公开(公告)号：US20220392819A1

公开(公告)日：2022-12-08

申请号：US17829956

申请日：2022-06-01

Applicant: DENSO CORPORATION

Inventor： Sachio KODAMA ,  Hiroaki YOSHIZAWA ,  Masanori OOSHIMA ,  Takahiro HIRANO

IPC: H01L23/31 ,  H01L23/433 ,  H01L23/00

Abstract: A semiconductor device includes a semiconductor element, a sealing member, and a first conductive plate. The semiconductor element includes a first electrode. The sealing member seals the semiconductor element. The first conductive plate includes a first surface facing the first electrode inside the sealing member. The first surface of the first conductive plate includes a mounting region, a roughened region and a non-roughened region. The first electrode is joined to the mounting region. The roughened region is located around the mounting region. The non-roughened region is located between the roughened region and an outer peripheral edge of the first surface. Surface roughness of the roughened region is larger than surface roughness of the non-roughened region.

公开(公告)号：US20210217680A1

公开(公告)日：2021-07-15

申请号：US17213774

申请日：2021-03-26

Applicant: DENSO CORPORATION

Inventor： Masanori OOSHIMA ,  Tomomi OKUMURA ,  Takahiro HIRANO

IPC: H01L23/367 ,  H01L23/10 ,  H01L23/31

Abstract: A semiconductor device incudes: a semiconductor chip that includes an active area and an outer peripheral area surrounding the active area; a metal member that includes one face including a mounting portion on which the semiconductor chip is mounted and a peripheral member surrounding the mounting portion; a joining member that connects the semiconductor chip and the metal member; and a sealing resin body. The metal member includes, as the peripheral portion, an adhesive portion that surrounds the mounting portion and adheres to the sealing resin body, and a non-adhesive portion that is placed between the mounting portion and the adhesive portion. An entire width is placed in an area overlapping the semiconductor chip in a projection view in a thickness direction of the semiconductor chip.

公开(公告)号：US20220208634A1

公开(公告)日：2022-06-30

申请号：US17697195

申请日：2022-03-17

Applicant: DENSO CORPORATION

Inventor： Takahiro HIRANO ,  Shun SUGIURA ,  Masanori OOSHIMA

IPC: H01L23/31 ,  H01L23/48

Abstract: A semiconductor device includes a semiconductor element, a sealing body, and a plurality of terminals. The sealing body seals the semiconductor element therein. The terminals are electrically connected to the semiconductor element inside of the sealing body, and project from the sealing body. Each of the terminals has a rough surface area having a larger surface roughness than a peripheral area in a section in a longitudinal direction of the terminal.

公开(公告)号：US20190057921A1

公开(公告)日：2019-02-21

申请号：US16079128

申请日：2017-03-24

Applicant: DENSO CORPORATION

Inventor： Masanori OOSHIMA ,  Eiji HAYASHI

IPC: H01L23/31 ,  G01N29/04 ,  H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/3142 ,  G01N29/04 ,  G01N29/0672 ,  G01N2291/267 ,  H01L21/4803 ,  H01L21/4825 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/48 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/50 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L25/0655 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2924/14252 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.