor： BRADLEY E. WILLIAMS ,  Kevin W. Haberern ,  Bennett D. Langsdorf ,  Manuel L. Breva

IPC: H01L33/62 ,  H01L33/08 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/08 ,  H01L33/382 ,  H01L33/405 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another to minimize the visibility of the space during operation. The LED chips can also comprise layers structures and compositions that allow improved reliability under high current operation.

Abstract translation: 公开了在副安装座上包括多个有源区的单片LED芯片，其中该基座包括与该有源区电接触的一体化导电互连元件，并将至少一些有源区串联连接。 基座还包括将至少一些互连元件和有源区域与基座的其它元件电绝缘的整体绝缘体元件。 活动区域彼此靠近地安装，以最小化操作期间空间的可视性。 LED芯片还可以包括在高电流操作下允许改进的可靠性的层结构和组合物。