Multiprocessor computer having configurable hardware system domains
    1.
    发明授权
    Multiprocessor computer having configurable hardware system domains 失效
    具有可配置硬件系统域的多处理器计算机

    公开(公告)号:US5931938A

    公开(公告)日:1999-08-03

    申请号:US763934

    申请日:1996-12-12

    CPC分类号: G06F15/17375

    摘要: Global address and data routers interconnect individual system units each having its own processors, memory, and I/O. A domain filter coupled to the routers dynamically defines groups of system units as domains and clusters of domains which have both software and hardware isolation from each other. Clusters can share dynamically definable ranges of memory with each other. The domain filter has software-loadable registers on the system units and in the global routers to set the parameters of the domains and clusters. The registers label individual inter-system transactions on the routers as invalid for system units not in the same domain or cluster as the originating unit.

    摘要翻译: 全局地址和数据路由器互连各自的系统单元,每个单元具有自己的处理器,存储器和I / O。 耦合到路由器的域过滤器动态地将系统单元组定义为具有彼此之间的软件和硬件彼此隔离的域和域集合。 群集可以彼此共享动态可定义的内存范围。 域过滤器在系统单元和全局路由器中具有软件可加载寄存器,用于设置域和群集的参数。 这些寄存器将路由器上的单个系统间事务标记为与始发单元不在同一域或集群中的系统单元无效。

    Multiprocessor computer having configurable hardware system domains
    2.
    再颁专利
    Multiprocessor computer having configurable hardware system domains 有权
    具有可配置硬件系统域的多处理器计算机

    公开(公告)号:USRE41293E1

    公开(公告)日:2010-04-27

    申请号:US09920433

    申请日:2001-08-01

    CPC分类号: G06F15/17375

    摘要: Global address and data routers interconnect individual system units each having its own processors, memory, and I/O. A domain filter coupled to the routers dynamically defines groups of system units as domains and clusters of domains which have both software and hardware isolation from each other. Clusters can share dynamically definable ranges of memory with each other. The domain filter has software-loadable registers on the system units and in the global routers to set the parameters of the domains and clusters. The registers label individual inter-system transactions on the routers as invalid for system units not in the same domain or cluster as the originating unit.

    摘要翻译: 全局地址和数据路由器互连各自的系统单元,每个单元具有自己的处理器,存储器和I / O。 耦合到路由器的域过滤器动态地将系统单元组定义为具有彼此之间的软件和硬件彼此隔离的域和域集合。 群集可以彼此共享动态可定义的内存范围。 域过滤器在系统单元和全局路由器中具有软件可加载寄存器,用于设置域和群集的参数。 这些寄存器将路由器上的单个系统间事务标记为与始发单元不在同一域或集群中的系统单元无效。

    Direct-execution microprogrammable microprocessor system
    3.
    发明授权
    Direct-execution microprogrammable microprocessor system 失效
    直接执行微程序微处理器系统

    公开(公告)号:US4761733A

    公开(公告)日:1988-08-02

    申请号:US710615

    申请日:1985-03-11

    IPC分类号: G06F9/22 G06F12/08 G06F12/10

    摘要: A direct-execution microprogrammable microprocessor system uses an emulatory microprogrammable microprocessor for direct execution of microinstructions in main memory through a microinstruction port. A microinstruction cache with a microinstruction address extension unit serving to communicate microinstructions from the main memory to the microprogrammable microprocessor. Virtual main memory accesses occur through a system multiplexer. A virtual address extension unit and a virtual address bus provide extension and redefinition of the main memory address space of the microprogrammable microprocessor. The system also uses a context switching stack cache and an expanded address translation cache with the microprogrammable microprocessor having a reduced and redefined microinstruction set with a variable microinstruction cycle.

