公开(公告)号：US07005010B2

公开(公告)日：2006-02-28

申请号：US10655210

申请日：2003-09-04

申请人： Eric Bergman ,  Dana Scranton ,  Erik Lund ,  Worm Lund

发明人： Eric Bergman ,  Dana Scranton ,  Erik Lund ,  Worm Lund

IPC分类号： B08B3/00 ,  F23B7/00

CPC分类号： B08B3/12 ,  Y10S134/902

摘要： A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

公开(公告)号：US20050199277A1

公开(公告)日：2005-09-15

申请号：US11054739

申请日：2005-02-09

申请人： Dana Scranton

发明人： Dana Scranton

IPC分类号： B08B3/12 ,  H01L21/00

CPC分类号： H01L21/67057 ,  B08B3/12

摘要： An apparatus for cleaning of a microelectronic workpiece having a front side, a back side, and an edge includes a chamber and a fixture within the chamber that is adapted to hold one or more microelectronic workpieces. At least one transducer is located within the chamber and preferably adjacent to the edge of the microelectronic workpiece. The method includes the steps of immersing the front side, back side, and edge of the microelectronic workpiece in a first processing fluid while preferably rotating the microelectronic workpiece. The microelectronic workpiece is then rinsed and dried and immersed in a second processing fluid such that the back side and edge of the microelectronic workpiece are immersed in the second processing fluid, while preferably rotating the microelectronic workpiece, without exposing the front surface of the microelectronic workpiece to the second processing fluid. Vibrational energy, preferably in the form of megasonics, is introduced during at least one of the immersions steps.

摘要翻译： 用于清洁具有前侧，后侧和边缘的微电子工件的设备包括腔室和室内的固定器，其适于容纳一个或多个微电子工件。 至少一个换能器位于腔室内并且优选地邻近微电子工件的边缘。 该方法包括以下步骤：将微电子工件的正面，背面和边缘浸入第一处理流体中，同时优选地旋转微电子工件。 然后将微电子工件冲洗并干燥并浸入第二处理流体中，使得微电子工件的背面和边缘浸入第二处理流体中，同时优选地旋转微电子工件，而不暴露微电子工件的前表面 到第二处理流体。 优选以兆声波形式的振动能量在至少一个浸入步骤期间引入。

公开(公告)号：US06691720B2

公开(公告)日：2004-02-17

申请号：US09907485

申请日：2001-07-16

申请人： Eric Bergman ,  Dana Scranton ,  Eric Lund ,  Gil Lund

发明人： Eric Bergman ,  Dana Scranton ,  Eric Lund ,  Gil Lund

IPC分类号： B08B300

CPC分类号： B08B3/12 ,  Y10S134/902

摘要： A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

摘要翻译： 用于处理工件的系统包括可枢转地支撑在外室内的内室。 内室具有开口以允许液体排出。 电动机使内腔枢转，使开口处于内腔液面之下或之下。 当内室转动时，液体排出。 内腔内的工件支撑在可固定或旋转的支架或转子上。 多个工艺可以在内腔内执行，减少了在各种装置之间移动工件的需要，并减少污染的风险。

公开(公告)号：US20080202564A1

公开(公告)日：2008-08-28

申请号：US11679479

申请日：2007-02-27

申请人： Dana Scranton

发明人： Dana Scranton

IPC分类号： B08B3/00

CPC分类号： H01L21/67028 ,  H01L21/67017 ,  H01L21/67207

摘要： A system for processing a workpiece includes a dry process chamber, such as a plasma etching chamber, and a wet process chamber, such as a spin/spray chamber. Gas supply lines supply gases to the dry process chamber, and to a chemical solution generator. A liquid supply line supplies a liquid, such as de-ionized water, to the chemical solution generator. The chemical solution generator manufactures liquid chemical solutions in situ, for point of use in the wet process chamber. The system allows for both wet and dry processing with few or no separate liquid chemical supply lines.

