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15 条记录 (耗时 0.025 秒)

    Technique for reducing backside particles
    1.
    发明申请
    Technique for reducing backside particles 审中-公开
    降低背面颗粒的技术

    公开(公告)号：US20060124155A1

    公开(公告)日：2006-06-15

    申请号：US11239000

    申请日：2005-09-30

    申请人： David Suuronen ,  Arthur Riaf ,  Paul Buccos ,  Kevin Daniels ,  Paul Murphy ,  Lawrence Ficarra ,  Kenneth Starks

    发明人： David Suuronen ,  Arthur Riaf ,  Paul Buccos ,  Kevin Daniels ,  Paul Murphy ,  Lawrence Ficarra ,  Kenneth Starks

    IPC分类号： B08B3/02

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B3/024 ,  B08B5/02 ,  C23C16/4407

    摘要： A technique for reducing backside particles is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for reducing backside particles. The apparatus may comprise a delivery mechanism configured to supply a cleaning substance to a platen, wherein the platen is housed in a process chamber. The apparatus may also comprise a control unit configured to cause the process chamber to reach a first pressure level, cause the cleaning substance to be supplied to a surface of the platen, and cause the process chamber to reach a second pressure level, thereby removing contaminant particles, together with the cleaning substance, from the surface of the platen.

    摘要翻译： 公开了一种减少背面颗粒的技术。 在一个特定的示例性实施例中，该技术可以被实现为用于减少背面颗粒的装置。 该装置可以包括配置成将清洁物质供应到压板的输送机构，其中压板容纳在处理室中。 该设备还可以包括控制单元，该控制单元被配置为使处理室达到第一压力水平，使得清洁物质被供应到压板的表面，并使处理室达到第二压力水平，从而去除污染物 颗粒与清洁物质一起从压板的表面。

    Clamp for use in processing semiconductor workpieces
    2.
    发明申请
    Clamp for use in processing semiconductor workpieces 有权

    公开(公告)号：US20060171094A1

    公开(公告)日：2006-08-03

    申请号：US11263113

    申请日：2005-10-31

    申请人： Richard Muka ,  Paul Murphy ,  David Suuronen

    发明人： Richard Muka ,  Paul Murphy ,  David Suuronen

    IPC分类号： H01T23/00

    CPC分类号： H01L21/6831 ,  H01L21/6875 ,  H01L21/68757

    摘要： An apparatus is provided to improve clamping of a work piece to a support surface. The apparatus includes a support base, an insulator layer disposed on the support base, an electrode layer disposed on the insulator layer, and a clamping layer comprising aluminum oxynitride disposed on the electrode layer wherein the workpiece is clamped to the surface of the clamping layer. The apparatus provides a higher clamping force for the workpiece while reducing gas leakage and particle levels in addition to maintaining a declamping time suitable for high throughput processing. The apparatus may further provide a raised surface geometry or embossments on the dielectric or a dielectric comprising an outer ring a center cavity for reducing particle contamination to the backside of the workpiece. Also, a thin wall sleeve may be provided between the base and the insulator and alternating current may be applied to opposite ones of interdigitated electrode pairs to reduce particle contamination and improve the implantation uniformity.

    Clamp for use in processing semiconductor workpieces
    3.
    发明申请
    Clamp for use in processing semiconductor workpieces 审中-公开
    夹具用于加工半导体工件

    公开(公告)号：US20060012939A1

    公开(公告)日：2006-01-19

    申请号：US11101832

    申请日：2005-04-08

    申请人： David Suuronen ,  Paul Murphy

    发明人： David Suuronen ,  Paul Murphy

    IPC分类号： H01L21/683

    CPC分类号： H01L21/6875 ,  H01L21/6831 ,  H01L21/68757

    摘要： An apparatus is provided to improve clamping of a work piece to a support surface. The apparatus includes a support base, an insulator layer disposed on the support base, an electrode layer disposed on the insulator layer, and a clamping layer comprising aluminum oxynitride disposed on the electrode layer wherein the workpiece is clamped to the surface of the clamping layer. The apparatus provides a higher clamping force for the workpiece while reducing gas leakage and particle levels in addition to maintaining a declamping time suitable for high throughput processing. The apparatus may also include a support base, an insulator layer disposed on the support base, an electrode layer disposed on the insulator layer, and a clamping layer comprising a dielectric layer and a resilient material layer disposed on the electrode layer wherein the workpiece is clamped to the surface of the clamping layer. The apparatus and configurations of the dielectric and resilient layers further reduce backside particle generation while providing a high clamping force for the workpiece.

