公开(公告)号：US07068870B2

公开(公告)日：2006-06-27

申请号：US09983984

申请日：2001-10-26

申请人： Dan A. Steinberg ,  Neal Ricks ,  Mindaugas F. Dautartas ,  Hui Luo

发明人： Dan A. Steinberg ,  Neal Ricks ,  Mindaugas F. Dautartas ,  Hui Luo

IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/132 ,  G02B6/10 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/305 ,  G02B2006/1215 ,  G02B2006/12173 ,  G02B2006/12176 ,  G02B2006/12195

摘要： A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.

公开(公告)号：US06883977B2

公开(公告)日：2005-04-26

申请号：US10013084

申请日：2001-12-10

申请人： Mindaugas F. Dautartas ,  David W. Sherrer ,  Neal Ricks ,  Dan A. Steinberg

发明人： Mindaugas F. Dautartas ,  David W. Sherrer ,  Neal Ricks ,  Dan A. Steinberg

IPC分类号： G02B6/42 ,  H05K3/34 ,  G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/423 ,  G02B6/4232 ,  H05K3/3436

摘要： An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

摘要翻译： 光学器件封装包括衬底; 光纤，框架，以及可选的盖子和光学半导体部件。 框架的上表面包括在其上表面上与焊球垂直延伸的导电签证。 沿着衬底表面的导电迹线提供光学半导体部件和框架之间的电连通。 光学器件封装适于倒装芯片类型安装到电路板或其他安装表面。

公开(公告)号：US06627096B2

公开(公告)日：2003-09-30

申请号：US09847798

申请日：2001-05-02

申请人： David W. Sherrer ,  Gregory A. Ten Eyck ,  Dan A. Steinberg ,  Neal Ricks

发明人： David W. Sherrer ,  Gregory A. Ten Eyck ,  Dan A. Steinberg ,  Neal Ricks

IPC分类号： H01L2100

CPC分类号： B81C1/00126 ,  B81B2203/0384 ,  B81C1/00428 ,  B81C2201/0132 ,  B81C2201/014 ,  B81C2201/0178 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/423 ,  G02B2006/12176

摘要： Methods for making a micromachined device (e.g. an microoptical submount) having positive features (extending up from a device surface) and negative features (extending into the device surface). The present techniques locate the postive feature and negative features according to a single mask step. In one embodiment, a hard mask is patterned on top of the device layer of an SOI wafer. Then, RIE is used to vertically etch to the etch stop layer, forming the positive feature. Then, the positive feature is masked, and metal or hard mask is deposited on the exposed areas of the etch stop layer. Then, portions of the device layer are removed, leaving the patterned metal layer on the etch stop layer. Then, the etch stop layer is removed in an exposed area, uncovering the handle layer. Then, the handle layer is etched in an exposed area to form the negative feature.

摘要翻译： 用于制造具有正特征（从器件表面向上延伸）和负特征（延伸到器件表面）的微加工器件（例如，微光学基座）的方法。 本技术根据单个掩模步骤定位了后置特征和负特征。 在一个实施例中，在SOI晶片的器件层的顶部上形成硬掩模。 然后，RIE用于垂直蚀刻到蚀刻停止层，形成阳性特征。 然后，正面特征被掩蔽，并且金属或硬掩模沉积在蚀刻停止层的暴露区域上。 然后，去除器件层的部分，留下图案化的金属层在蚀刻停止层上。 然后，在曝光区域中去除蚀刻停止层，露出手柄层。 然后，在曝光区域中蚀刻手柄层以形成负面特征。

公开(公告)号：US06870981B2

公开(公告)日：2005-03-22

申请号：US09828842

申请日：2001-04-10

申请人： David W. Sherrer ,  Neal Ricks

发明人： David W. Sherrer ,  Neal Ricks

IPC分类号： G02B6/25 ,  G02B6/35 ,  G02B6/38 ,  G02B6/26 ,  G02B6/00

CPC分类号： G02B6/3506 ,  G02B6/25 ,  G02B6/3552 ,  G02B6/3863

摘要： A method for constructing an optical switch and the switch constructed thereby are described. An optical switch having a pair of chips is assembled with a plurality of optical fibers mounted on the chips such that endfaces of the fibers extend beyond ends of the chips. The optical fibers may be mounted by adhering them to the chips. The endfaces of the fibers and the front surfaces of the chips are then polished to provide coplanar surfaces which are good optical couplers. The chips are then etched with an etchant material which is ineffective at etching the optical fibers. The chips may include a coating which is resistant to the etchant material.

摘要翻译： 对构成光开关的方法和由此构成的开关进行说明。 具有一对芯片的光学开关与安装在芯片上的多个光纤组装，使得光纤的端面延伸超过芯片的端部。 光纤可以通过将它们粘附到芯片来安装。 然后将纤维的端面和芯片的前表面抛光以提供共面，这是良好的光耦合器。 然后用蚀刻剂材料蚀刻芯片，这在蚀刻光纤时无效。 芯片可以包括耐腐蚀剂材料的涂层。

公开(公告)号：US06613243B2

公开(公告)日：2003-09-02

申请号：US09911834

申请日：2001-07-25

申请人： Neal Ricks

发明人： Neal Ricks

IPC分类号： C23F100

CPC分类号： G02B3/0018 ,  B81C1/00396 ,  C03C15/00 ,  G02B3/0012 ,  G02B6/35 ,  G02B6/3636 ,  G02B6/3644 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/3854

摘要： A method of producing surface features in a substrate includes steps of forming a film having a composition that varies in the direction of its thickness on the substrate, forming a mask on the heterogeneous film, etching the film to thereby pattern the film, and etching the structure that includes the patterned film to erode the film and correspondingly shape the substrate as the film is so being eroded. In this way, the pattern of the film is transferred to the substrate in a manner dependent on the selectivity of one or both of the etching processes as well as the thickness of the discrete mask layers, or in the case of a continuously graded film, the “slope” of the stoichiometric change with respect to position in the overall thickness of the film.