ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

    公开(公告)号:US20180022968A1

    公开(公告)日:2018-01-25

    申请号:US15546150

    申请日:2016-03-18

    Abstract: Provided is an anisotropic conductive film that allows conductive particles to be sufficiently captured even by connecting terminals disposed at a fine pitch and can suppress a short circuit, and in particular, that can suppress variation of conduction resistance of a connection portion even when partial contact is caused by a thermal pressing tool during anisotropic conductive connection. In an anisotropic conductive film 1A, an insulating adhesive layer 3 contains conductive particles 2. The conductive particles 2 have an aspect ratio of 1.2 or more and are dispersed without being in contact with each other as viewed in a plan view, and an angle formed between a film surface S of the anisotropic conductive film 1A and a major axis direction of each of the conductive particles 2 is less than 40°. The anisotropic conductive film 1A preferably contains columnar conductive glass particles as the conductive particles 2.

    ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

    公开(公告)号:US20170352967A1

    公开(公告)日:2017-12-07

    申请号:US15538525

    申请日:2015-12-22

    CPC classification number: H01R11/01 H01B1/20 H01B5/14 H01R13/2414 H05K3/323

    Abstract: An anisotropic electrically conductive film that is suitable for use in fine-pitch FOG connections and COG connections and that also can reduce increases in production costs associated with increasing the electrically conductive particle density. The anisotropic electrically conductive film includes an electrically insulating adhesive layer and electrically conductive particles disposed within the electrically insulating adhesive layer. The anisotropic electrically conductive film has electrically conductive particle disposition regions that are disposed in a manner corresponding to the arrangement of terminals of electronic components to be connected. The electrically conductive particle disposition regions are formed periodically in the longitudinal direction of the anisotropic electrically conductive film. The anisotropic electrically conductive film also has buffer regions in which no electrically conductive particles are disposed that are formed between adjacent electrically conductive particle disposition regions for connection.

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