    摘要翻译： 提供了一种用于改进将工件夹持到支撑表面上的装置。 该装置包括支撑基座，设置在支撑基座上的绝缘体层，设置在绝缘体层上的电极层，以及包括设置在电极层上的氮氧化铝的夹持层，其中工件被夹持在夹持层的表面上。 该设备为工件提供更高的夹紧力，同时减少气体泄漏和颗粒水平，同时保持适合于高通量处理的延迟时间。 该装置还可以包括支撑基座，设置在支撑基座上的绝缘体层，设置在绝缘体层上的电极层，以及夹持层，其包括电介质层和设置在电极层上的弹性材料层，其中工件被夹紧 到夹紧层的表面。 电介质和弹性层的装置和结构进一步减少背面的颗粒产生，同时为工件提供高的夹紧力。

    PLATEN CLEANING METHOD
    4.
    发明申请
    PLATEN CLEANING METHOD 审中-公开
    板清洗方法

    公开(公告)号：US20130037052A1

    公开(公告)日：2013-02-14

    申请号：US13588820

    申请日：2012-08-17

    申请人： David Suuronen ,  Frederick B. Ammon ,  David Burgdorf ,  Lyudmila Stone

    发明人： David Suuronen ,  Frederick B. Ammon ,  David Burgdorf ,  Lyudmila Stone

    IPC分类号： B08B7/00

    CPC分类号： B08B7/0028 ,  C23C14/48 ,  C23C14/564 ,  H01J37/20 ,  H01J37/32412 ,  H01J2237/022 ,  H01J2237/31701

    摘要： A method for cleaning a workpiece support that includes using a workpiece that has been coated on its bottom surface with a suitable material is disclosed. This specially coated workpiece is placed on the support, and some time later, it is removed, taking with it particles from the support. In certain embodiments, the workpiece undergoes an ion implantation process to increase its temperature, and to increase the tackiness of the coating on the bottom surface. The material used to coat the bottom can be of variable types, including photoresists, oxides and deposited glasses.

    摘要翻译： 公开了一种用于清洁工件支撑件的方法，其包括使用已经涂覆在其底部表面上的合适材料的工件。 将这种特殊涂层的工件放置在支架上，一段时间后，将其从支架上取下来。 在某些实施例中，工件经历离子注入工艺以增加其温度，并增加涂层在底面上的粘性。 用于涂覆底部的材料可以是可变的类型，包括光致抗蚀剂，氧化物和沉积的玻璃。

    TRIBOELECTRIC CHARGE CONTROLLED ELECTROSTATIC CLAMP
    6.
    发明申请
    TRIBOELECTRIC CHARGE CONTROLLED ELECTROSTATIC CLAMP 有权
    TRIBOELECTRIC CHARGE控制静电夹

    公开(公告)号：US20120200980A1

    公开(公告)日：2012-08-09

    申请号：US13021838

    申请日：2011-02-07

    申请人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

    发明人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

    IPC分类号： H05F3/02

    CPC分类号： H01L21/6831

    摘要： An electrostatic clamp which more effectively removes built up charge from a substrate prior to removal is disclosed. Currently, the lift pins and the ground pins are the only mechanism used to remove charge from the substrate after implantation. The present discloses describes an electrostatic chuck in which the top dielectric surface has an embedded conductive region, such as a ring shaped conductive region in the sealing ring. Thus, regardless of the orientation of the substrate during release, at least a portion of the substrate will contain the conductive region on the dielectric layer of the workpiece support. This conductive region may be connected to ground through the use of conductive vias in the dielectric layer. In some embodiments, these conductive vias are the fluid conduits used to supply gas to the back side of the substrate.