    摘要翻译: 直接执行微程序微处理器系统使用可编程微程序微处理器来通过微指令端口直接执行主存储器中的微指令。 具有微指令地址扩展单元的微指令缓存,用于将从主存储器的微指令传送到微程序微处理器。 虚拟主存储器访问通过系统多路复用器进行。 虚拟地址扩展单元和虚拟地址总线提供微程序微处理器的主存储器地址空间的扩展和重新定义。 该系统还使用上下文切换堆栈高速缓存和扩展的地址转换高速缓存,其中微程序微处理器具有具有可变微指令周期的简化和重新定义的微指令集。

    Electrically alterable memory cell
    4.
    发明授权
    Electrically alterable memory cell 失效
    电可变存储单元

    公开(公告)号:US4224686A

    公开(公告)日:1980-09-23

    申请号:US947927

    申请日:1978-10-02

    IPC分类号: G11C14/00 G11C11/40 G11C17/00

    CPC分类号: G11C14/00

    摘要: An electrically alterable memory cell is described which has a capacitive imbalance for causing the memory cell to assume either of its two stable states, and which uses a capacitor as a non-volatile storage element for retaining the information stored in the memory cell during power down operation. The capacitor has an alterable capacitance-voltage curve which is employed to identify the information in the bistable multivibrator just prior to loss of power. When power is returned, the capacitor causes the bistable multivibrator to assume that stable state in which it was operating at the time power was lost.

    摘要翻译: 描述了一种电可改变的存储单元,其具有用于使存储器单元呈现其两个稳定状态中的任一种的电容性不平衡,并且其使用电容器作为非易失性存储元件,用于在掉电期间保存存储在存储单元中的信息 操作。 电容器具有可变的电容 - 电压曲线,用于在功率损失之前识别双稳态多谐振荡器中的信息。 当电源返回时,电容器会导致双稳态多谐振荡器在功率损耗时处于稳定状态。

    CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS
    5.
    发明申请
    CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS 审中-公开
    芯片组件配置与密封包装光学互连

    公开(公告)号:US20130230272A1

    公开(公告)日:2013-09-05

    申请号:US13410113

    申请日:2012-03-01

    IPC分类号: G02B6/12

    摘要: A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).

    摘要翻译: 芯片组装配置包括在一侧具有集成电路的基板和另一侧上的转换机构。 集成电路和转换机构通过穿过衬底的短电传输线电耦合。 此外,转换机构在电区域和光学域之间转换信号,从而允许集成电路与使用光通信的其他部件和设备(例如,在光纤或光波导中)之间的高速通信。

    Method and system for cooling electronic equipment
    6.
    发明申请
    Method and system for cooling electronic equipment 审中-公开
    冷却电子设备的方法和系统

    公开(公告)号:US20070283710A1

    公开(公告)日:2007-12-13

    申请号:US11451281

    申请日:2006-06-12

    IPC分类号: F25D23/12 F25D17/04

    CPC分类号: H05K7/20754 H05K7/20836

    摘要: A system includes electronic equipment, a device arranged to cool air using a refrigerant, the device secured to one of a top side and a bottom side of the electronic equipment, and a housing arranged to enclose the electronic equipment and the device, where the cooled air is propagated from one of the top side and the bottom side of the electronic equipment to the other one of the top side and the bottom side of the electronic equipment.

    摘要翻译: 一种系统包括电子设备,布置成使用制冷剂冷却空气的设备,该设备固定在电子设备的顶侧和底侧中的一个以及被包围电子设备和设备的壳体,其中冷却 空气从电子设备的顶侧和底侧之一传播到电子设备的顶侧和底侧的另一个。

    Victim invalidation
    7.
    发明授权
    Victim invalidation 有权
    受害者无效

    公开(公告)号:US06961827B2

    公开(公告)日:2005-11-01

    申请号:US10011115

    申请日:2001-11-13

    IPC分类号: G06F12/08 G06F12/12 G06F12/00

    摘要: The present invention provides a method and apparatus for invalidating a victimized entry. The apparatus comprises a directory cache adapted to store one or more cache entries, and a control unit. The control unit is adapted to determine whether it is desirable to remove a shared cache entry from the directory cache, and invalidate the shared cache entry in response to determining that it is desirable to remove the shared cache entry from the directory cache.