摘要翻译： 用于处理工件的系统包括诸如等离子体蚀刻室的干燥处理室和诸如旋转/喷雾室的湿处理室。 气体供应管线向干燥处理室和化学溶液发生器供应气体。 液体供应管线将诸如去离子水的液体供应到化学溶液发生器。 化学溶液发生器原位生产液体化学溶液，用于湿法处理室。 该系统允许湿式和干式加工，几乎没有或没有单独的液体化学品供应管线。

公开(公告)号：US20060118132A1

公开(公告)日：2006-06-08

申请号：US11005553

申请日：2004-12-06

申请人： Eric Bergman ,  Dana Scranton ,  Brian Aegerter

发明人： Eric Bergman ,  Dana Scranton ,  Brian Aegerter

IPC分类号： B08B3/12 ,  B08B3/00

CPC分类号： B08B3/02 ,  B08B3/10 ,  B08B3/12 ,  B08B2203/0288 ,  H01L21/02052 ,  H01L21/67051

摘要： In a method for cleaning a wafer, the wafer is placed a processing chamber. A layer or film of liquid is provided on the wafer. Electrically charged aerosol droplets of a liquid are formed and directed to the workpiece. The charged aerosol particles accumulate on the workpiece. This creates an electrical charge on the workpiece. Contaminant particles on the workpiece are released and/or repelled by the electrical charge and are carried away in the liquid layer. The liquid layer is optionally continuously replenished with fresh liquid. The liquid layer may be thinned out in a localized aerosol impingement area, via a jet of gas, to allow the electrical charge of the aerosol to better collect on or near the surface of the workpiece.

摘要翻译： 在清洁晶片的方法中，将晶片放置在处理室中。 在晶片上设置一层或多层液体。 形成液体的带电气溶胶液滴并将其导向工件。 带电气溶胶颗粒聚集在工件上。 这会在工件上产生电荷。 工件上的污染物颗粒被电荷释放和/或排斥，并在液体层中被带走。 任选地用新鲜液体连续补充液体层。 液体层可以通过气体喷射在局部气溶胶冲击区域中变薄，以允许气溶胶的电荷更好地收集在工件的表面上或附近。

公开(公告)号：US06668844B2

公开(公告)日：2003-12-30

申请号：US09907544

申请日：2001-07-16

申请人： Eric Lund ,  Joe Lanfrankie ,  Gil Lund ,  Dana Scranton ,  Eric Bergman

发明人： Eric Lund ,  Joe Lanfrankie ,  Gil Lund ,  Dana Scranton ,  Eric Bergman

IPC分类号： B08B300

CPC分类号： H01L21/67057 ,  B08B3/045 ,  Y10S134/902

摘要： Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

公开(公告)号：US06502591B1

公开(公告)日：2003-01-07

申请号：US09590724

申请日：2000-06-08

申请人： Dana Scranton ,  Ian Sharp

发明人： Dana Scranton ,  Ian Sharp

IPC分类号： B08B306

CPC分类号： H01L21/67034 ,  B08B3/06 ,  B08B3/10 ,  B08B3/12 ,  H01L21/67028

摘要： A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

摘要翻译： 用于冲洗和干燥半导体衬底的处理器包括容纳在外部容纳容器内的处理容器。 稀释的有机蒸气沿着包含在处理容器内的处理液体的表面产生马兰戈尼效应流。 处理容器包括多孔壁，其允许残留的化学物质，有机物质和其它不需要的物质从处理容器流到外部容器。 多孔壁允许维持稳定的表面张力梯度，以维持一致的马兰戈尼力，以使其均匀干燥。 替代处理流体优选地引入到处理容器中，以防止加工流体的表面层中的有机物质的积聚。

公开(公告)号：US06374837B2

公开(公告)日：2002-04-23

申请号：US09859930

申请日：2001-05-17

申请人： Dana Scranton ,  Gary L. Curtis

发明人： Dana Scranton ,  Gary L. Curtis

IPC分类号： B08B300

CPC分类号： H01L21/67034 ,  Y10S134/902

摘要： An apparatus for processing or drying a semiconductor wafer includes a rotor for holding a wafer and for spinning the wafer about a first axis. A pivot arm supports the rotor, so that the rotor can pivot about a second axis that is substantially perpendicular to the first axis. A basin holding a processing fluid is located below the rotor, with the rotor vertically movable into and out of the processing fluid via an elevator supporting the pivot arm. The rotor is pivotable into a position where it holds the wafer at an inclined angle so that the wafer may be withdrawn from the processing fluid at said inclined angle to facilitate drying of the wafer.

