公开(公告)号：US20220369499A1

公开(公告)日：2022-11-17

申请号：US17425541

申请日：2020-01-29

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hiroaki OTA

IPC: H05K7/20 ,  F28F21/08 ,  F28F21/04 ,  C04B35/575 ,  C04B41/51 ,  C04B41/45 ,  C04B41/88 ,  C09K5/14 ,  B28B3/02

Abstract: Among two main surfaces of a heat dissipation member, one main surface is curved to be convex in an outward direction and the other convex in an inward direction. When a straight line passing through both endpoints P1 and P2 of the curve is l1, a point at which a distance to l1 on the curve is maximum is Pmax, an intersection point between l1 and a perpendicular drawn from Pmax to l1 is P3, a middle point of a line segment P1P3 is P4, an intersection point between the curve and a straight line that passes through P4 and is perpendicular to l1 is Pmid, a length of the line segment P1P3 is L, a length of a line segment P3Pmax is H, and a length of a line segment P4Pmax is h, (2 h/L)/(H/L) is 1.1 or more.

公开(公告)号：US20240413051A1

公开(公告)日：2024-12-12

申请号：US18698607

申请日：2022-10-03

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hiroaki OTA

IPC: H01L23/373 ,  H01L23/40 ,  H01L25/065 ,  H05K7/20

Abstract: Provided is a heat dissipation member according to the present invention that includes a flat metal-silicon carbide composite containing aluminum, the heat dissipation member including: at least one through hole that penetrates the flat metal-silicon carbide composite in a plate thickness direction; a tapered portion where an inner diameter of the through hole gradually increases toward an outer side in a periphery of one or both end portions of the through hole; a metal portion containing aluminum that is formed on an inner surface of the through hole; and a screw hole that is formed in the metal portion.

公开(公告)号：US20240404913A1

公开(公告)日：2024-12-05

申请号：US18698695

申请日：2022-10-03

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hiroaki OTA ,  Kazunori KOYANAGI ,  Nobuhiro FUNATSU

IPC: H01L23/373

Abstract: Provided is a heat dissipation member according to the present invention including a flat metal-silicon carbide composite containing aluminum, in which a thickness of the heat dissipation member is equal to or less than 4 mm, and the heat dissipation member is used as a heat dissipation member for automobile mount.

公开(公告)号：US20190341330A1

公开(公告)日：2019-11-07

申请号：US16474690

申请日：2017-11-24

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Hiroaki OTA ,  Hideo TSUKAMOTO

IPC: H01L23/373 ,  C22C26/00 ,  C25D7/12 ,  C23C18/32

Abstract: A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 μm and 55-195 μm, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 μm and 45-205 μm is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.

公开(公告)号：US20180281230A1

公开(公告)日：2018-10-04

申请号：US15765931

申请日：2016-10-11

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki OTA ,  Takeshi MIYAKAWA ,  Yosuke ISHIHARA

IPC: B28B19/00 ,  C09K5/14 ,  H01L23/373 ,  F28F21/08 ,  B28B11/24

Abstract: The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor clement, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element. Provided is a flat plate-shaped aluminum-diamond composite that has an aluminum-diamond composite part and a surface layer that coats both surfaces of the composite part and includes a metal that has aluminum as a principal component, Wherein: the composite part is composed of a composite material that is composed of an aluminum or aluminum alloy matrix and diamond particles dispersed in said matrix; the composite material is composed of a diamond powder in which diamond particles having a particle size of 1-20 μm, inclusive, make up 10-40 vol of the diamond particles and diamond particles having a particle size of 100-250 μm, inclusive, make up 50-80 vol %, said powder not containing diamond particles having a particle size of less than 1 μm or diamond particles having a particle size of more than 250 μm; and the average value for the differences in in-plane thickness per 50 mm×50 mm is 100 μm or less.

公开(公告)号：US20230303461A1

公开(公告)日：2023-09-28

申请号：US18023226

申请日：2022-02-16

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hiroaki OTA

IPC: C04B41/51 ,  B28B5/02 ,  B28B11/12 ,  C04B35/565 ,  C04B35/622 ,  C04B41/88

CPC classification number: C04B41/5155 ,  B28B5/021 ,  B28B11/12 ,  C04B35/565 ,  C04B35/62236 ,  C04B41/88 ,  C04B2235/3826 ,  C04B2235/402 ,  C04B2235/5224 ,  C04B2235/602 ,  C04B2235/616 ,  C04B2235/96

Abstract: A molded article having a small difference in thermal conductivities between a central section and a section located at an outer peripheral surface side; and a method for producing the same; wherein, a plate-shaped molded article includes an aluminum-silicon carbide composited section in which a metal including aluminum was impregnated into a silicon carbide porous body, wherein a difference in the densities, by Archimedes’ principle, of a central section of the aluminum-silicon carbide composited section and of at least a portion of an outer side section located further toward the outside peripheral surface side than the central section is 3% or less.

公开(公告)号：US20220104400A1

公开(公告)日：2022-03-31

申请号：US17423429

申请日：2020-01-29

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hiroaki OTA

IPC: H05K7/20 ,  F28F21/02 ,  F28F21/08 ,  F28F13/18

Abstract: A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f2, f2 is less than f1 by 10 μm or more.

公开(公告)号：US20220017282A1

公开(公告)日：2022-01-20

申请号：US17292473

申请日：2019-11-06

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki OTA ,  Yosuke ISHIHARA ,  Daisuke GOTO

IPC: B65D81/26 ,  B65D57/00 ,  B65D81/20

Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.

公开(公告)号：US20240226997A1

公开(公告)日：2024-07-11

申请号：US18562539

申请日：2022-05-16

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki OTA ,  Yosuke ISHIHARA ,  Daisuke GOTO

IPC: B22D19/14 ,  B22D18/02 ,  C22C1/10 ,  C22C26/00 ,  H01L21/48 ,  H01L23/373

CPC classification number: B22D19/14 ,  B22D18/02 ,  C22C1/1073 ,  C22C26/00 ,  H01L21/4871 ,  H01L23/3733

Abstract: A production method for an aluminum-diamond composite having a step of providing a laminate structure including a composition layer containing a diamond powder in an opening of a flat plate-like porous material having the opening so as to be separated from an inner circumferential surface of the opening and a step of press-fitting a melt of a metal containing aluminum into a space between the porous material and the laminate structure and impregnating the composition layer with the melt to form a composited part containing aluminum and diamond and forming metal layers on at least side surfaces of the laminate structure, in which the laminate structure includes a first mold release plate, a first inorganic layer, the composition layer, a second inorganic layer and a second mold release plate in this order.

公开(公告)号：US20230156966A1

公开(公告)日：2023-05-18

申请号：US17911890

申请日：2021-03-11

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hiroaki OTA

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: An element-mounted board includes a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element including a ceramic plate, which is mounted on one surface side of the heat-dissipating plate, in which a flatness of the other surface of the heat-dissipating plate is 600 μm or less.