摘要:
In some embodiments, built-in self-test logic is provided for an integrated circuit (IC) device having memory controller logic to generate address and command information for accessing a memory device. Driver circuits are on-chip with the memory controller logic. The driver circuits have outputs that are coupled to on-chip signal pads, respectively. The BIST logic is coupled between the driver circuits and the controller logic. The BIST logic is to transmit, at speed, address and command information that has been generated by the controller logic using the driver circuits in a normal mode of operation for the device. In addition, the BIST logic is able to transmit, at speed, test symbols using the driver circuits in a test mode of operation for the IC device, during which a chip-to-chip connection between the IC device and another device is tested. Other embodiments are also described and claimed.
摘要:
In some embodiments, built-in self-test logic is provided for an integrated circuit (IC) device having memory controller logic to generate address and command information for accessing a memory device. Driver circuits are on-chip with the memory controller logic. The driver circuits have outputs that are coupled to on-chip signal pads, respectively. The BIST logic is coupled between the driver circuits and the controller logic. The BIST logic is to transmit, at speed, address and command information that has been generated by the controller logic using the driver circuits in a normal mode of operation for the device. In addition, the BIST logic is able to transmit, at speed, test symbols using the driver circuits in a test mode of operation for the IC device, during which a chip-to-chip connection between the IC device and another device is tested. Other embodiments are also described and claimed.
摘要:
Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.
摘要:
A buffer logic within a memory module having the capability to carry out a test of another memory module to which it is coupled via a point-to-point bus through autonomously storing and transmitting a test pattern across that point-to-point bus to the other memory module, while further employing another buffer logic that is interposed between the two memory modules to pass on the test pattern, but intercept a signal received from the other memory module during the test and pass on an indication of the receipt of that signal to an analysis device to monitor the test.
摘要:
A generic address scrambler for a memory circuit test engine. An embodiment of a memory device includes a memory stack having one or more of coupled memory elements, a built-in self-test circuit including a generic programmable address scrambler for the mapping of logical addresses to physical addresses for the memory elements, and one or more registers to hold pro-gramming values for the generic programmable address scrambler.
摘要:
A generic data scrambler for a memory circuit test engine. An embodiment of a memory device includes a memory; a memory controller for the memory; a built-in self-test (BIST) circuit for the testing of the memory; and a generic data scrambler for scrambling of data according to a scrambling algorithm for the memory, where each algorithm is based on values of an address for data. The generic data scrambler includes a programmable lookup table to hold values for each possible outcome of the algorithm, the lookup table to generate a set of data factors, and a logic for combining the data with the data factors to generate scrambled data.
摘要:
A bead applicator for embedding particulates in wet paint, includes a blower directing air into an attached series of connected pipes; a particulate hopper, and a tubular particulate supply line connecting an outlet opening from the hopper to a venturi inlet opening at a low pressure point of a venturi tube. The series of connected pipes includes, in order, the venturi tube, a rigid tubular wand, and a dispensing nozzle. The wand, an inlet of the nozzle, and an outlet of the nozzle all have approximately the same, or greater, inside cross-sectional area relative to that of an outlet of the venturi tube; and the nozzle fans out to a long and narrow shaped outlet. Preferably a flexible hose is included in the series of connected pipes; the hose having approximately the same, or greater, inside cross-sectional area relative to that of the venturi tube outlet, and the nozzle outlet is bent over.
摘要:
A bead applicator for embedding particulates in wet paint, includes a blower directing air into an attached series of connected pipes; a particulate hopper, and a tubular particulate supply line connecting an outlet opening from the hopper to a venturi inlet opening at a low pressure point of a venturi tube. The series of connected pipes includes, in order, the venturi tube, a rigid tubular wand, and a dispensing nozzle. The wand, an inlet of the nozzle, and an outlet of the nozzle all have approximately the same, or greater, inside cross-sectional area relative to that of an outlet of the venturi tube; and the nozzle fans out to a long and narrow shaped outlet. Preferably a flexible hose is included in the series of connected pipes; the hose having approximately the same, or greater, inside cross-sectional area relative to that of the venturi tube outlet, and the nozzle outlet is bent over.
摘要:
An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.
摘要:
The present invention relates to a process for recovering chlorine from a feed stream containing metal chlorides using a tubular reactor wherein a hot oxygen containing gas has an initial velocity such that the resulting velocity of the bulk gas formed from mixing the oxygen containing gas with the metal chloride feed stream and a scrubs feed stream is sufficient to remove wall deposits as fast as such deposits are formed.