摘要:
A method of programming a memory cell with a substrate that includes a first region and a second region with a channel therebetween and a gate above the channel, and a charge trapping region that contains a first amount of charge. The method includes applying a constant first voltage across the gate, applying a second constant voltage across the first region and applying a third voltage that is constant and negative to the substrate so that the effect of spillover electrons is substantially reduced when compared with when the third constant voltage is absent.
摘要:
An erase operation is performed on a non-volatile memory cell with an oxide-nitride-oxide structure by using an initial negative gate erase voltage to improve the speed and performance of the non-volatile memory cell after many program-erase cycles. By utilizing a negative gate erase voltage, the cell does not require increased erase time to reduce the cell threshold and avoid incomplete erase conditions as the number of program-erase cycles increases.
摘要:
An erase operation is performed on a non-volatile memory cell with an oxide-nitride-oxide structure by using a negative gate erase voltage during an erase procedure to improve the speed and performance of the non-volatile memory cell after many program-erase cycles. During the erase procedure, an erase cycle is applied followed by a read cycle until the cell has a threshold erased below a desired value. For the initial erase cycle in the procedure, an initial negative gate voltage is applied. In subsequent erase cycles, a sequentially decreasing negative gate voltage is applied until the threshold is reduced below the desired value. In one embodiment, after erase is complete, the last negative gate voltage value applied is stored in a separate memory. After a subsequent programming when the erase procedure is again applied, the initial negative gate voltage applied is the negative gate voltage value for the cell stored in memory.
摘要:
An erase operation is performed on a non-volatile memory cell with an oxide-nitride-oxide structure having charge stored near both the source and drain. During the erase operation, a negative gate erase voltage is applied along with a positive source and drain voltage to improve the speed of erase operations and performance of the non-volatile memory cell after many program-erase cycles.
摘要:
A memory cell that includes a substrate that has a first region and a second region with a channel therebetween, wherein the first region generates hot carriers. The memory cell further includes a gate above the channel and a charge trapping region that contains a first amount of charge. A current limiter that limits the number of the generated hot carriers that can flow into the channel, wherein the current limiter does not control the voltage of the second region.
摘要:
A programming operation using hot carrier injection is performed on a non volatile memory cell having an oxide-nitride-oxide structure by applying a first train of voltage pulses to he drain and a second train of voltage pulses to the gate. The programming method of the present invention prevents over-programming, minimizes programming time, and increases memory cell endurance and reliability.
摘要:
A method of erasing a memory cell that includes a first region and a second region with a channel therebetween and a gate above the channel, and a charge trapping region that contains a first amount of charge. The method includes: applying a voltage across the gate and the first region in accordance with a coarse erase sequence of voltages so that a portion of the first amount of charge is removed from the charge trapping region; and applying a voltage across the gate and the first region in accordance with a fine erase sequence of voltages so that a portion of the first amount of charge is removed from the charge trapping region.
摘要:
One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; and forming gates in the core region and the periphery region.
摘要:
One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; and forming gates in the core region and the periphery region.
摘要:
One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; removing at least a portion of the charge trapping dielectric positioned over the buried bitlines in the core region; forming a bitline isolation over the buried bitlines in the core region; and forming gates in the core region and the periphery region. Another aspect of the present invention relates to increasing the thickness of the gate dielectric in at least a portion of the periphery region simultaneously while forming the bitline isolation.