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13 条记录 (耗时 0.021 秒)

    Method for Fabricating Micromachine Component of Resin
    3.
    发明申请
    Method for Fabricating Micromachine Component of Resin 失效
    制造树脂微机械成分的方法

    公开(公告)号：US20090035706A1

    公开(公告)日：2009-02-05

    申请号：US11922529

    申请日：2006-06-15

    申请人： Nao Honda ,  Satoshi Mori ,  Shuji Tanaka ,  Masayoshi Esashi

    发明人： Nao Honda ,  Satoshi Mori ,  Shuji Tanaka ,  Masayoshi Esashi

    IPC分类号： G03F7/20

    CPC分类号： F04D29/281 ,  B29C64/106 ,  B29C64/124 ,  B29L2031/7496 ,  B81C99/008 ,  F04D29/023 ,  F05D2230/31 ,  F05D2300/44

    摘要： A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge potion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.

    摘要翻译： 一种用于制造树脂微机械部件的方法，包括在基板上形成牺牲层的步骤（a），在牺牲层上依次形成至少两个感光性树脂组合物层的步骤（b），并对各感光性树脂组合物进行光刻 以形成限定微机械部件的周向边缘部分的气隙部分和构成微机械部件的内部结构以形成多层结构的气隙部分，用于在多层结构上沉积干膜抗蚀剂的步骤（c） 并进行干膜抗蚀剂层的光刻，形成固化的干膜抗蚀剂层，其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙 形成，并且步骤（d）用于分离具有多层st的微机械部件 通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层的结构。

    Permanent resist composition, cured product thereof, and use thereof
    4.
    发明申请
    Permanent resist composition, cured product thereof, and use thereof 审中-公开
    永久抗蚀剂组合物，其固化产物及其用途

    公开(公告)号：US20050260522A1

    公开(公告)日：2005-11-24

    申请号：US11054651

    申请日：2005-02-09

    申请人： William Weber ,  Satoshi Mori ,  Nao Honda ,  Donald Johnson ,  Manuel DoCanto

    发明人： William Weber ,  Satoshi Mori ,  Nao Honda ,  Donald Johnson ,  Manuel DoCanto

    IPC分类号： C08G59/32 ,  C08G59/68 ,  G03C1/492 ,  G03F7/00 ,  G03F7/038

    CPC分类号： G03F7/0385 ,  B82Y10/00 ,  B82Y40/00 ,  C08G59/3218 ,  C08G59/687 ,  G03F7/0002 ,  G03F7/001 ,  G03F7/038 ,  H05K3/287

    摘要： A permanent photoresist composition comprising: (A) one or more bisphenol A-novolac epoxy resins according to Formula I; wherein each group R in Formula I is individually selected from glycidyl or hydrogen and k in Formula I is a real number ranging from 0 to about 30; (B) one or more epoxy resins selected from the group represented by Formulas BIIa and BIIb; wherein each R1, R2 and R3 in Formula BIIa are independently selected from the group consisting of hydrogen or alkyl groups having 1 to 4 carbon atoms and the value of p in Formula BIIa is a real number ranging from 1 to 30; the values of n and m in Formula BIIb are independently real numbers ranging from 1 to 30 and each R4 and R5 in Formula BIIb are independently selected from hydrogen, alkyl groups having 1 to 4 carbon atoms, or trifluoromethyl; (C) one or more cationic photoinitiators (also known as photoacid generators or PAGs); and (D) one or more solvents.

    摘要翻译： 一种永久性光致抗蚀剂组合物，其包含：（A）根据式I的一种或多种双酚A-酚醛清漆环氧树脂; 其中式I中的每个基团R各自选自缩水甘油基或氢，式I中的k为0至约30的实数; （B）选自由式BIIa和BIIb表示的基团中的一种或多种环氧树脂; 其中式BIIa中的每个R 1，R 2和R 3各自独立地选自氢或具有1至4个碳原子的烷基 碳原子，式BIIa中的p的值为1〜30的实数; 式BIIb中的n和m的值独立地为1至30的实数，并且式BIIb中的每个R 4和R 5独立地选自氢，烷基 具有1至4个碳原子，或三氟甲基; （C）一种或多种阳离子光引发剂（也称为光酸产生剂或PAG）; 和（D）一种或多种溶剂。

    Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them
    7.
    发明授权
    Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them 有权
    光刻胶组合物，其硬化形式，其硬化图案和使用它们形成的金属图案

