摘要:
The invention relates to polysulfonamide compositions for use as redistribution layers as used in the manufacture of semiconductors and semiconductor packages. More specifically it relates to photoimageable polysulfonamide composition for redistribution applications. The invention also relates to the use of the compositions in semiconductor manufacture.
摘要:
The invention relates to polysulfonamide compositions for use as redistribution layers as used in the manufacture of semiconductors and semiconductor packages. More specifically it relates to photoimageable polysulfonamide composition for redistribution applications. The invention also relates to the use of the compositions in semiconductor manufacture.
摘要:
The present invention relates to methods of fabricating nanostructures using a replacement reaction. In a preferred embodiment, metal particles in an inert atmosphere undergo a replacement reaction to form a layer on the metal particle which is removed to form a high surface area nanostructure. A preferred embodiment includes the fabrication of heater elements, powders and heater assemblies using the nanostructures.
摘要:
The present invention relates to methods of fabricating nanostructures using a replacement reaction. In a preferred embodiment, metal particles in an inert atmosphere undergo a replacement reaction to form a layer on the metal particle which is removed to form a high surface area nanostructure. A preferred embodiment includes the fabrication of heater elements, powders and heater assemblies using the nanostructures.
摘要:
A selective hydrogenation catalyst for the seletive hydrogenation of unsaturated hydrocarbons, a process for preparing this catalyst and its use. The catalyst of the invention comprises a support, active component Pd, rare earth metals, and auxiliary metal Bi, Ag etc. The catalyst is able to hydrogenate high-unsaturated hydrocarbons such as alkyne with high selectivity at high space velocity while both green oil formation and carbon deposition on the catalyst are very low. It is applicable to an industrial cracking process.