公开(公告)号：US20170181280A1

公开(公告)日：2017-06-22

申请号：US15452828

申请日：2017-03-08

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Masaaki ASANO ,  Hiroshi MAWATARI ,  Takafumi OKAMURA

IPC: H05K1/11 ,  H01L25/065 ,  H01L21/66 ,  H01L21/48 ,  H05K3/40 ,  H01L23/498

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L22/32 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49883 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2225/06548 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/002 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4076 ,  H05K3/423 ,  H05K2203/1178

Abstract: The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.