    摘要翻译: 本发明提供一种使受害条目无效的方法和装置。 该装置包括适于存储一个或多个高速缓存条目的目录缓存器和控制单元。 控制单元适于确定是否期望从目录高速缓存中移除共享高速缓存条目,并且响应于确定希望从目录高速缓存中移除共享高速缓存条目而使共享高速缓存条目无效。

    Thermal transfer technique using heat pipes with integral rack rails
    8.
    发明授权
    Thermal transfer technique using heat pipes with integral rack rails 有权
    热传导技术使用带整体机架导轨的热管

    公开(公告)号:US07626820B1

    公开(公告)日:2009-12-01

    申请号:US12121303

    申请日:2008-05-15

    IPC分类号: H05K7/20 F28F1/00

    CPC分类号: H05K7/20672 F28D15/0266

    摘要: A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus.

    摘要翻译: 用于冷却发热电子部件的热转印装置包括设置在发热电子部件上并与发热电子部件热耦合的蒸发器,多个热管,其承载设置在蒸发器上方的工作流体,并且热 耦合到蒸发器,热耦合到多个热管的第一端的冷板和与多个热管的第二端热耦合的冷凝器。 热管在蒸发器上延伸,使得热管的第一端和第二端在不超过发热电子部件的位置连接到冷板和冷凝器。 冷热板和冷凝器从热转印装置的外部供应冷却剂。

    THERMAL TRANSFER TECHNIQUE USING HEAT PIPES WITH INTEGRAL RACK RAILS
    9.
    发明申请
    THERMAL TRANSFER TECHNIQUE USING HEAT PIPES WITH INTEGRAL RACK RAILS 有权
    使用带有整体式货架轨道的热管道进行热传递技术

    公开(公告)号:US20090284924A1

    公开(公告)日:2009-11-19

    申请号:US12121303

    申请日:2008-05-15

    IPC分类号: H05K7/20 F28D15/02

    CPC分类号: H05K7/20672 F28D15/0266

    摘要: A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus.

    摘要翻译: 用于冷却发热电子部件的热转印装置包括设置在发热电子部件上并与发热电子部件热耦合的蒸发器,多个热管,其承载设置在蒸发器上方的工作流体,并且热 耦合到蒸发器,热耦合到多个热管的第一端的冷板和与多个热管的第二端热耦合的冷凝器。 热管在蒸发器上延伸,使得热管的第一端和第二端在不超过发热电子部件的位置连接到冷板和冷凝器。 冷热板和冷凝器从热转印装置的外部供应冷却剂。

    Mechanism for cooling electronic components
    10.
    发明申请
    Mechanism for cooling electronic components 审中-公开
    冷却电子元件的机构

    公开(公告)号:US20080013283A1

    公开(公告)日:2008-01-17

    申请号:US11488281

    申请日:2006-07-17

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20772

    摘要: A mechanism is disclosed for cooling electronic components of a module housed in a chassis. The chassis may be, for example, a rack or other housing, which may contain many such modules. The system comprises an external cooling system, and an internal cooling system for cooling electronic components on the module. The internal cooling system may reside on the module. The internal cooling system can be removed from the chassis to enable servicing components on the module without disconnecting any lines carrying cooling fluid in either fluid cooling system.

    摘要翻译: 公开了用于冷却容纳在底盘中的模块的电子部件的机构。 底盘可以是例如可以包含许多这样的模块的机架或其他壳体。 该系统包括外部冷却系统和用于冷却模块上的电子部件的内部冷却系统。 内部冷却系统可能位于模块上。 内部冷却系统可以从机箱中取出,以便维护模块上的组件,而无需断开任何流体冷却系统中承载冷却液体的管路。