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公开(公告)号:US20120086516A1
公开(公告)日:2012-04-12
申请号:US13253394
申请日:2011-10-05
IPC分类号: H03B5/30
CPC分类号: H03L1/028 , H05K1/0271 , H05K3/3442 , H05K2201/09063 , H05K2201/10083 , H05K2201/10636 , Y02P70/611
摘要: Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.
摘要翻译: 本发明提供一种可控制晶体振荡器,其可以减少大尺寸电路元件的焊接中出现的裂缝,提高可靠性。 它是一种烤箱控制的晶体振荡器,其中在设置在基板上的大尺寸电路部件的下表面的周边或下方形成有狭缝,此外,多个小型电路部件小于大 根据需要设置在大尺寸电路部件周围,对于多个小型电路部件,电连接的电子部件和未电气连接的虚拟电子部件, 被使用。
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公开(公告)号:US20120200366A1
公开(公告)日:2012-08-09
申请号:US13358818
申请日:2012-01-26
CPC分类号: H03H9/10 , H03H9/13 , H05K1/111 , H05K3/3442 , H05K2201/09781 , H05K2201/10075 , H05K2201/2036 , Y10T29/42 , Y10T29/49144
摘要: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.
摘要翻译: 提供了一种可以通过简单的结构以低成本抑制由温度变化引起的焊料裂纹并提高耐热循环性能的振荡器。 振荡器包括环氧树脂板和安装在板上的电子部件。 在电路板上形成两端电极图形,并通过焊料与电子部件的端子电极连接。 在与相应的端子电极连接的部分上的每个电极图案上形成突起,以在端子电极和电极图案之间形成空间,并且焊料在该空间中形成圆角。 这有助于提高焊料的粘附强度。
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3.
公开(公告)号:US20120098610A1
公开(公告)日:2012-04-26
申请号:US13253373
申请日:2011-10-05
CPC分类号: H05K3/3447
摘要: Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.
摘要翻译: 提供了一种烤箱控制的晶体振荡器,其中在将金属引线焊接到基板的情况下,即使在焊料中发生裂纹,其可靠性也不降低,并且制造方法。 也就是说,其中形成有用于使金属引线通过的通孔的基板的前表面和后表面上的开口周围形成预镀锡焊料的烤箱控制晶体振荡器; 并且在其表面上形成有焊锡层(预镀锡)的金属引线插入基板的贯通孔的状态下,从开口部延伸的金属引线焊接到前表面的开口部, 基板的后表面,以形成主焊料,并且提供了炉控晶体振荡器的制造方法。
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