    摘要翻译： 公开了一种在去除之前更有效地从衬底去除积聚电荷的静电夹。 目前，升降针和接地引脚是用于在植入后从衬底去除电荷的唯一机制。 本公开描述了一种静电卡盘，其中顶部电介质表面具有嵌入的导电区域，例如密封环中的环形导电区域。 因此，无论衬底在释放过程中的取向如何，衬底的至少一部分将包含工件支撑体的电介质层上的导电区域。 该导电区域可以通过使用电介质层中的导电通孔而连接到地。 在一些实施例中，这些导电通孔是用于向衬底的背侧供应气体的流体导管。

    Triboelectric charge controlled electrostatic clamp
    7.
    发明授权
    Triboelectric charge controlled electrostatic clamp 有权
    摩擦电荷控制静电夹

    公开(公告)号：US09082804B2

    公开(公告)日：2015-07-14

    申请号：US13021838

    申请日：2011-02-07

    申请人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

    发明人： Julian Blake ,  Dale K. Stone ,  Lyudmila Stone ,  David Suuronen ,  Shigeo Oshiro

    IPC分类号： H01L21/683

    CPC分类号： H01L21/6831

    摘要： An electrostatic clamp which more effectively removes built up charge from a substrate prior to removal is disclosed. Currently, the lift pins and the ground pins are the only mechanism used to remove charge from the substrate after implantation. The present discloses describes an electrostatic chuck in which the top dielectric surface has an embedded conductive region, such as a ring shaped conductive region in the sealing ring. Thus, regardless of the orientation of the substrate during release, at least a portion of the substrate will contain the conductive region on the dielectric layer of the workpiece support. This conductive region may be connected to ground through the use of conductive vias in the dielectric layer. In some embodiments, these conductive vias are the fluid conduits used to supply gas to the back side of the substrate.

    摘要翻译： 公开了一种在去除之前更有效地从衬底去除积聚电荷的静电夹。 目前，升降针和接地引脚是用于在植入后从衬底去除电荷的唯一机制。 本公开描述了一种静电卡盘，其中顶部电介质表面具有嵌入的导电区域，例如密封环中的环形导电区域。 因此，无论衬底在释放过程中的取向如何，衬底的至少一部分将在工件支撑体的电介质层上包含导电区域。 该导电区域可以通过使用电介质层中的导电通孔而连接到地。 在一些实施例中，这些导电通孔是用于向衬底的背侧供应气体的流体导管。

    Platen Cleaning Method
    10.
    发明申请
    Platen Cleaning Method 有权
    压板清洁方法

    公开(公告)号：US20100083980A1

    公开(公告)日：2010-04-08

    申请号：US12243980

    申请日：2008-10-02

    申请人： David Suuronen ,  Frederick B. Ammon ,  David Burgdorf ,  Lyudmila Stone

    发明人： David Suuronen ,  Frederick B. Ammon ,  David Burgdorf ,  Lyudmila Stone

    IPC分类号： B08B6/00

    CPC分类号： B08B7/0028 ,  C23C14/48 ,  C23C14/564 ,  H01J37/20 ,  H01J37/32412 ,  H01J2237/022 ,  H01J2237/31701

    摘要： A method for cleaning a workpiece support that includes using a workpiece that has been coated on its bottom surface with a suitable material is disclosed. This specially coated workpiece is placed on the support, and some time later, it is removed, taking with it particles from the support. In certain embodiments, the workpiece undergoes an ion implantation process to increase its temperature, and to increase the tackiness of the coating on the bottom surface. The material used to coat the bottom can be of variable types, including photoresists, oxides and deposited glasses.

    摘要翻译： 公开了一种用于清洁工件支撑件的方法，其包括使用已经涂覆在其底部表面上的合适材料的工件。 将这种特殊涂层的工件放置在支架上，一段时间后，将其从支架上取下来。 在某些实施例中，工件经历离子注入工艺以增加其温度，并增加涂层在底面上的粘性。 用于涂覆底部的材料可以是可变的类型，包括光致抗蚀剂，氧化物和沉积的玻璃。