摘要:
In a method of processing or drying a semiconductor wafer, the wafer is withdrawn from a fluid bath at an inclined angle, and at a selected withdrawal speed. A solvent vapor is provided at the surface of the bath, to create a surface tension gradient and promote drying, or removal of the fluid from the wafer surface. After the wafer is entirely withdrawn from the rinsing liquid, the wafer is rotated briefly, to remove any remaining fluid via centrifugal force, without the fluid drying on the wafer. The wafer is held onto a rotor assembly which rotates the wafer within an enclosed chamber, and which is also pivoted within the chamber, to position the wafer at the incline angle.
摘要:
An apparatus for processing or drying a semiconductor wafer includes a rotor for holding a wafer and for spinning the wafer about a first axis. A pivot arm supports the rotor, so that the rotor can pivot about a second axis that is substantially perpendicular to the first axis. A basin holding a processing fluid is located below the rotor, with the rotor vertically movable into and out of the processing fluid via an elevator supporting the pivot arm. The rotor is pivotable into a position where it holds the wafer at an inclined angle so that the wafer may be withdrawn from the processing fluid at said inclined angle to facilitate drying of the wafer.
摘要:
An apparatus for capping a stem web including a cooled roll, a first heated nip roll positioned to form a first nip with the cooled roll, and a second heated nip roll positioned to form a second nip with the cooled roll. The cooled roll has a diameter that is at least 30% larger than a diameter of the first or second heated nip roll. In an embodiment, the two nips are on opposite sides of a larger central cooled roll positioned between the heated rolls. In an embodiment, the reaction forces between the rolls are measured and controlled at each end of each of the heated rolls. The invention is particularly adapted to making abrasive particles that are attached to a driving mechanism via headed stem fasteners formed by the method.
摘要:
A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.
摘要:
A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.
摘要:
A processor for processing articles, such as semiconductor wafers, includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. An article extraction mechanism adapted to seal with the pod removes articles from the pod without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism adapted to seal with a pod in the interface section. The article insertion mechanism allows insertion of the articles into the pod after processing by at least one processing station.
摘要:
A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.
摘要:
An apparatus for rinsing and drying a semiconductor workpiece in a micro-environment is set forth. The apparatus includes a rotor motor and a rinser/dryer housing. The rinser/dryer housing is connected to be rotated by the rotor motor. The rinser/dryer housing further defines a substantially closed rinser/dryer chamber therein in which rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centripetal acceleration generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.
摘要:
A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.
摘要:
A centrifugal semiconductor processing system having a rotor which holds articles for centrifugal processing. The rotor includes a rotor frame with a receiver for holding the wafers or other articles in a spaced array without a wafer carrier to improve fluid access to the wafers. The rotor also has one or more retainers which are pivoted relative to the rotor to controllably urge the wafers into their desired processing positions. The retainers are preferably constructed to provide initial spring biasing with added restraining forces being generated during rotation. The processing system also preferably includes an implement mounted on a robot for loading the rotor, and a vision system to aid in the loading operation.