    公开(公告)号：US07282324B2

    公开(公告)日：2007-10-16

    申请号：US11028455

    申请日：2005-01-03

    申请人： William Weber ,  Satoshi Mori ,  Nao Honda

    发明人： William Weber ,  Satoshi Mori ,  Nao Honda

    IPC分类号： G03F7/40

    CPC分类号： G03F7/40 ,  G03F7/038

    摘要： Photoresist compositions that demonstrate superior photolithographic performance and hardened resist films that show superior resistance to solvents, have excellent resistance to under plating during the electrodeposition of metals, and show excellent resist stripping characteristics. These photoresist compositions according to the invention are well-suited as for applications in the manufacture of MEMS and micromachine devices. These photoresist compositions according to the invention comprise one or more epoxide-substituted, polycarboxylic acid Resin Component (A), one or more photoacid generator compounds (B), and one or more solvent (C).

    摘要翻译： 显示优异的光刻性能的光刻胶组合物和显示出优异的耐溶剂性的硬化抗蚀剂膜，在金属电沉积期间具有优异的耐电镀性，并且显示出优异的抗剥离特性。 根据本发明的这些光致抗蚀剂组合物非常适用于制造MEMS和微机械装置的应用。 根据本发明的这些光致抗蚀剂组合物包含一种或多种环氧化物取代的多元羧酸树脂组分（A），一种或多种光酸产生剂化合物（B）和一种或多种溶剂（C）。

    Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them
    8.
    发明申请
    Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them 有权
    光刻胶组合物，其硬化形式，其硬化图案和使用它们形成的金属图案

    公开(公告)号：US20050147918A1

    公开(公告)日：2005-07-07

    申请号：US11028455

    申请日：2005-01-03

    申请人： William Weber ,  Satoshi Mori ,  Nao Honda

    发明人： William Weber ,  Satoshi Mori ,  Nao Honda

    IPC分类号： G03C1/76 ,  G03F7/038 ,  G03F7/40

    CPC分类号： G03F7/40 ,  G03F7/038

    摘要： Photoresist compositions that demonstrate superior photolithographic performance and hardened resist films that show superior resistance to solvents, have excellent resistance to under plating during the electrodeposition of metals, and show excellent resist stripping characteristics. These photoresist compositions according to the invention are well-suited as for applications in the manufacture of MEMS and micromachine devices. These photoresist compositions according to the invention comprise one or more epoxide-substituted, polycarboxylic acid Resin Component (A), one or more photoacid generator compounds (B), and one or more solvent (C).

    摘要翻译： 显示优异的光刻性能的光刻胶组合物和显示出优异的耐溶剂性的硬化抗蚀剂膜，在金属电沉积期间具有优异的耐电镀性，并且显示出优异的抗剥离特性。 根据本发明的这些光致抗蚀剂组合物非常适用于制造MEMS和微机械装置的应用。 根据本发明的这些光致抗蚀剂组合物包含一种或多种环氧化物取代的多元羧酸树脂组分（A），一种或多种光酸产生剂化合物（B）和一种或多种溶剂（C）。

    Photosensitive resin composition and cured product thereof
    9.
    发明授权
    Photosensitive resin composition and cured product thereof 有权
    感光性树脂组合物及其固化物

    公开(公告)号：US09223212B2

    公开(公告)日：2015-12-29

    申请号：US14234199

    申请日：2012-07-26

    申请人： Misato Oonishi ,  Shinya Inagaki ,  Naoko Imaizumi ,  Nao Honda

    发明人： Misato Oonishi ,  Shinya Inagaki ,  Naoko Imaizumi ,  Nao Honda

    IPC分类号： G03F7/038 ,  C08G59/42 ,  G03F7/40

    CPC分类号： G03F7/038 ,  C08G59/42 ,  G03F7/40

    摘要： An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.

    摘要翻译： 一种碱显影型感光性树脂组合物，其含有：通过使多元酸酐（c）与反应物（ab）在两端具有环氧基的双官能双酚环氧树脂（a）反应而得到的多元羧酸树脂（A） 环氧当量为600-1300g / eq。和具有醇羟基的单羧酸化合物（b）; 在分子中具有两个以上环氧基的环氧树脂（B） 和光酸产生剂（C），其中一元羧酸化合物（b）相对于环氧树脂（a）的1当量环氧基的添加比例为80当量％以上，多元酸酐与 相对于一当量的反应物（ab）的伯羟基为80当量％以上。