摘要:
A method for testing a substrate by using a photoemission microscope is provided which includes providing the substrate and applying a reverse bias voltage to the substrate. The method further includes detecting light emissions from a top surface of the substrate and characterizing viability of the substrate from the detection of the light emissions.
摘要:
A system that detects multiple anomalies in a cluster of components is presented. During operation, the system monitors derivatives obtained from one or more inferential variables which are received from sensors in the cluster of components. The system then determines whether one or more components within the cluster have experienced an anomalous event based on the monitored derivatives. If so, the system performs one or more remedial actions.
摘要:
A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.
摘要:
One embodiment provides a system that analyzes an electrical connection in a computer system. During operation, the system monitors a reflection coefficient associated with the electrical connection and applies a sequential-analysis technique to the reflection coefficient to determine a statistical deviation of the reflection coefficient. Next, the system assesses the integrity of the electrical connection based on the statistical deviation of the reflection coefficient. Finally, the system uses the assessed integrity to maintain the electrical connection.
摘要:
A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the required testing hardware.
摘要:
One embodiment of the present invention provides a system that determines the reliability of a component in a system. During operation, the system monitors inferential variables associated with a number of specimens of the component. The system then collects degradation data by first computing a likelihood value that indicates whether an inferential variable associated with a specimen of the component is behaving normally or abnormally. Next, the system determines whether the specimen of the component has degraded based on the likelihood value. If the specimen of the component is determined to have degraded, the system records the time when the specimen of the component was determined to have degraded. The system also uses the degradation data to determine the reliability of the component in the system.
摘要:
Some embodiments of the present invention provide a system for in-situ characterization of a solid-state light. First, a voltage and a current of the solid-state light source are monitored. Then, the health of the solid-state light source is characterized based on an analysis of the monitored voltage and current.
摘要:
One embodiment of the present invention provides a system that performs a real-time root-cause-analysis for a degradation event associated with a component under test. During operation, the system monitors a telemetry signal collected from the component, and while doing so, attempts to detect an anomaly in the telemetry signal. If an anomaly is detected in the telemetry signal, the system performs a failure analysis on the telemetry signal in real-time while the telemetry signal is degrading. Next, the system identifies a failure mechanism for the component based on the failure analysis.
摘要:
Some embodiments of the present invention provide a system that determines the reliability of an interconnect. During operation, connectors in the interconnect are categorized into a set of predetermined groups. Next, the reliability for selected groups in the set of predetermined groups is determined. Then, a reliability model for the interconnect is generated based on the selected groups and the reliability of the selected groups to determine the overall reliability of the interconnect.
摘要:
A method for assessing a reliability of a complex component having a plurality of similar subcomponents is described. The complex component is divided into a plurality of component parts, each component part including at least one of the subcomponents. Specification ranges are identified for measured variables within which the component parts are considered to be operating within specification. The complex component is subjected to a reliability test and reliability data is obtained for the component parts by comparing the measured variable for each of the component parts with the specification ranges to determine failure times. A system and machine readable medium embodying program instructions is also provided.