公开(公告)号：US20180320031A1

公开(公告)日：2018-11-08

申请号：US15768050

申请日：2016-12-13

Applicant: DEXERIALS CORPORATION

Inventor： Daichi MORI ,  Tomoyuki ISHIMATSU

IPC: C09J7/30 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J163/00 ,  H01L21/304 ,  H01L21/683 ,  B32B27/06

CPC classification number: C09J7/30 ,  B32B27/06 ,  B32B2457/14 ,  C09J7/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J163/00 ,  H01L21/304 ,  H01L21/6836

Abstract: A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E-04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

公开(公告)号：US20180312728A1

公开(公告)日：2018-11-01

申请号：US15768197

申请日：2016-12-13

Applicant: DEXERIALS CORPORATION

Inventor： Daichi MORI ,  Tomoyuki ISHIMATSU

IPC: C09J7/30 ,  C09J11/04 ,  C09J11/06 ,  H01L21/304 ,  H01L21/683

CPC classification number: C09J7/30 ,  C08K3/013 ,  C09J7/10 ,  C09J11/04 ,  C09J11/06 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: Provided are a thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing semiconductor wafer warping and chipping. The thermosetting adhesive sheet includes a thermosetting adhesive layer containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator, the (meth)acrylate containing a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate, content of the solid (meth)acrylate in the resin component being 55 wt % or more; a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component being 2.7E-03 or more, and blending amount of the filler being 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.

公开(公告)号：US20170372936A1

公开(公告)日：2017-12-28

申请号：US15544050

申请日：2016-03-29

Applicant: DEXERIALS CORPORATION

Inventor： Daichi MORI

IPC: H01L21/683 ,  C09J133/10 ,  H01L21/78 ,  H01L21/304 ,  C09J133/08 ,  C09J11/04

CPC classification number: H01L21/6836 ,  C08K5/0025 ,  C08K5/14 ,  C09J4/00 ,  C09J7/10 ,  C09J7/35 ,  C09J11/04 ,  C09J133/00 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  H01L21/304 ,  H01L21/683 ,  H01L21/78 ,  H01L2221/68322 ,  H01L2221/68327

Abstract: A thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing warping of a semiconductor wafer are provided. The thermosetting adhesive sheet is to be applied to a grinding-side surface of a semiconductor wafer and cured before dicing and includes a polymer containing an elastomer, a (meth) acrylate containing more than 95% wt of a polyfunctional (meth) acrylate with respect to total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130° C. or lower, and a transparent filler. Thereby, the thermosetting adhesive sheet significantly shrinks and generates a stress opposing a warp direction of the semiconductor wafer, enabling the semiconductor wafer to be maintained in a flat state.

公开(公告)号：US20160351510A1

公开(公告)日：2016-12-01

申请号：US15163200

申请日：2016-05-24

Applicant: Dexerials Corporation

Inventor： Daichi MORI

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L23/562 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/11 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/01029

Abstract: A thermosetting adhesive sheet comprises a thermosetting binder, a transparent filler having an average primary particle diameter from 1 nm to 1000 nm and a colorant; wherein content of the transparent filler is from 30 to 100 pts. mass with respect to 80 pts. mass of the thermosetting binder and content of the colorant is from 0.5 to 3.0 pts. mass with respect to 80 pts. mass of the thermosetting binder; this thermosetting adhesive sheet is applied to a grinding-side surface of a semiconductor wafer and before dicing the semiconductor wafer. Printing using laser marking is thus made clear enabling excellent laser mark visibility and accurate alignment using infrared light.

Abstract translation: 热固性粘合片包括热固性粘合剂，平均一次粒径为1nm至1000nm的透明填料和着色剂; 其中，所述透明填料的含量为30〜100个。 质量相对于80点。 热固性粘合剂的质量和着色剂的含量为0.5至3.0个点。 质量相对于80点。 热固性粘合剂的质量; 将这种热固性粘合片施加到半导体晶片的研磨侧表面，并且在切割半导体晶片之前。 因此，使用激光打标的打印得以清晰，从而能够获得出色的激光标记可视性和使用红外光的精

公开(公告)号：US20140373339A1

公开(公告)日：2014-12-25

申请号：US14483759

申请日：2014-09-11

Applicant: DEXERIALS CORPORATION

Inventor： Daichi MORI

IPC: G01R31/26 ,  H01L31/18 ,  G01R31/40

CPC classification number: G01R31/26 ,  H01L31/0201 ,  H01L31/046 ,  H01L31/0504 ,  H01L31/0512 ,  H02S50/10 ,  Y02E10/50 ,  Y10T29/49004

Abstract: A method for producing a solar battery module, which contains: arranging tab wire on an electrode of a solar cell via an adhesive; connecting the tab wire with a measuring device for measuring electrical characteristics of the solar cell, to measure electrical characteristics of the solar cell; judging a grade of the solar cell based on a result of the measurement; and modularizing the solar cells of the same grade.

Abstract translation: 一种太阳能电池模块的制造方法，其特征在于，包括：通过粘合剂在太阳能电池的电极上配置突起线; 将接头线与用于测量太阳能电池的电特性的测量装置连接，以测量太阳能电池的电特性; 基于测量结果判断太阳能电池的等级; 并模块化相同等级的太阳能电池。

公开(公告)号：US20130255776A1

公开(公告)日：2013-10-03

申请号：US13905523

申请日：2013-05-30

Applicant: DEXERIALS CORPORATION

Inventor： Daichi MORI

IPC: H01L27/142

CPC classification number: B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B17/10018 ,  B32B17/10788 ,  B32B17/10871 ,  B32B2457/00 ,  H01L31/048 ,  H01L31/0504 ,  H01L31/0512 ,  Y02E10/50

Abstract: A thin-film solar cell module, including: a thin-film solar cell including an electrode; a tab line; and an adhesive layer, wherein the tab line includes convex portions only on one surface thereof, wherein the adhesive layer is disposed only on the one surface of the tab line including the convex portions, and wherein the electrode and the one surface of the tab line including the convex portions are adhered and electrically connected via the adhesive layer.

Abstract translation: 一种薄膜太阳能电池模块，包括：包括电极的薄膜太阳能电池; 标签线 和粘合剂层，其中，所述突片线仅在其一个表面上包括凸部，其中所述粘合剂层仅设置在包括所述凸部的所述突片的一个表面上，并且其中所述电极和所述突片线的所述一个表面 包括凸部通过粘合剂层粘合并电连接。