公开(公告)号：US20160380367A1

公开(公告)日：2016-12-29

申请号：US15163897

申请日：2016-05-25

Applicant: DENSO CORPORATION

Inventor： Toshihiro MIYAKE

IPC: H01R12/58 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K3/325 ,  H01R12/585 ,  H01R13/03 ,  H05K1/115 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2203/1157 ,  H05K2203/1189

Abstract: An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically.

Abstract translation: 电子设备包括具有包括铜或铜合金的第一连接部分的连接目标构件，具有包括铜或铜合金的第二连接部分的连接端子，第二连接部分通过弹簧反作用力与第一连接部分机械连接 以及在所述第一连接部和所述第二连接部之间设置有接触点的接合部。 第一连接部分和第二连接部分中的至少一个在其表面上的接合部分的周围包括氧化物膜，氧化物膜包括氧化铜。 接头部分冶金地直接接合包括在第一连接部分中的铜和包括在第二连接部分中的铜。

公开(公告)号：US20160141782A1

公开(公告)日：2016-05-19

申请号：US14926134

申请日：2015-10-29

Applicant: DENSO CORPORATION

Inventor： Toshihiro MIYAKE

IPC: H01R12/70

CPC classification number: H01R12/7076 ,  H01R12/58

Abstract: An electric connection structure electrically connecting an electric device and a circuit board includes a connection terminal including a press-welded terminal portion welded to a device terminal of the electric device by pressing, and a press-fit terminal portion fitted in a through-hole of the circuit board by pressing. A direction of the pressing of the press-welded terminal portion against the device terminal is the same as a direction of the pressing of the press-fit terminal portion into the through-hole.

Abstract translation: 电连接电气设备和电路板的电连接结构包括：连接端子，包括通过压制焊接到电气设备的器件端子的压焊端子部分;以及压配端子部分，其安装在通孔 电路板通过按压。 压焊端子部分抵靠器件端子的方向与压配端子部分压入通孔的方向相同。

公开(公告)号：US20210013121A1

公开(公告)日：2021-01-14

申请号：US16919330

申请日：2020-07-02

Applicant: DENSO CORPORATION

Inventor： Toshihiro MIYAKE

IPC: H01L23/373 ,  C22C9/00 ,  C22C5/02 ,  C22C21/00 ,  H01L23/00 ,  H01L23/495

Abstract: An electronic device includes a metal member and a connected member. A metal connecting layer is provided between a lower-side surface of the metal member and an upper-side surface of the connected member, to connect the metal member and the connected member to each other. The metal connecting layer includes at least one of metal films, each of which is made of gold or gold alloy. A thickness of the metal connecting layer in an opposing area between the metal member and the connected member is smaller than a flatness of each of the lower-side surface and the upper-side surface. A rust-preventing film is formed on a side wall of the metal member in such a way that the rust-preventing film extends from an outer periphery of the metal connecting layer to a position away from the outer periphery by a predetermined distance.

公开(公告)号：US20220210942A1

公开(公告)日：2022-06-30

申请号：US17542589

申请日：2021-12-06

Applicant: DENSO CORPORATION

Inventor： Toshihiro MIYAKE

IPC: H05K7/20

Abstract: An electronic device includes a heat generator including at least an electronic component generating heat, a case dissipating heat from the heat generator, a heat conductive member conducting heat of the heat generator to a heat dissipation member, and a metal bonding layer interposing between the heat generator and the heat conductive member and including at least a first bonding layer using gold or gold alloy as a constituting material. Thickness of the metal bonding layer is smaller than flatness of a bonding region which is bonded to a metal bonding layer on a facing surface of the heat generator and a facing surface of the heat conductive member. The heat conductive member has flexibility, is joined to the heat generator via the metal bonding layer, and is in contact with the case.

公开(公告)号：US20160201211A1

公开(公告)日：2016-07-14

申请号：US14982048

申请日：2015-12-29

Applicant: DENSO CORPORATION

Inventor： Kenji OCHI ,  Toshihiro MIYAKE ,  Yasuo ISHIHARA

IPC: C25D9/02 ,  C25D3/22 ,  H01R13/03 ,  C25D3/56 ,  C25D7/00 ,  C25D5/00 ,  C25D3/12 ,  C25D3/38

CPC classification number: C25D9/02 ,  C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D3/56 ,  C25D5/00 ,  C25D7/00 ,  C25D15/00 ,  H01R13/03

Abstract: A composite material includes a metal material having conductivity and an oxidation inhibitor mixed with the metal material. The oxidation inhibitor forms a complex with the metal material to exert a resistance to oxidation of the metal material. For example, the composite material is formed on a surface of a base material as a plating material. As another example, the composite material is plated on a surface of an electrode.

Abstract translation: 复合材料包括具有导电性的金属材料和与金属材料混合的氧化抑制剂。 氧化抑制剂与金属材料形成复合物以发挥金属材料的氧化性。 例如，复合材料形成在作为电镀材料的基材的表面上。 作为另一示例，将复合材料镀在电极的表面上。