摘要翻译： 用于处理或干燥半导体晶片的装置包括用于保持晶片并围绕第一轴旋转晶片的转子。 枢转臂支撑转子，使得转子可围绕基本上垂直于第一轴线的第二轴线枢转。 保持加工流体的盆地位于转子下方，其中转子可通过支撑枢转臂的电梯竖直移动和移出加工流体。 转子可枢转到其以倾斜角度保持晶片的位置，使得晶片可以以所述倾斜角度从处理流体中取出，以促进晶片的干燥。

公开(公告)号：US20080060676A1

公开(公告)日：2008-03-13

申请号：US11530703

申请日：2006-09-11

申请人： Dana Scranton

发明人： Dana Scranton

IPC分类号： C23G1/00 ,  B08B7/00 ,  B08B3/00

CPC分类号： H01L21/02063 ,  B08B3/10

摘要： A method for cleaning vias, trenches, or other features on a workpiece, such as a semiconductor wafer, includes pre-heating the wafer to a desired temperature. A heated processing or cleaning fluid is then applied to the workpiece. The workpiece may be heated to a temperature higher than the temperature of the processing fluid, to increase the chemical reaction efficiency between the processing fluid and the workpiece features. The workpiece may be heated before or after being loaded into a processing chamber.

摘要翻译： 用于清洁工件（例如半导体晶片）上的通孔，沟槽或其它特征的方法包括将晶片预热到期望的温度。 然后将加热的加工或清洁流体施加到工件。 可以将工件加热到高于处理流体的温度的温度，以增加处理流体和工件特征之间的化学反应效率。 工件可以在装入处理室之前或之后被加热。

公开(公告)号：US06875284B2

公开(公告)日：2005-04-05

申请号：US10055302

申请日：2002-01-23

申请人： Dana Scranton

发明人： Dana Scranton

IPC分类号： B08B3/12 ,  H01L21/00 ,  B08B3/00

CPC分类号： H01L21/67057 ,  B08B3/12

摘要： A device for the side-specific cleaning of a microelectronic workpiece having a front side, a back side, and an edge includes a chamber, a fixture within the chamber that is adapted to hold one or more microelectronic workpieces. At least one transducer is located within the chamber and preferably adjacent to the edge of the microelectronic workpiece. The method includes the steps of immersing the front side, back side, and edge of the microelectronic workpiece in a first processing fluid while preferably rotating the microelectronic workpiece. The microelectronic workpiece is then rinsed and dried and immersed in a second processing fluid such that the back side and edge of the microelectronic workpiece are immersed in the second processing fluid, while preferably rotating the microelectronic workpiece, without exposing the front surface of the microelectronic workpiece to the second processing fluid. Vibrational energy, preferably in the form of megasonics, is introduced during at least one of the immersions steps.

摘要翻译： 用于侧面清洁具有前侧，后侧和边缘的微电子工件的装置包括腔室，室内的固定件，其适于容纳一个或多个微电子工件。 至少一个换能器位于腔室内并且优选地邻近微电子工件的边缘。 该方法包括以下步骤：将微电子工件的正面，背面和边缘浸入第一处理流体中，同时优选地旋转微电子工件。 然后将微电子工件冲洗并干燥并浸入第二处理流体中，使得微电子工件的背面和边缘浸入第二处理流体中，同时优选地旋转微电子工件，而不暴露微电子工件的前表面 到第二处理流体。 优选以兆声波形式的振动能量在至少一个浸入步骤期间引入。