公开(公告)号：US20220208634A1

公开(公告)日：2022-06-30

申请号：US17697195

申请日：2022-03-17

Applicant: DENSO CORPORATION

Inventor： Takahiro HIRANO ,  Shun SUGIURA ,  Masanori OOSHIMA

IPC: H01L23/31 ,  H01L23/48

Abstract: A semiconductor device includes a semiconductor element, a sealing body, and a plurality of terminals. The sealing body seals the semiconductor element therein. The terminals are electrically connected to the semiconductor element inside of the sealing body, and project from the sealing body. Each of the terminals has a rough surface area having a larger surface roughness than a peripheral area in a section in a longitudinal direction of the terminal.

公开(公告)号：US20160204047A1

公开(公告)日：2016-07-14

申请号：US14913719

申请日：2015-01-09

Applicant: DENSO CORPORATION

Inventor： Shun SUGIURA ,  Yasushi OOKURA

IPC: H01L23/367 ,  B23K1/00 ,  H01L23/00

CPC classification number: H01L23/3675 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/087 ,  B23K2101/40 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/05554 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/83986 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/38 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014

Abstract: A semiconductor device includes: a semiconductor element having a solder region and a non-solder region on a first face; a first metal member disposed on the first face of the semiconductor element; a second metal member disposed on a rear face of the semiconductor element; a first solder that connects the solder region of the semiconductor element and the first metal member; and a second solder that connects the rear face of the semiconductor element and the second metal member. At least the second solder provides a melt-bond. A gravity center position of the first metal member coincides with a center position of the semiconductor element in a projection view from a stacking direction.

Abstract translation: 半导体器件包括：在第一面上具有焊料区域和非焊接区域的半导体元件; 设置在所述半导体元件的第一面上的第一金属构件; 设置在所述半导体元件的背面上的第二金属构件; 连接半导体元件的焊料区域和第一金属部件的第一焊料; 以及连接半导体元件的后表面和第二金属构件的第二焊料。 至少第二焊料提供熔融粘合。 第一金属构件的重心位置与半导体元件的从堆叠方向的投影视图的中心位置重合。

公开(公告)号：US20160163656A1

公开(公告)日：2016-06-09

申请号：US14888098

申请日：2014-05-29

Applicant: DENSO CORPORATION ,  FUJI ELECTRIC CO., LTD.

Inventor： Shun SUGIURA ,  Yasushi OOKURA ,  Takeshi FUJII ,  Tetsutaro IMAGAWA

IPC: H01L23/00 ,  H01L23/528

CPC classification number: H01L23/562 ,  H01L23/34 ,  H01L23/4824 ,  H01L23/528 ,  H01L27/0255 ,  H01L29/417 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes: a semiconductor substrate having an element; a front surface electrode connected to the element; a rear surface electrode connected to the element; a protective film disposed on the front surface of the semiconductor substrate in a separation region; and a temperature sensor disposed on a front surface side of the semiconductor substrate. The front surface electrode is divided into multiple pieces along at least two directions with the protective film. The separation region includes an opposing region located between opposing sides of divided pieces of the front surface electrode adjacent to each other, and an intersection region, at which the opposing region intersects. The temperature sensor is disposed in only the opposing region.

Abstract translation: 半导体器件包括：具有元件的半导体衬底; 连接到所述元件的前表面电极; 连接到所述元件的背面电极; 在分离区域中设置在半导体衬底的前表面上的保护膜; 以及设置在半导体基板的正面侧的温度传感器。 前表面电极沿着保护膜沿至少两个方向分成多个片段。 分离区域包括位于彼此相邻的前表面电极的分割片的相对侧之间的相对区域和相对区域相交的交叉区域。 温度传感器仅设置在相对的区域中。