High density capacitor integrated into focal plane array processing flow
    1.
    发明授权
    High density capacitor integrated into focal plane array processing flow 有权
    高密度电容器集成在焦平面阵列处理流程中

    公开(公告)号:US08895343B2

    公开(公告)日:2014-11-25

    申请号:US13859874

    申请日:2013-04-10

    申请人: DRS RSTA, Inc.

    摘要: Methods and structures of photodetectors are described. The structure may include a readout integrated circuit substrate having an internally integrated capacitor. The structure may additionally include an external capacitor overlying the readout integrated circuit substrate. The external capacitor may be coupled with the internally integrated capacitor of the readout integrated circuit substrate, and configured to operate in parallel with the internally integrated capacitor of the readout integrated circuit substrate. The structure may also include a detector overlying the external capacitor.

    摘要翻译: 描述了光电探测器的方法和结构。 该结构可以包括具有内部集成电容器的读出集成电路基板。 该结构可以另外包括覆盖读出集成电路基板的外部电容器。 外部电容器可以与读出集成电路基板的内部集成电容器耦合,并且被配置为与读出集成电路基板的内部集成电容器并联操作。 该结构还可以包括覆盖外部电容器的检测器。

    INTEGRATED RADIATION SHIELD AND RADIATION STOP
    2.
    发明申请
    INTEGRATED RADIATION SHIELD AND RADIATION STOP 有权
    集成辐射屏蔽和辐射停止

    公开(公告)号:US20140267763A1

    公开(公告)日:2014-09-18

    申请号:US14208462

    申请日:2014-03-13

    申请人: DRS RSTA, INC.

    摘要: An apparatus includes a detector that measures radiation. The apparatus also includes a window that is relationally coupled to the detector and a shield, so that the window is in between the detector and the shield. The apparatus further includes the shield that emits substantially constant radiation, and substantially blocks radiation from a camera housing at least partially surrounding the shield, so that the detector measures radiation passing through an optical system and the shield.

    摘要翻译: 一种装置包括测量辐射的检测器。 该装置还包括与检测器和屏蔽件相关地耦合的窗口,使得窗口位于检测器和屏蔽件之间。 该装置还包括屏蔽,其发射基本上恒定的辐射,并且基本上阻挡来自照相机外壳的至少部分围绕屏蔽的辐射,使得检测器测量通过光学系统和屏蔽的辐射。

    HIGH DENSITY CAPACITOR INTEGRATED INTO FOCAL PLANE ARRAY PROCESSING FLOW
    3.
    发明申请
    HIGH DENSITY CAPACITOR INTEGRATED INTO FOCAL PLANE ARRAY PROCESSING FLOW 审中-公开
    高密度电容器集成到焦平面阵列加工流程中

    公开(公告)号:US20150035108A1

    公开(公告)日:2015-02-05

    申请号:US14519486

    申请日:2014-10-21

    申请人: DRS RSTA, Inc.

    摘要: Methods and structures of photodetectors are described. The structure may include a readout integrated circuit substrate having an internally integrated capacitor. The structure may additionally include an external capacitor overlying the readout integrated circuit substrate. The external capacitor may be coupled with the internally integrated capacitor of the readout integrated circuit substrate, and configured to operate in parallel with the internally integrated capacitor of the readout integrated circuit substrate. The structure may also include a detector overlying the external capacitor.

    摘要翻译: 描述了光电探测器的方法和结构。 该结构可以包括具有内部集成电容器的读出集成电路基板。 该结构可以另外包括覆盖读出集成电路基板的外部电容器。 外部电容器可以与读出集成电路基板的内部集成电容器耦合,并且被配置为与读出集成电路基板的内部集成电容器并联操作。 该结构还可以包括覆盖外部电容器的检测器。

    HIGH DENSITY CAPACITOR INTEGRATED INTO FOCAL PLANE ARRAY PROCESSING FLOW
    5.
    发明申请
    HIGH DENSITY CAPACITOR INTEGRATED INTO FOCAL PLANE ARRAY PROCESSING FLOW 有权
    高密度电容器集成到焦平面阵列加工流程中

    公开(公告)号:US20140138786A1

    公开(公告)日:2014-05-22

    申请号:US13859874

    申请日:2013-04-10

    申请人: DRS RSTA, Inc.

    IPC分类号: H01L27/146

    摘要: Methods and structures of photodetectors are described. The structure may include a readout integrated circuit substrate having an internally integrated capacitor. The structure may additionally include an external capacitor overlying the readout integrated circuit substrate. The external capacitor may be coupled with the internally integrated capacitor of the readout integrated circuit substrate, and configured to operate in parallel with the internally integrated capacitor of the readout integrated circuit substrate. The structure may also include a detector overlying the external capacitor.

    摘要翻译: 描述了光电探测器的方法和结构。 该结构可以包括具有内部集成电容器的读出集成电路基板。 该结构可以另外包括覆盖读出集成电路基板的外部电容器。 外部电容器可以与读出集成电路基板的内部集成电容器耦合,并且被配置为与读出集成电路基板的内部集成电容器并联操作。 该结构还可以包括覆盖外部电容器的检测器。